Lens perpendicularity testing methods, calibration methods, devices, and semiconductor processing equipment

Abstract

This invention provides a lens perpendicularity detection method, calibration method, apparatus, and semiconductor processing equipment. The lens perpendicularity detection method includes: after moving a target mark in a marking plate to a position corresponding to the center region of the target field of view of the lens, acquiring first position information of the target mark within the target field of view; during the process of moving the target mark in the marking plate to positions corresponding to at least three target regions in the target field of view, acquiring second position information of the target mark within the target field of view when it is located at the position corresponding to each target region; and determining whether the axis of the lens is perpendicular to the plane where the marking plate is located based on the distance between the second position information and the first position information when the target mark is located at the position corresponding to each target region within the target field of view. This invention solves the problem of detection deviation caused by manual inspection when detecting the perpendicularity of a lens.

Description

Technical Field

[0001] This invention relates to the field of visual inspection technology, and in particular to a lens perpendicularity detection method, calibration method, apparatus, and semiconductor processing equipment. Background Technology

[0002] The vision inspection module of semiconductor processing equipment relies on lens imaging to detect workpiece defects and dimensions. The lens assembly perpendicularity directly determines the optical path imaging accuracy and workpiece processing yield, and is a key parameter to ensure the precision operation of the equipment. Therefore, the lens perpendicularity needs to be tested and calibrated regularly.

[0003] The existing lens verticality detection and calibration method relies on manual operation. That is, the operator places the workpiece with the standard pattern under the lens, moves the lens manually, observes the translation of the workpiece pattern with the human eye, subjectively judges the lens tilt based on human experience, and then manually fine-tunes the lens to complete the calibration.

[0004] However, it is difficult to detect slight lens tilts by manually observing the center of the field of view, which can lead to deviations in the lens perpendicularity test results. Consequently, the lens calibrated by manual testing results cannot meet the high requirements of semiconductor processing equipment for lens mounting perpendicularity. Summary of the Invention

[0005] The purpose of this invention is to provide a lens perpendicularity detection method, calibration method, device, and semiconductor processing equipment, which solves the problem of detection deviation caused by manual detection when detecting lens perpendicularity, so as to ensure that the lens calibrated by the detection result can meet the high requirements of the semiconductor processing equipment for lens installation perpendicularity.

[0006] According to a first aspect of the present invention, a lens perpendicularity detection method is provided, applied to a semiconductor processing equipment, the semiconductor processing equipment including a vision inspection module, the vision inspection module including a lens, the method comprising: After the target mark in the marking plate is moved to a position corresponding to the center area of ​​the target field of view of the lens, the first position information of the target mark in the target field of view is obtained; the marking plate is placed on the table surface of the semiconductor processing equipment. During the process of moving the target markers in the marking board to positions corresponding to at least three target regions in the target field of view, the second position information of the target markers in the target field of view when they are located at positions corresponding to each target region is obtained; the at least three target regions are distributed in the target field of view with the center point of the central region as the center; Based on the distance between the second position information and the first position information within the target field of view when the target mark is located at the corresponding position in each target area, it is determined whether the axis of the lens is perpendicular to the plane where the mark plate is located, and the determination result is used as the detection result of the lens's perpendicularity.

[0007] Optionally, based on the distance between the second position information and the first position information within the target's field of view when the target marker is located at the position corresponding to each target area, it is determined whether the lens axis is perpendicular to the plane where the marker plate is located, and the determination result is used as the detection result of the lens's perpendicularity, including: If the distance between the second position information and the first position information within the target field of view when the target mark is located at the position corresponding to each target area is within the target threshold range, then it is determined that the axis of the lens is perpendicular to the plane where the mark plate is located. If the distance between the second position information and the first position information within the target field of view when the target mark is located at the position corresponding to each target area is not completely within the target threshold range, then it is determined that the axis of the lens is not perpendicular to the plane where the mark plate is located.

[0008] Optionally, after the target marker in the marking plate moves to a position corresponding to the center region of the target field of view of the lens, the first position information of the target marker within the target field of view is obtained, including: After the target marker is moved to a position corresponding to the central region in the target field of view, the first image of the target marker presented in the target field of view is acquired; The location of the target marker presented in the first image is identified to obtain the first pixel region corresponding to the target marker in the first image. The position of the first center point of the first pixel region is identified, and the position information of the first pixel corresponding to the identified first center point is used as the first position information.

[0009] Optionally, during the process of moving the target markers in the marking plate to positions corresponding to at least three target regions in the target field of view, the second position information of the target markers located at the positions corresponding to each target region within the target field of view is obtained, including: For each target region in the target field of view, after the target marker moves to the position corresponding to the target region, a second image of the target marker within the target field of view is acquired; For each second image, the location of the target marker presented in the second image is identified to obtain the second pixel region corresponding to the target marker in the second image; The position of the second center point of the second pixel region is identified, and the position information of the second pixel point corresponding to the identified second center point is used as the second position information.

[0010] Optionally, there are four target areas; based on the distance between the second position information and the first position information within the target's field of view when the target marker is located at the corresponding position in each target area, it is determined whether the lens axis is perpendicular to the plane where the marker plate is located, and the determination result is used as the detection result of the lens's perpendicularity, including: For the two target regions that are furthest apart from each other, the second position information of the target marker located at the position corresponding to one of the two target regions within the target field of view is calculated with the first position information to obtain the first difference information; and the second position information of the target marker located at the position corresponding to the other of the two target regions within the target field of view is calculated with the first position information to obtain the second difference information. For the two target regions that are farthest apart from each other, if the difference between the first difference information and the second difference information is not greater than a preset threshold, then the axis of the lens is determined to be perpendicular to the line connecting the two target regions. When the lens axis is determined to be perpendicular to the line connecting the two target areas that are furthest apart from each other, the lens axis is determined to be perpendicular to the plane on which the marking board is located. For the two target areas that are farthest apart, if the difference between the first difference information and the second difference information is greater than a preset threshold, it is determined that the axis of the lens is not perpendicular to the line connecting the two target areas, so as to determine that the axis of the lens is not perpendicular to the plane where the marking plate is located.

[0011] Optionally, the target region is the edge region near the inner edge of the target field of view.

[0012] Optionally, it also includes: If it is determined that the axis of the lens is not perpendicular to the plane where the marker is located, the offset direction and offset angle of the lens axis are determined based on the second position information and the first position information of the target marker in the target field of view when it is located at the position corresponding to each target area. The offset direction and offset angle are then added to the detection result of the lens perpendicularity to obtain a new detection result of the lens perpendicularity.

[0013] According to a second aspect of the present invention, a lens calibration method is provided, applied to a semiconductor processing equipment, the semiconductor processing equipment including a vision inspection module, the vision inspection module including multiple lenses, the method comprising: Based on the detection results of the lens perpendicularity obtained as in the first aspect or its various implementations, the position of the lens axis is adjusted until the lens axis is perpendicular to the plane where the marking plate is located, so as to complete the lens calibration.

[0014] According to a third aspect of the present invention, a lens perpendicularity detection device is provided, applied to a semiconductor processing equipment. The semiconductor processing equipment includes a vision inspection module, the vision inspection module includes a lens, and the device includes: The first position information acquisition module is used to acquire the first position information of the target mark in the target field of view after the target mark in the marking plate moves to a position corresponding to the center area in the target field of view of the lens; the marking plate is placed on the table surface of the worktable of the semiconductor processing equipment; The second position information acquisition module is used to acquire the second position information of the target mark in the target field of view when it is located at the position corresponding to each target area during the process of moving the target mark in the marking board to the position corresponding to at least three target areas in the target field of view; the at least three target areas are distributed in the target field of view with the center point of the central area as the center; The judgment module is used to determine whether the axis of the lens is perpendicular to the plane where the marker plate is located, based on the distance between the second position information and the first position information within the target field of view when the target marker is located at the position corresponding to each target area, and to use the judgment result as the detection result of the lens's perpendicularity.

[0015] According to a fourth aspect of the present invention, a lens calibration device is provided, applied to a semiconductor processing equipment, the semiconductor processing equipment including a vision inspection module, the vision inspection module including a plurality of lenses, and the device comprising: The adjustment module is used to adjust the position of the lens axis according to the detection result of the lens perpendicularity obtained in the first aspect or its various implementations, until the lens axis is perpendicular to the plane where the marking plate is located, so as to complete the lens calibration.

[0016] According to a fifth aspect of the invention, a semiconductor processing apparatus is provided, including a memory and a processor, the memory for storing processor-executable instructions; the processor is configured to execute the executable instructions in the memory to implement the steps of the method as described in the first aspect or its various implementations.

[0017] According to a sixth aspect of the present invention, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps of the method as described in the first aspect or its various implementations.

[0018] Compared with the prior art, the beneficial effects of the present invention are: This application provides a lens perpendicularity detection method. First, when the target mark is located at the corresponding position in the center region of the target field of view of the lens, the first position information of the target mark in the target field of view is used as a reference. Then, while moving the target mark in the marking plate to positions corresponding to at least three target regions in the target field of view, the second position information of the target mark in the target field of view when it is located in each target region is obtained. Finally, based on the distance between the second position information and the first position information of the target mark in the target field of view when it is located in each target region, the perpendicularity of the lens axis relative to the plane of the worktable is objectively and accurately detected, thereby obtaining an accurate lens perpendicularity detection result. This solves the problem of detection deviation caused by manual detection when detecting lens perpendicularity, and ultimately enables the lens calibrated by this detection result to meet the high requirements of semiconductor processing equipment for lens installation perpendicularity. Attached Figure Description

[0019] Figure 1 An application scenario diagram provided for one embodiment of this application; Figure 2 A flowchart of a lens perpendicularity detection method provided in one embodiment of this application; Figure 3 A flowchart illustrating a lens calibration method provided in one embodiment of this application; Figure 4 A schematic diagram of a lens perpendicularity detection device provided in one embodiment of this application; Figure 5 A schematic diagram of a lens calibration device provided in one embodiment of this application; Figure 6 This is a schematic block diagram of a semiconductor processing apparatus provided in one embodiment of this application. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0021] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or server that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0022] Semiconductor processing equipment is equipped with a vision inspection module, which is equipped with a lens. The perpendicularity of the lens directly determines the imaging accuracy and inspection yield of the workpiece, and is a core assembly indicator for semiconductor precision vision processing, appearance inspection, and dimensional verification.

[0023] The existing traditional method for detecting lens verticality is manual inspection: the operator places the workpiece with straight lines and circular patterns under the lens, moves the lens up and down manually, and observes the translation of the workpiece pattern in the horizontal and vertical directions with the naked eye. Based on personal subjective experience, the operator judges whether the lens is tilted, the degree of tilt, and the direction of correction, and then manually completes the lens leveling and calibration.

[0024] Traditional testing and calibration methods rely entirely on manual visual observation and technicians' professional experience. They lack standardized and quantitative data judgment criteria, and the overall testing process has no image recording, no data retention, and inconsistent verification standards. They are only suitable for low-precision equipment verification and cannot meet the assembly and maintenance needs of ultra-high precision semiconductor processing equipment.

[0025] To at least address one of the technical problems existing in the prior art or related technologies, the present invention provides a lens perpendicularity detection method, calibration method, apparatus, and semiconductor processing equipment. The lens perpendicularity detection method includes: after a target mark in a marking plate is moved to a position corresponding to the central region of the target field of view of the lens, acquiring first position information of the target mark within the target field of view; placing the marking plate on the worktable of the semiconductor processing equipment; during the process of moving the target mark in the marking plate to positions corresponding to at least three target regions in the target field of view, acquiring second position information of the target mark within the target field of view when it is located at the position corresponding to each target region; the at least three target regions are distributed in the target field of view with the center point of the central region as the center; based on the distance value between the second position information and the first position information of the target mark within the target field of view when it is located at the position corresponding to each target region, determining whether the axis of the lens is perpendicular to the plane where the marking plate is located, and using the determination result as the detection result of the lens perpendicularity. This application can reduce the degree of human intervention and solve the problem of detection deviation caused by manual inspection when detecting the perpendicularity of the lens, so that the lens calibrated by the test results obtained by this application can meet the high requirements of semiconductor processing equipment for lens mounting perpendicularity.

[0026] It should be understood that the technical solution of this application can be applied to the following scenarios, but is not limited to: In some possible ways, Figure 1 An application scenario diagram provided for an embodiment of this application, such as... Figure 1 As shown, this application scenario may include semiconductor processing equipment 110 and network device 120. Semiconductor processing equipment 110 can establish a connection with network device 120 via a wired network or a wireless network.

[0027] For example, the semiconductor processing equipment 110 can be a dicing machine, a cutting and sorting machine, a grinding machine, etc., but is not limited to these. The network device 120 can be a desktop computer, a laptop computer, a tablet computer, etc., but is not limited to these. In one embodiment of this application, the network device 120 can send a request message to the semiconductor processing equipment 110, which can be used to request the acquisition of the first position information of the target marker within the target field of view. Further, the network device 120 can receive a response message sent by the semiconductor processing equipment 110, which includes the acquisition of the first position information of the target marker within the target field of view.

[0028] also, Figure 1 An exemplary semiconductor processing apparatus and a network device are provided, but in practice, other numbers of semiconductor processing apparatus and network devices may be included, and this application does not limit this.

[0029] In other possible implementations, the technical solution of this application may also be executed by the aforementioned semiconductor processing equipment 110, or by the aforementioned network equipment 120, and this application does not impose any restrictions on this.

[0030] After introducing the application scenarios of the embodiments of this application, the technical solution of this application will be described in detail below: Figure 2 A flowchart illustrating a lens perpendicularity detection method provided in this application embodiment. This method is applied to semiconductor processing equipment, which includes a vision inspection module. The vision inspection module includes a lens. The method can be performed by, for example... Figure 1 The semiconductor processing equipment 110 shown performs the operation, but is not limited to it. For example... Figure 2 As shown, the method may include the following steps: S210. After the target mark in the marking plate is moved to a position corresponding to the center area of ​​the target field of view of the lens, the first position information of the target mark in the target field of view is obtained.

[0031] The marking plate is placed on the worktable of the semiconductor processing equipment. Here, the marking plate can be fixed horizontally on the worktable of the semiconductor equipment to ensure that the plane of the marking plate is completely in contact with the reference plane of the worktable, so that the plane where the marking plate is located is the reference plane for the perpendicularity detection of the lens.

