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Inverted pressure vessel with horizontal through loading

A pressure vessel, open type technology, applied in the field of pressure vessels, can solve the problems of pollution of the processing environment, limited production speed of pressure vessels, poor integration of pressure vessels, etc., and achieves the effect of reducing pollution and safe operation.

Inactive Publication Date: 2005-06-01
S C FLUIDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] As far as supercritical fluid processing of wafers and substrates is concerned in pressure vessels, especially in production environments, the current existing technologies do not solve the following technical problems well: processing environment pollution, especially a process with subsequent processing Continuous sources of pollution accumulated periodically; the production speed of traditional pressure vessels is limited during automatic loading and unloading, and the loading path is complicated; there is a lack of fast, simple and safe automatic mechanical locking devices for pressure vessels that support automatic operations; in addition, they can be integrated into The potential for integration of conventional pressure vessels is generally poor in terms of the possibility of a production line that uses robots to move wafers into and out of the vessel

Method used

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  • Inverted pressure vessel with horizontal through loading
  • Inverted pressure vessel with horizontal through loading
  • Inverted pressure vessel with horizontal through loading

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Embodiment Construction

[0036] The present invention can have many variations. Accordingly, the illustrations and description of the preferred embodiments are disclosed as illustrations of the invention and are not to be construed as limiting.

[0037] Preferred embodiments are for use in the semiconductor industry for photoresist stripping, particle removal, dry resist development, wafer cleaning, drying of MEMS structures, and other high pressure processes not detailed herein Application of reagents (process reagents are gaseous, liquid, or supercritical) with or without possible modifiers. These processes often require a high degree of cleaning and must be suitable for automatic loading and unloading in order to facilitate high throughput.

[0038] see figure 2 and image 3 , the first preferred embodiment uses an inverted pressure vessel mounted strictly on the upper end of the support frame 6 of the stationary assembly. Not shown are channels and ports for introducing and removing process f...

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Abstract

A pressure vessel intended to be used during clean operations and operated at elevated pressure and temperature comprising: an open support frame; an inverted pressure vessel secured to said open support frame; a vertically movable underside a cover plate; means for moving said cover plate between an upward position closed to said inverted pressure vessel and a downward position open to said pressure vessel; a mechanical locking system; a guard for separating said operating environment from said pressure vessel said means for moving said cover plate is isolated from said locking system; and means for applying heat to said pressure vessel.

Description

[0001] This application is related to and claims priority to US Application Serial No. 60 / 147,251, filed August 5, 1999, and US Application Serial No. 60 / 155,454, filed September 25, 1999. technical field [0002] The present invention relates to the use of pressure vessels operating at progressively elevated pressures and temperatures during operations requiring extreme cleanliness and, in particular, to the use in production environments to facilitate easy and clean loading of pressure vessels during automated wafer handling and Closed pressure vessel design and closure mechanism. Background technique [0003] In the semiconductor industry as well as in other industries, there is a general need for a method of operation that can load wafers or other items to be processed and allow the process fluid or substance to be processed to enter or exit after the enclosure is sealed. , and shells or pressure vessels in which pressure and temperature rise and vary within a certain ra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D55/00B01J3/00F17C13/06B01J3/06B65D51/00F16J13/02H01L21/00H01L21/677
CPCB01J3/008B01J3/06H01L21/67126H01L21/67751F17C13/02
Inventor 詹姆斯·特塞奥尼斯黑科·莫端特兹莫汉·查安德瑞罗伯特·法默尔伊杰兹·杰弗里乔纳森·托伯特
Owner S C FLUIDS