Integrated semiconductor internal memory with formed network region selective transistor
A semiconductor and memory technology, applied in the field of integrated semiconductor memory, can solve the problems of lowering operating voltage, shortening the update period, increasing memory current consumption, etc.
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[0031] figure 1 The integrated semiconductor memory 10 is shown having an SOI substrate 20 with an implanted insulating layer 11 disposed just below the selective transistors of the memory cells 1 formed on the ridges 4 . The implanted insulating layer 11 is preferably an oxide layer 11 with openings in which a trench capacitor 2 is incorporated into the substrate 20, and by means of a contact provided in the opening, such as the surface contact 19, Connected to the first source / drain region 5 of the selective transistor 3 . The first source / drain region 5 is arranged on the first terminal A of the ridge 4 extending in the longitudinal direction x, while the second source / drain region 6 is arranged on the other terminal B of the ridge 4 . The ridge extends between this terminal A and terminal B, its main direction of extension x being consistent with the current flow direction I of the transistor channel, and by a gate oxide 9 and a gate layer sequence from above it and above...
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