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Integrated low-pass or band-pass filter

A filter and integrated circuit technology, applied in the direction of impedance network, electrical components, multi-terminal pair network, etc., can solve the problem of low ratio

Inactive Publication Date: 2006-10-11
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the benefits of the solutions described above remain due to the resulting poor utilization, that is, due to the resulting reduction in parasitic inductance and increase in surface area (more precisely, in the package Increments in terms of number of terminals) impractical defects caused by low ratios between

Method used

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  • Integrated low-pass or band-pass filter
  • Integrated low-pass or band-pass filter
  • Integrated low-pass or band-pass filter

Examples

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Embodiment Construction

[0038] Figures 6 to 8 illustrate a first embodiment of a low-pass filter according to the invention, wherein the innermost part of the filter structure is independent of the ground connection. FIG. 6 is an equivalent circuit diagram of a π filter manufactured as an integrated circuit 40 and mounted in a package 50 according to the present invention. Figure 7 is a very simple partial top view of a chip and package prior to packaging according to an embodiment of the invention. FIG. 8 shows the frequency response curve of the low-pass filter in FIG. 6 compared with the frequency response curves of the filters in FIGS. 1 and 4 .

[0039] As mentioned above, the ? low-pass filter includes a resistor R coupled to two capacitors C1 and C2. Terminals 4 , 5 of resistor R are defined as filter input-output terminals connected to pads 11 , 12 in chip 40 . Conductive wires (for example, gold wires) 32 and 33 represented by parasitic inductances L1 and L2 in FIG. 6 ( Figure 7 ) to co...

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Abstract

The invention relates to a filter made in the form of an integrated circuit using resistive (R) and capacitive (C11, C12, C13, C14, C21, C22, C23, C24) components, and includes: chip (69) They are not directly connected to each other but are designed to be connected to at least two discrete terminals (71-78) of the housing (70) and at least two discrete welding points for grounding.

Description

technical field [0001] The present invention relates to the technical field of integrated filters, which are passive components (resistors and capacitors) made into the same integrated circuit mounted in a package. [0002] An example application of the invention involves high frequency transmissions (eg mobile phones). [0003] The invention will be described with respect to the application to a low pass filter. The present invention also relates generally to low pass filters, band pass filters and complex filters. Background technique [0004] Existing integrated filters have the disadvantage that their packaging degrades their frequency response. [0005] FIG. 1 shows an example of an equivalent circuit diagram of a low-pass filter 1 manufactured in the form of an integrated circuit and mounted in a package. The example in FIG. 1 relates to a so-called π-filter comprising electrodes 2 and 3 with a common ground and two capacitive elements with second electrodes 4 and 5...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H7/06
CPCH03H7/06H03H7/1758
Inventor 法布里斯·居顿丘克里·卡鲁伊
Owner STMICROELECTRONICS SRL