[0032] Here, the marking plate can be moved manually or electronically to move the target markings on the marking plate, such as crosshairs, circular reference points, square positioning blocks, and T-shaped markings, to the center of the lens's target field of view. The visual inspection module can automatically photograph and analyze the target markings, recording the coordinates and pixel positions of the target markings in the lens's field of view coordinate system under this reference state. The coordinates and pixel positions of the target markings in the lens's field of view coordinate system can be used as the primary position information.

[0033] For example, the target field of view of the lens is an 800×800 pixel square area, and the coordinates of the center area of ​​the target field of view are (400, 400). A solid black dot is selected as the target marker on the marker board. The marker board is translated so that the dot is moved to the position directly below the center area. From above the lens, the dot can be observed to fall completely at the center area coordinates (400, 400) of the target field of view. Then, the vision module is used to collect and record the coordinate information of the dot in the field of view coordinate system of the lens, as well as the pixel position and other data, so as to obtain the first position information of the dot in the target field of view.

[0034] In this step, by moving the target mark in the marking plate to a position corresponding to the center area of ​​the target field of view of the lens, the first position information of the target mark in the target field of view is obtained. This establishes a unified and standardized center reference coordinate for lens perpendicularity detection, providing a reference basis for deviation calculation in the subsequent step S230. At the same time, the mechanical positioning of moving the target mark in the marking plate to the target field of view of the lens, together with the acquisition of the first position information of the target mark in the target field of view by the visual recognition module, can replace the method of estimating the center position of the lens by the naked eye, thereby greatly improving the reference positioning accuracy of the center position of the lens.

[0035] S220. During the process of moving the target markers in the marking plate to positions corresponding to at least three target regions in the target field of view, the second position information of the target markers in the target field of view when they are located at positions corresponding to each target region is obtained.

[0036] Among them, at least three target areas are distributed in the target field of view with the center point of the central area as the center; for example, with the center point of the central area of ​​the target field of view as the center, the four corner areas of the upper left, upper right, lower left and lower right within the target field of view can be used as target areas.

[0037] Here, the process of moving the target markers in the marker board to positions corresponding to at least three target regions in the target field of view can be understood as follows: the marker board is horizontally translated sequentially, allowing the same target marker to move one by one to the position corresponding to each target region, that is, moving the target marker to a position directly below the target region so that the target marker can be observed in the target region from the lens. When the target marker moves to each target region, the visual detection module can simultaneously collect the field of view position data of the corresponding target marker in the target field of view and use this field of view position data as the second position information. The field of view position data may include the coordinate information of the target marker located at the corresponding position in the target region in the field of view coordinate system, as well as pixel position data.

[0038] Continuing with the example of a target field of view of 800×800 pixels in step S210, four target regions are set with the center of the target field of view (400,400) as the center: upper left (200,600), upper right (600,600), lower left (200,200), and lower right (600,200). The dot markers are moved to the corresponding positions of the four target regions in sequence, and four sets of field of view position data are collected respectively, which are the four sets of second position information.

[0039] In this step, by distributing at least three target regions around the center point of the central region within the target field of view, and moving the target markers in the marker plate to positions corresponding to the at least three target regions within the target field of view, it is possible to collect second position information corresponding to the target markers located at positions corresponding to multiple target regions. This avoids the bias of detection results obtained based on data collected at a single position. At the same time, by controlling the movement of the same target marker to positions corresponding to different target regions, the data consistency of the final second position information obtained can be guaranteed within the target field of view, avoiding data interference caused by differences in size and shape due to the use of different markers.

[0040] S230. Based on the distance between the second position information and the first position information within the target field of view when the target mark is located at the position corresponding to each target area, determine whether the axis of the lens is perpendicular to the plane where the mark plate is located, and use the determination result as the detection result of the perpendicularity of the lens.

[0041] Here, based on the distance between the second position information and the first position information in the target field of view when the target marker is located at the position corresponding to each target area, it can be understood as: calculating the difference between each second position information obtained in step S220 and the first position information obtained in step S210 to obtain the position offset difference between each second position information and the first position information.

[0042] If the lens axis is perfectly perpendicular to the plane of the marker plate, the lens is not tilted, and when the marker plate moves horizontally, the target marker only undergoes a theoretical position change. The distance values ​​between each second position information and the first position information are all within the target range, indicating that the position deviation difference within the lens's target field of view meets the standard threshold, meaning the lens axis has almost no offset. If the lens is tilted left-right or forward-backward, the lens's optical path will be skewed. When controlling the target marker to move to each target area, there will be a regular situation where the position offset difference within the target field of view does not meet the standard threshold. In this case, the offset amount and direction of the position coordinates within the target field of view can directly correspond to the tilt angle and tilt direction of the lens axis. Therefore, based on the above principle, by using the distance value between the second position information and the first position information within the target field of view when the target marker is located at the corresponding position in each target area, it is possible to determine whether the lens axis is perpendicular to the plane of the marker plate, thereby determining the detection results of whether the lens's perpendicularity is qualified, the tilt direction, and the degree of tilt.

[0043] For example, when the lens is in a standard vertical position: by controlling the target marker to move to the positions corresponding to the four corner areas as target regions, the second position information of the target marker at the corresponding position in the target region within the target field of view can be obtained, and the offset difference relative to the center (first position information) reference is within the allowable error range; when the lens axis is tilted to the left: when the target marker moves to the positions corresponding to the two target regions on the left, the second position information of the target marker at the corresponding positions in the two target regions within the target field of view can be obtained, and the position offset difference relative to the center (first position information) reference is too large; when the target marker moves to the positions corresponding to the two target regions on the right, the second position information of the target marker at the corresponding positions in the two target regions within the target field of view can be obtained, and the position offset difference relative to the center (first position information) reference is too small, and the angle of the lens axis tilting to the left can be accurately calculated through the position offset difference data to determine that the lens verticality is unqualified.

[0044] In this step, by using the distance between the second position information and the first position information within the target's field of view when the target mark is located at the corresponding position in each target area, it is possible to accurately determine whether the lens axis is perpendicular to the plane where the marking plate is located. This can replace the subjective judgment of the lens's perpendicularity by the naked eye, thereby realizing the datafication and quantification of the lens's perpendicularity detection results.

[0045] This embodiment addresses the drawbacks of traditional methods that rely on manual observation and empirical adjustments to determine lens perpendicularity. It utilizes the built-in vision inspection module of the semiconductor processing equipment, along with a marker plate bearing target markers. First, it acquires the first position information within the target field of view when the target marker is located in the center region of the lens's target field of view, serving as a baseline. Then, as the target marker on the marker plate is moved to positions corresponding to at least three target regions within the target field of view, the second position information within the target field of view is acquired when the target marker is located in each target region. Finally, based on the distance between the second and first position information of the target marker within the target field of view when it is located in each target region, the perpendicularity of the lens axis to the plane of the worktable is objectively and accurately detected using optical imaging and geometric perpendicularity principles.

[0046] By adopting the above method, the traditional method of detecting lens perpendicularity, which requires visual observation, experience judgment, and manual blind adjustment, can be abandoned. By relying on visual image acquisition and data processing to complete the detection of lens perpendicularity, accurate lens perpendicularity detection results can be obtained. This reduces the degree of human involvement and solves the problem of detection deviation caused by manual detection when detecting lens perpendicularity. Therefore, the lens calibrated by the detection results obtained in this embodiment can meet the high requirements of semiconductor processing equipment for lens installation perpendicularity.

