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Optical element holder

A technology for holding devices and optical components, which is applied in the direction of optical components, optical, electrical components, etc., can solve the problems of easy failure, high cost, and difficulty in miniaturization of devices, and achieve the effect of cost saving and space saving

Inactive Publication Date: 2005-11-30
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the packaging volume of the modules assembled in this way is relatively large
The second method is to use screws or glue to fix the optical components on the printed circuit board (see Figure 1), but this method requires additional space to accommodate the screws, making it difficult to miniaturize the entire device
It is time-consuming and prone to failure, resulting in low productivity and high cost

Method used

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  • Optical element holder
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Experimental program
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Embodiment Construction

[0010] Please refer to FIG. 2 and FIG. 3, the optical component holding device 1 of the present invention includes a package housing 10 for accommodating optical passive components and a plurality of pins 11, which can mount the optical passive components 12 on the printed circuit board 3 by soldering technology superior. The optical passive device 12 may be a wavelength division multiplexing device with input and output optical fibers (not shown). The packaging case 10 includes a body 102 , two packaging caps 104 and two protective sleeves 106 . The main body 102 can be made of metal material, and two openings (not shown) are respectively defined at opposite ends thereof, and the passive device 12 enters and passes through the main body 102 through one of the openings when assembled. The package cap 104 is closely matched with the body 102 , and a through hole (not shown) is opened in the center thereof to guide the input and output optical fibers of the optical passive devi...

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Abstract

The invention is a kind of optical component fix-holding equipment, including an encapsulation crust to accept optical passive devices and multiple pins, able to use welding technique to fix the devices on PCB. The crust includes a body, two encapsulation caps and two protection covers. On the body's opposite ends is opened a mouth, respectively, as assembled, the devices enters and passes through the body by one mouth. The encapsulation caps assort with the body closed, and in middle of each encapsulation cap is opened a connection hole to guide the input and output optical fibers of the devices. The protection covers are fix-held in the connection holes, respectively. One end of ach pin is fixed at the bottom of the body, and the other extends outwards and is welded on the PCB.

Description

【Technical field】 [0001] The invention relates to an optical component holding device, in particular to an optical component holding device capable of fixing an optical passive device on a printed circuit board. 【Background technique】 [0002] With the development of optical communication, the requirements for component integration are getting higher and higher, and it is often necessary to integrate optical components and circuits into the same module. For Raman amplifiers, multiple lasers, couplers, isolators and other optical components and circuit boards need to be integrated into one component. Therefore, not only the optical active device needs to be integrated with the circuit, but the optical passive device also needs to be integrated on the circuit board. Generally, there are two methods for fixing optical passive components on a printed circuit board. The first method is to adopt a layered arrangement method, that is, install the electronic components on the circ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/36G02B6/42
CPCG02B6/4238G02B6/3656G02B6/426
Inventor 邵有福
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD