Copper grid heterojunction cell sheet and preparation method thereof

By using aerosol jet printing and electroplated copper grid line technology, the high loss and precision problems of screen printing method were solved, realizing efficient and reliable copper grid line preparation, and improving the photoelectric conversion efficiency and reliability of HJT cells.

CN122227718APending Publication Date: 2026-06-16XINYU UNIV
0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
XINYU UNIV
Filing Date
2026-01-22
Publication Date
2026-06-16

AI Technical Summary

⚠Technical Problem

Existing screen printing methods for preparing copper grid HJT cells suffer from problems such as high loss, risk of silicon wafer breakage, low mask layer precision, and poor cell reliability, which affect cell conversion efficiency and industrialization prospects.

⚗Method used

A non-contact mask layer is prepared using aerosol jet printing technology, combined with ultraviolet exposure development and copper electroplating to form copper grid lines with a width of less than 15μm. An anti-oxidation layer is then formed on the copper grid lines to improve reliability.

🎯Benefits of technology

It reduces the breakage rate in the printing process, increases the effective light-receiving area of ​​the battery, improves photoelectric conversion efficiency and long-term battery reliability, and reduces production costs.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The application discloses a copper grid line heterojunction cell and a preparation method thereof, and relates to the technical field of heterojunction cell preparation. The preparation method comprises the following steps: step one: providing an N-type substrate, the substrate comprising opposite front and back surfaces, and forming a conductive area on the front and back surfaces; step two: depositing a transparent conductive oxide layer on the conductive area; step three: depositing a copper seed layer on the transparent conductive oxide layer; step four: using aerosol jet printing technology to prepare a mask layer on the non-grid line area of the copper seed layer; step five: exposing and developing the mask layer to expose the copper seed layer of the grid line pattern area; step six: depositing copper by electroplating to generate a copper grid line in the grid line pattern area; and step seven: removing the mask layer and the copper seed layer to obtain a copper grid line heterojunction cell. The application provides a complete preparation method for non-contact printing of a copper grid line heterojunction cell. The aerosol jet printing technology is used, and the non-contact printing reduces the breakage rate of the printing process. In combination with developing, curing and electroplating of the copper grid line, a copper grid line with a width of less than 15 µm can be prepared, so that the effective light receiving area of the cell is increased, and the photoelectric conversion efficiency is improved.
Need to check novelty before this filing date? Find Prior Art