[0047] In some possible implementations, based on the distance between the second position information and the first position information within the target field of view when the target marker is located at the position corresponding to each target area, it is determined whether the axis of the lens is perpendicular to the plane where the marker plate is located, and the determination result is used as the detection result of the lens's perpendicularity. This may include the following steps: S310. If the distance between the second position information and the first position information in the target field of view when the target mark is located at the position corresponding to each target area is within the target threshold range, then the axis of the lens is determined to be perpendicular to the plane where the mark plate is located.

[0048] Since the marking plate is placed against the workbench surface, the plane on which the marking plate is located is a horizontal reference plane. Here, when the lens axis is completely perpendicular to the reference plane, the lens's optical path is perpendicular to the reference plane without any deviation, and the lens's visual imaging follows standard geometric imaging laws. At this time, under the premise of horizontally translating the marking plate and only changing the orientation of the target mark in the target field of view of the lens, the imaging offset of each dispersed target area in the target field of view relative to the central area which serves as the central reference should be within the target threshold range. That is, when the target mark is located at the position corresponding to each target area, the distance between the second position information and the first position information in the target field of view is within the target threshold range, with no additional offset error exceeding the target threshold range. Therefore, the verticality of the lens can be determined to be qualified.

[0049] For example, the target field of view of the lens is set to an 800×800 pixel area, and the center reference coordinates (first position information) of the target field of view are (400, 400). Four target regions (upper, lower, left, and right) are uniformly set within the target field of view, with a fixed theoretical standard offset difference: when the target marker moves to the position corresponding to the upper target region, the obtained second coordinate information is (0, +200); when the target marker moves to the position corresponding to the lower target region, the obtained second coordinate information is (0, -200); when the target marker moves to the left target region, the obtained second coordinate information is (-200, 0); when the target marker moves to the position corresponding to the right region, the obtained second coordinate information is (+200, 0). Therefore, it can be seen that when the target marker is located in the positions corresponding to the upper, lower, left, and right target regions, the distance between the second position information and the first position information within the target field of view is 200, all within the target threshold range (target threshold range is 199.5 to 200.5). Thus, it is determined that the lens axis is perpendicular to the plane where the marker plate is located, and the lens perpendicularity meets the standard.

[0050] S320. If the distance between the second position information and the first position information in the target field of view when the target mark is located at the position corresponding to each target area is not completely within the target threshold range, then it is determined that the axis of the lens is not perpendicular to the plane where the mark plate is located.

[0051] If the lens is tilted forward, backward, left, or right, the optical path will be distorted and offset on the plane of the marker, breaking the standard perpendicular imaging rules. Since different target areas within the lens's field of view are distributed in a circular pattern, and lens tilt affects imaging from different angles to varying degrees, the offset of the second position information of the target marker within the target's field of view relative to the reference first position information will become disordered when the target marker is located in different target areas. Furthermore, the distance value of the second coordinate information of the target marker within the target's field of view when it is located in some target areas will be too large, too small, or have an abnormal offset direction from the reference first position information, making it impossible to maintain consistency among all calculated distance values. As long as there is inconsistency in distance values, it can be accurately determined that the lens is tilted and its perpendicularity is not up to standard.

[0052] Continuing with the target field of view parameters in step S310 above, the lens tilts slightly to the left, and the overall optical path of the lens shifts to the left. The theoretical second position information for the left target area, originally (-200, 0), becomes (-182, 0) when the target marker moves to the corresponding position. The theoretical second position information for the right target area, originally (+200, 0), becomes (+216, 0). Slight coordinate shifts also occur in the upper and lower target areas. Therefore, the distance values ​​corresponding to each target area cannot remain uniform and are not entirely within the target threshold range, i.e., they do not perfectly match the theoretical standard deviation. This indicates that the lens axis is not perpendicular to the marker plane, and the lens's perpendicularity is abnormal, requiring calibration and adjustment.

[0053] Using the above method, based on the principle of optical geometric imaging, the traditional subjective judgment method that relies on human eyes and professional experience is transformed into one that only needs to determine whether the distance between the second position information and the first position information in the target field of view when the target mark is located at the corresponding position in each target area is within the target threshold range. This can accurately distinguish between the two states of lens verticality and lens tilt, and the obtained detection results are adapted to the high-precision and high-stability detection and calibration requirements of semiconductor processing equipment.

[0054] In some possible implementations, after the target marker in the marking plate is moved to a position corresponding to the central region of the target field of view of the lens, obtaining the first position information of the target marker within the target field of view may include the following steps: S410. After the target marker moves to a position corresponding to the center region in the target field of view, acquire the first image of the target marker presented in the target field of view.

[0055] Here, after the marker board is placed horizontally and the target marker is moved to the position corresponding to the center of the target field of view of the lens, the visual inspection module triggers the imaging function to capture the original image containing the complete target marker and the background of the field of view, which is the first image. Here, this step is the source of baseline data acquisition. It can abandon the traditional method of manually observing and judging the centering of the marker. The visual inspection module images and preserves objective, storable, and analyzable original image data, providing the original data basis for subsequent accurate positioning.

[0056] S420. The position of the target mark presented in the first image is identified to obtain the first pixel region corresponding to the target mark in the first image.

[0057] Here, the visual inspection module incorporates an image recognition algorithm that processes the acquired first image. Through techniques such as grayscale recognition, contour extraction, and threshold filtering, it removes background interference from the workbench, including impurities, lighting, and dust, accurately identifying the contour boundaries of the target marker within the first image. It then selects the entire pixel range occupied by the target marker in the first image; this pixel range is the first pixel region. This step achieves precise purification from the "original image" to "target region filtering," filtering out environmental interference that hinders target marker recognition.

[0058] S430. The position of the first center point of the first pixel region is identified, so that the position information of the first pixel point corresponding to the identified first center point is used as the first position information.

[0059] Here, after accurately locating the first pixel region of the target marker, the first center point of this pixel region is calculated using an algorithm that solves for the first pixel region. The image pixel coordinates corresponding to the first center point of the first pixel region are defined as the first position information. Unlike the traditional method of manually estimating the marker center, this step can accurately solve for the first center point of the target marker using a geometric algorithm for the first pixel region. This first center point serves as the unique reference origin for the entire verticality detection scheme, providing high-precision reference data for subsequent distance calculations and verticality determination.

[0060] The above method differs from the traditional manual visual inspection and subjective positioning methods. By utilizing the image acquisition and algorithm processing capabilities of the visual inspection module, it can automatically complete the imaging, interference filtering, and center positioning of the target marker, accurately and quickly determining the first position information as the reference, thus solving the problem of large deviations in the traditional manual estimation of the reference position.

[0061] In some possible implementations, during the process of moving the target markers in the marker plate to positions corresponding to at least three target regions in the target field of view, obtaining the second position information of the target markers located at the positions corresponding to each target region within the target field of view may include the following steps: S510. For each target region in the target field of view, after the target marker moves to the position corresponding to the target region, acquire a second image of the target marker within the target field of view.

[0062] After acquiring the first position information of the target field of view center reference, using the center point of the central region of the target field of view as the center point, the same target mark on the marker board is sequentially translated to the corresponding positions of at least three target regions evenly distributed within the target field of view. For each target region, after the target mark is moved to the position corresponding to the target region, the visual detection module independently captures an image, generating an image containing the target mark and the background of the target field of view, denoted as the second image. The second image is the original imaging data of the target mark located at each off-center point, which is the basic material for multi-point offset data acquisition. Corresponding to the first image acquired from the center reference mentioned above, it forms a complete sampling image group of "center reference image + multi-directional off-center image", replacing the traditional method of observing off-center offset with the naked eye.

[0063] Taking the above scenario with a target field of view of 800×800 pixels and a target marker of circular shape as an example, the target area consists of four target areas: upper left, upper right, lower left, and lower right. The worktable is driven to translate the marker plate. First, the circular target marker is moved to the upper left target area. After the worktable stops and the imaging stabilizes, the vision detection module automatically captures and generates the image corresponding to the current target field of view, which is the second image corresponding to the upper left target area. Then, the marker is moved to the remaining three target areas in sequence, and four independent and corresponding second images are captured respectively.

[0064] S520. For each second image, perform position recognition on the target marker presented in the second image to obtain the second pixel region corresponding to the target marker in the second image.

[0065] For each acquired second image, the visual inspection module invokes its built-in image recognition algorithm. Through image processing techniques such as image thresholding, grayscale comparison, contour extraction, and noise filtering, it filters out interference factors such as dust on the semiconductor workbench, light fluctuations, board textures, and ambient stray light. This accurately identifies the closed contour of the target mark within each second image, locking down the entire pixel range occupied by the target mark in the second image; this pixel region is the second pixel region. This step is completely consistent with the logic of the first pixel region identification described earlier, achieving standardized purification of the target region across all locations.

[0066] S530. The position of the second center point of the second pixel region is identified, so that the position information of the second pixel point corresponding to the identified second center point is used as the second position information.

[0067] For each target region corresponding to a second pixel region, the same geometric algorithm used to solve for the center of the first pixel region is employed to calculate the second center point of each second pixel region. The pixel coordinates of this second center point are defined as the second position information of the corresponding point. This step uses a standardized algorithm to solve for the marker center of each eccentric point, forming a unified data dimension with the first position information of the center reference. This provides accurate and equivalent data support for subsequent multi-point pixel difference calculations and verticality consistency determination.

[0068] By employing the above method and using image acquisition and algorithm recognition logic that is completely consistent with the first location information, the obtained second location information can be highly consistent with the detection of the first location information. That is, all detection point data (first center point and second center point) are of the same standard, avoiding the problem of differences in sampling standards at multiple points, and ensuring that the comparison results of the distance difference between each second location information and the first location information are true and effective.

[0069] In some possible implementations, there are four target regions; based on the distance between the second position information and the first position information within the target field of view when the target marker is located at the position corresponding to each target region, it is determined whether the axis of the lens is perpendicular to the plane where the marker plate is located, and the determination result is used as the detection result of the lens's perpendicularity, which may include the following steps: S610. For the two target regions that are farthest apart from each other, calculate the difference between the second position information of the target marker located at the position corresponding to one of the two target regions and the first position information to obtain the first difference information; and calculate the difference between the second position information of the target marker located at the position corresponding to the other target region and the first position information to obtain the second difference information.

[0070] Here, four target regions are set up, which can be the target regions located above, below, left, and right of the center point of the target field of view. Among them, the target regions located on opposite sides of the center point of the target field of view have the longest straight-line distance between them, forming two pairs of opposite combinations: left-right and top-bottom. Using the first position information corresponding to the center region of the target field of view as the sole reference, the second position information corresponding to the two target regions in the same pair is taken, and the distance difference is calculated between them and the reference position to obtain the distance difference between the two opposite points, namely the first difference information and the second difference information.

[0071] Taking a scene with a target field of view of 800×800 pixels and a first position information (center coordinates) of (400,400) as an example, the second position information corresponding to the four target regions is as follows: left (-200,0), right (200,0), top (0,200), bottom (0,-200). Select the farthest target regions in the first group: left and right. Calculate the difference between the second position information of the target marker in the target field of view when it is located at the position corresponding to the left target region and the reference first position information, obtaining the first difference ΔX=200; calculate the difference between the second position information of the target marker in the target field of view when it is located at the position corresponding to the right target region and the reference first position information, obtaining the first difference ΔX=200. Similarly, the difference calculation can be performed for the top and bottom opposite groups.

[0072] Here, the two target regions with the largest distance between them in the target field of view are selected as the calculation regions, and the difference is calculated. Compared with sampling of nearby points, it is easier to capture the subtle tilt defects of the lens.

[0073] S620. For the two target areas that are farthest apart from each other, if the difference between the first difference information and the second difference information is not greater than a preset threshold, then determine that the axis of the lens is perpendicular to the line connecting the two target areas.

[0074] Here, the preset threshold is the minimum allowable error value calibrated by the visual inspection module, representing the normal tolerance range for the assembly and imaging of the visual inspection module. When the offset difference between two points in a set of target areas relative to the center reference of the target field of view is symmetrical and the deviation is minimal, and the deviation between the two sets of differences is not greater than the preset threshold, it proves that the optical path of the lens is not skewed in the dimension of the line connecting the opposite sides, and the lens axis is perpendicular to the line connecting the current target area, thus completing the single-dimensional perpendicularity verification. Conversely, the optical path in the current dimension is tilted, and the perpendicularity is abnormal.

[0075] Using the example from step S610, it can be determined that the lens axis is perpendicular to the line connecting the left and right target areas, and the lens's verticality in this dimension is acceptable. If the lens is slightly tilted to the left, and the difference between the first difference information and the second difference information is 24 pixels, which is greater than the preset threshold, then the lens's verticality in this dimension is not up to standard.

[0076] S630. When the axis of the lens is determined to be perpendicular to the line connecting the two target areas that are furthest apart from each other, the axis of the lens is determined to be perpendicular to the plane on which the marking plate is located.

[0077] Since the plane is composed of two sets of intersecting straight lines, this embodiment has two sets of orthogonal diagonal lines (left-right, top-bottom), covering the complete two-dimensional plane corresponding to the target's field of view. When the lens axis is simultaneously perpendicular to both sets of intersecting diagonal lines, according to the principles of spatial geometry, it can be determined that the lens axis is perpendicular to the horizontal plane of the marker plate where the diagonal lines are located, thus confirming that the lens perpendicularity is qualified and completing the perpendicularity verification of the complete two-dimensional plane.

[0078] For example, if the deviation of the first set of opposite sides (left-right) is 1 pixel and the deviation of the second set of opposite sides (top-bottom) is 0 pixels, both less than the preset threshold of 2 pixels, then the perpendicularity of both sets of dimensions is qualified. According to the spatial geometry judgment rules, if there is no tilt in both diagonal dimensions, it can be determined that the axis of the lens is perpendicular to the plane of the marking plate worktable, and the perpendicularity test of the lens is qualified.

[0079] In this step, the spatial geometry principle of bidirectional diagonal cross-check can be relied upon to upgrade from single-dimensional judgment to two-dimensional planar global judgment, solving the problem of the one-sidedness of traditional single-point and one-way detection, avoiding local tilting and missing judgment, and greatly improving the accuracy of lens verticality qualification judgment.

[0080] S640. For the two target areas that are farthest apart from each other, if the difference between the first difference information and the second difference information is greater than a preset threshold, then it is determined that the axis of the lens is not perpendicular to the line connecting the two target areas, so as to determine that the axis of the lens is not perpendicular to the plane where the marking plate is located.

[0081] Here, if the difference between the first and second difference information in any set of target areas exceeds the preset fault tolerance threshold, it means that the optical path imaging in that diagonal dimension has been distorted, and the lens axis is tilted in the corresponding dimension. As long as the perpendicularity in a single dimension is unqualified, according to the principle of spatial perpendicularity, it can be directly determined that the lens as a whole is not perpendicular to the plane of the marking plate, that is, the perpendicularity detection of the lens is deemed unqualified.

[0082] For example, if the detected difference deviation between the right and left sides is 25 pixels, which is greater than the preset threshold of 2 pixels, the verticality of the lens in this dimension is abnormal. It can be directly determined that the lens is tilted and the axis of the lens is not perpendicular to the worktable plane where the marking board is located. The verticality of the lens is unqualified.

[0083] Using the above method, based on four distributed target areas, and utilizing the spatial geometry principle of bidirectional cross-verification of the farthest opposite points between two groups, the verticality of the two orthogonal dimensions is verified by calculating the offset difference of the opposite points and combining it with a preset fault tolerance threshold. Only when both bidirectional dimensions are qualified is the lens determined to be vertical; any abnormality in any dimension is considered tilted. A high-precision detection logic of "multi-point sampling - diagonal difference calculation - single-dimensional verification - two-dimensional global judgment" is fully constructed, forming a complete and high-precision automated verticality detection solution. This solution specifically addresses the problems of traditional manual detection, which relies on experience, has large errors, cannot identify minute spatial tilts, and has a high false negative rate.

[0084] In some possible implementations, the target region is an edge region near the inner edge of the target field of view.

[0085] Here, when the target marker is moved to the position corresponding to the target area, the target marker is always within the target's field of view.

[0086] Because the slight tilt of the lens has a minimal impact on the imaging shift in the central region of the target field of view, but a significantly amplified impact on the imaging shift in the edge regions, the pixel shift caused by the tilt is much greater than that in the central region. Therefore, in this embodiment, all target areas for detection are set in the inner edge region of the target field of view. Sampling points are placed on the inner sides of the four sides of the target field of view, close to the field of view boundary, using the center point of the target field of view as a reference. With the marker plate horizontally shifted, changing only the position of the marker field of view, even slight vertical deviations of the lens will produce significant and quantifiable pixel shifts at the edge sampling points, thus making the detection results obtained based on the second position information corresponding to the target area more accurate.

[0087] In some possible implementations, the method may further include: if it is determined that the axis of the lens is not perpendicular to the plane where the marker plate is located, then based on the second position information of the target marker in the target field of view when it is located at the position corresponding to each target area, and the first position information, the offset direction and offset angle of the lens axis are determined, and the offset direction and offset angle are added to the detection result of the lens perpendicularity to obtain a new detection result of the lens perpendicularity.

[0088] Given that the lens axis is not perpendicular to the plane of the marking plate, it is necessary to retrieve the second position information and the first position information of the target mark in the target field of view when it is located at the corresponding position of each target area. Then, based on the optical perspective imaging geometry, the unique optical path deflection direction and deflection angle corresponding to the pixel offset difference in different directions are determined. Then, by performing a simultaneous calculation on the pixel offset of multiple points, the spatial optical path offset parameters of the lens are fitted to accurately solve the offset direction (left tilt, right tilt, forward tilt, backward tilt) and specific offset angle of the lens axis relative to the vertical normal. This quantified data is then incorporated into the detection results to form complete perpendicularity detection data with quantified defect parameters.

[0089] Continuing with unified equipment parameters: 800×800 pixel field of view, central reference first position information (400, 400), four edge target areas within the field of view: upper edge (400, 700), lower edge (400, 100), left edge (100, 400), right edge (700, 400), with a preset fault tolerance threshold of ±2 pixels. The visual inspection module detects that the actual second position corresponding to the target mark being located at the left edge is (118, 400), and the actual second position corresponding to the target mark being located at the right edge is (682, 400), with the pixel offset difference between the upper and lower edges within the threshold range. Through pixel difference calculation, a regular horizontal offset is identified, determining that the lens is tilted to the left; combined with the optical imaging ratio to convert the pixel offset, the lens axis offset angle is calculated to be 0.32°, which is a slight tilt. The "Offset direction: left tilt, offset angle: 0.32°" can be written into the detection result to generate a new quantitative verticality detection report.

[0090] Using the above method, after determining that the lens verticality is unqualified, the offset direction and offset angle of the lens axis can be accurately calculated based on the pixel difference data of multi-point edge sampling, so as to achieve full-dimensional detection of "whether it is tilted, in which direction it is tilted, and by how many degrees", which solves the problem that traditional solutions can only detect qualitatively and cannot detect quantitatively.

[0091] Figure 3 A flowchart illustrating a lens calibration method provided in this application embodiment. This method is applied to a semiconductor processing equipment, which includes a vision inspection module comprising multiple lenses. The method can be performed by, for example... Figure 1 The semiconductor processing equipment 110 shown performs the operation, but is not limited to it. For example... Figure 3 As shown, the method may include the following steps: S710. Based on the lens perpendicularity test results obtained as described above, adjust the lens axis position until the lens axis is perpendicular to the plane where the marking plate is located, in order to complete the lens calibration.

[0092] The calibration method provided in this embodiment is adapted to the vision inspection module of semiconductor processing equipment with multiple lenses. Based on the quantitative detection results output by all the perpendicularity detection schemes mentioned above (including whether the lens is tilted, the direction of offset, and the angle of offset), it performs targeted fine-tuning of the lens axis position. During the calibration process, the equipment continuously and synchronously executes the aforementioned perpendicularity detection process, updates the perpendicularity detection results in real time, iteratively corrects the lens axis position, and performs cyclic fine-tuning and verification until it is determined that the lens axis is completely perpendicular to the reference plane of the worktable where the marking plate is located. Finally, the lens standardization calibration is completed to ensure that the adjusted lens perpendicularity can meet the requirements of semiconductor ultra-precision processing and vision inspection accuracy.

[0093] Figure 4 This is a schematic diagram of a lens perpendicularity detection device according to an embodiment of the present invention, as shown below. Figure 4 As shown, this device is used in semiconductor processing equipment, which includes a vision inspection module, and the vision inspection module includes a lens. The device includes: The first position information acquisition module 810 is used to acquire the first position information of the target mark in the target field of view after the target mark in the marking plate moves to a position corresponding to the center area in the target field of view of the lens; the marking plate is placed on the table surface of the worktable of the semiconductor processing equipment; The second position information acquisition module 820 is used to acquire the second position information of the target mark in the target field of view when it is located at the position corresponding to each target area during the process of moving the target mark in the marking plate to the position corresponding to at least three target areas in the target field of view; the at least three target areas are distributed in the target field of view with the center point of the central area as the center; The judgment module 830 is used to determine whether the axis of the lens is perpendicular to the plane where the marker plate is located, based on the distance value between the second position information and the first position information in the target field of view when the target marker is located at the position corresponding to each target area, and to use the judgment result as the detection result of the perpendicularity of the lens.

[0094] In some possible implementations, the determination module includes: The first determining unit is configured to determine that the axis of the lens is perpendicular to the plane where the marking plate is located if the distance between the second position information and the first position information in the target field of view when the target mark is located at the position corresponding to each target area is within the target threshold range. The second determining unit is used to determine that the axis of the lens is not perpendicular to the plane where the marking plate is located if the distance value between the second position information and the first position information in the target field of view when the target mark is located at the position corresponding to each target area is not completely within the target threshold range.

[0095] In some possible implementations, the first location information acquisition module includes: The first image acquisition unit is used to acquire a first image of the target mark presented in the target field of view after the target mark moves to a position corresponding to the central region in the target field of view; The first pixel region acquisition unit is used to perform position recognition on the target mark presented in the first image to obtain the first pixel region corresponding to the target mark in the first image. The first position information determination unit is used to identify the position of the first center point of the first pixel region, so as to use the position information of the first pixel point corresponding to the identified first center point as the first position information.

[0096] In some possible implementations, the second location information acquisition module includes: The second image acquisition unit is used to acquire a second image of the target marker within the target field of view after the target marker moves to the position corresponding to the target area for each target area in the target field of view; The second pixel region acquisition unit is used to perform position recognition on the target marker presented in the second image for each second image, and obtain the second pixel region corresponding to the target marker in the second image; The second position information determination unit is used to identify the position of the second center point of the second pixel region, so as to use the position information of the second pixel point corresponding to the identified second center point as the second position information.

[0097] In some possible implementations, there are four target regions; the determination module includes: The difference information determination unit is used to calculate the difference between the second position information of a target marker located at a position corresponding to one of the two target regions and the first position information for two target regions that are farthest apart from each other, to obtain the first difference information; and to calculate the difference between the second position information of a target marker located at a position corresponding to the other target region and the first position information for two target regions that are farthest apart from each other, to obtain the second difference information. The perpendicularity determination unit is used to determine that the axis of the lens is perpendicular to the line connecting the two target areas if the difference between the first difference information and the second difference information is not greater than a preset threshold for the two target areas that are farthest apart. The plane perpendicularity determination unit is used to determine whether the axis of the lens is perpendicular to the plane on which the marking plate is located, when the axis of the lens is perpendicular to both the line connecting the two sets of target areas that are furthest apart from each other. The line-connection-non-perpendicularity determination unit is used to determine that the lens axis is not perpendicular to the line connecting the two target areas that are farthest apart from each other. If the difference between the first difference information and the second difference information is greater than a preset threshold, the lens axis is determined to be not perpendicular to the plane on which the marking plate is located.

[0098] In some possible implementations, the target region is an edge region near the inner edge of the target field of view.

[0099] In some possible embodiments, the lens perpendicularity detection device further includes: The detection result update module is used to determine the offset direction and offset angle of the lens axis if it is determined that the lens axis is not perpendicular to the plane where the marker plate is located. This is based on the second position information of the target marker in the target field of view when it is located at the position corresponding to each target area, as well as the first position information. The offset direction and offset angle are then added to the lens perpendicularity detection result to obtain a new lens perpendicularity detection result.

[0100] Figure 5 This is a schematic diagram of a lens calibration device according to an embodiment of the present invention, as shown below. Figure 5 As shown, this device is used in semiconductor processing equipment, which includes a vision inspection module, and the vision inspection module includes a lens. The device includes: The adjustment module 910 is used to adjust the position of the lens axis according to the detection results of the lens perpendicularity obtained above, until the lens axis is perpendicular to the plane where the marking plate is located, so as to complete the lens calibration.

[0101] It should be understood that the embodiments of the lens perpendicularity detection device and the lens calibration device correspond to the embodiments of the lens perpendicularity detection method and the lens calibration method, and similar descriptions can be found in the calibration method embodiments. To avoid repetition, further details are omitted here. Specifically, Figure 4 The lens perpendicularity detection device shown can execute the above-described lens perpendicularity detection method embodiment, and the aforementioned and other operations and / or functions of each module in the lens perpendicularity detection device are respectively for implementing the corresponding process in the above-described lens perpendicularity detection method. Figure 5 The lens calibration device shown can perform the lens calibration method embodiment described above, and the aforementioned and other operations and / or functions of each module in the lens calibration device are respectively for implementing the corresponding process in the calibration method described above. For the sake of brevity, they will not be described in detail here.

[0102] The lens perpendicularity detection device and lens calibration device of the present invention have been described above from the perspective of functional modules, with reference to the accompanying drawings. It should be understood that these functional modules can be implemented in hardware, in software instructions, or in a combination of hardware and software modules. Specifically, the steps of the calibration method and detection method embodiments of the present invention can be completed by the integrated logic circuits of the processor and / or by software instructions. The steps of the calibration method and detection method disclosed in the embodiments of the present invention can be directly manifested as execution by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. Optionally, the software module can be located in a mature storage medium in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, etc. This storage medium is located in memory, and the processor reads the information in the memory and, in conjunction with its hardware, completes the steps of the above-described calibration method and detection method embodiments.

[0103] This invention provides a semiconductor processing apparatus according to one embodiment. Optionally, the semiconductor processing apparatus includes a memory for storing processor-executable instructions; a processor configured to execute the executable instructions in the memory to implement the steps of the lens perpendicularity detection method and the lens calibration method provided in this disclosure.

[0104] Figure 6 This is a schematic block diagram of a semiconductor processing apparatus 110 according to an embodiment of the present invention.

[0105] like Figure 6 As shown, the semiconductor processing equipment 110 may further include: The system includes a memory 1101 and a processor 1102. The memory 1101 stores computer programs and transfers the program code to the processor 1102. In other words, the processor 1102 can retrieve and run the computer programs from the memory 1101 to implement the methods described in the embodiments of the present invention.

[0106] For example, the processor 1102 can be used to execute the above-described method embodiments according to instructions in the computer program.

[0107] In some embodiments of the present invention, the semiconductor processing apparatus 110 may include, but is not limited to: General-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0108] In some embodiments of the present invention, the memory 1101 includes, but is not limited to: Volatile memory and / or non-volatile memory. Non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory can be random access memory (RAM), used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced Synchronous DRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), and Direct Rambus RAM (DR RAM).

[0109] In some embodiments of the present invention, the computer program may be divided into one or more modules, which are stored in the memory 1101 and executed by the processor 1102 to perform the method provided by the present invention. The one or more modules may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the controller.

[0110] like Figure 6 As shown, the semiconductor processing equipment 110 may further include: Transceiver 1103, which can be connected to processor 1102 or memory 1101.

[0111] The processor 1102 can control the transceiver 1103 to communicate with other devices; specifically, it can send information or data to other devices or receive information or data sent by other devices. The transceiver 1103 may include a transmitter and a receiver. The transceiver 1103 may further include antennas, and the number of antennas may be one or more.

[0112] It should be understood that the various components in the semiconductor processing equipment are connected through a bus system, which includes a data bus, a power bus, a control bus, and a status signal bus.

[0113] The present invention also provides a computer storage medium having a computer program stored thereon, which, when executed by a computer, enables the computer to perform the methods of the above-described method embodiments. Alternatively, one embodiment of the present invention also provides a computer program product containing instructions that, when executed by a computer, cause the computer to perform the methods of the above-described method embodiments.

[0114] When implemented using software, it can be implemented wholly or partially as a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., Digital Video Disc (DVD)), or a semiconductor medium (e.g., Solid State Disk (SSD)).

[0115] Those skilled in the art will recognize that the modules and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0116] In the several embodiments provided by this invention, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or modules may be electrical, mechanical, or other forms.

[0117] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. For example, the functional modules in the various embodiments of this application may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module.

[0118] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A lens perpendicularity detection method, applied to semiconductor processing equipment, the semiconductor processing equipment including a vision inspection module, the vision inspection module including a lens, characterized in that, The method includes: After the target mark in the marking plate is moved to a position corresponding to the center region of the target field of view of the lens, the first position information of the target mark in the target field of view is obtained; the marking plate is placed on the table surface of the worktable of the semiconductor processing equipment; During the process of moving the target markers in the marking plate to positions corresponding to at least three target regions in the target field of view, second position information of the target markers in the target field of view when they are located at positions corresponding to each target region is obtained; at least three target regions are distributed in the target field of view with the center point of the central region as the center; the distances between at least three target regions and the center point of the central region are all the same; Based on the distance between the second position information and the first position information within the target field of view when the target mark is located at the position corresponding to each target area, it is determined whether the axis of the lens is perpendicular to the plane where the mark plate is located, and the determination result is used as the detection result of the perpendicularity of the lens.

2. The lens perpendicularity detection method according to claim 1, characterized in that, The step of determining whether the axis of the lens is perpendicular to the plane where the marker plate is located, based on the distance values ​​between the second position information of the target marker in the target field of view and the first position information when the target marker is located at the position corresponding to each target area, and using the determination result as the detection result of the perpendicularity of the lens, includes: If the distance between the second position information and the first position information in the target field of view when the target mark is located at the position corresponding to each target area is within the target threshold range, then it is determined that the axis of the lens is perpendicular to the plane where the mark plate is located; If the distance between the second position information and the first position information in the target field of view when the target mark is located at the position corresponding to each target area is not completely within the target threshold range, then it is determined that the axis of the lens is not perpendicular to the plane where the mark plate is located.

3. The lens perpendicularity detection method according to claim 1, characterized in that, After the target marker in the marking plate is moved to a position corresponding to the center region of the target field of view of the lens, the first position information of the target marker within the target field of view is obtained, including: After the target marker moves to a position corresponding to the central region in the target field of view, a first image of the target marker presented in the target field of view is acquired; The target marker presented in the first image is located to obtain the first pixel region corresponding to the target marker in the first image; The position of the first center point of the first pixel region is identified, and the position information of the first pixel corresponding to the identified first center point is used as the first position information.

4. The lens perpendicularity detection method according to claim 1, characterized in that, The step of moving the target markers in the marking plate to positions corresponding to at least three target regions in the target field of view, and obtaining second position information of the target markers within the target field of view when they are located at positions corresponding to each of the target regions, includes: For each target region in the target field of view, after the target marker moves to the position corresponding to the target region, a second image of the target marker within the target field of view is acquired; For each of the second images, the location of the target marker presented in the second image is identified to obtain the second pixel region corresponding to the target marker in the second image; The position of the second center point of the second pixel region is identified, and the position information of the second pixel point corresponding to the identified second center point is used as the second position information.

5. The lens perpendicularity detection method according to claim 1, characterized in that, The target areas are four; the step of determining whether the axis of the lens is perpendicular to the plane where the marking plate is located, based on the distance between the second position information and the first position information within the target field of view when the target mark is located at the position corresponding to each target area, and using the determination result as the detection result of the lens's perpendicularity, includes: For the two target regions that are furthest apart from each other, the second position information of the target marker located at the position corresponding to one of the two target regions within the target field of view is calculated with the first position information to obtain first difference information; and the second position information of the target marker located at the position corresponding to the other of the two target regions within the target field of view is calculated with the first position information to obtain second difference information. For the two target regions that are furthest apart from each other, if the distance between the first difference information and the second difference information is not greater than a preset threshold, then it is determined that the axis of the lens is perpendicular to the line connecting the two target regions. When it is determined that the axis of the lens is perpendicular to the line connecting the two target areas that are furthest apart from each other, the axis of the lens is determined to be perpendicular to the plane on which the marking plate is located; For the two target areas that are furthest apart from each other, if the distance between the first difference information and the second difference information is greater than a preset threshold, it is determined that the axis of the lens is not perpendicular to the line connecting the two target areas, so as to determine that the axis of the lens is not perpendicular to the plane where the marking plate is located.

6. The lens perpendicularity detection method according to claim 1, characterized in that, The target region is the edge region near the inner edge of the target field of view.

7. The lens perpendicularity detection method according to claim 1, characterized in that, Also includes: If it is determined that the axis of the lens is not perpendicular to the plane where the marking plate is located, then based on the second position information of the target mark located at the position corresponding to each target area within the target field of view, and the first position information, the offset direction and offset angle of the lens axis are determined, and the offset direction and offset angle are added to the detection result of the lens perpendicularity to obtain a new detection result of the lens perpendicularity.

8. A lens calibration method applied to semiconductor processing equipment, the semiconductor processing equipment including a vision inspection module, the vision inspection module including multiple lenses, characterized in that, The method includes: Based on the detection result of the perpendicularity of the lens obtained according to any one of claims 1 to 7, the axial position of the lens is adjusted until the axial position of the lens is perpendicular to the plane where the marking plate is located, so as to complete the calibration of the lens.

9. A lens perpendicularity detection device, applied to semiconductor processing equipment, the semiconductor processing equipment including a vision inspection module, the vision inspection module including a lens, characterized in that, The device includes: The first position information acquisition module is used to acquire the first position information of the target mark in the target field of view after the target mark in the marking plate moves to a position corresponding to the center area in the target field of view of the lens; the marking plate is placed on the table surface of the worktable of the semiconductor processing equipment; The second position information acquisition module is used to acquire second position information of the target mark in the target field of view when it is located at the position corresponding to each of the target areas during the process of moving the target mark in the marking plate to the position corresponding to at least three target areas in the target field of view; the at least three target areas are distributed in the target field of view with the center point of the central area as the center; the distance between the at least three target areas and the center point of the central area is the same; The judgment module is used to determine whether the axis of the lens is perpendicular to the plane where the marker plate is located, based on the distance values ​​between the second position information and the first position information in the target field of view when the target marker is located at the position corresponding to each target area, and to use the judgment result as the detection result of the perpendicularity of the lens.

10. A lens calibration device, applied to semiconductor processing equipment, the semiconductor processing equipment including a vision inspection module, the vision inspection module including multiple lenses, characterized in that, The device includes: An adjustment module is used to adjust the axial position of the lens according to the detection result of the lens perpendicularity obtained as claimed in any one of claims 1 to 7, until the axial position of the lens is perpendicular to the plane where the marking plate is located, so as to complete the calibration of the lens.

11. A semiconductor processing apparatus, characterized in that, include: Memory is used to store processor-executable instructions; A processor is configured to execute executable instructions in the memory to implement the steps of the method according to any one of claims 1 to 8.

12. A computer-readable storage medium, characterized in that, It contains a computer program that, when executed by a processor, implements the steps of the method described in any one of claims 1 to 8.

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