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Chip inductive resistor

A technology of inductors and chips, which is applied in the direction of inductors with magnetic cores, transformer/inductor shells, magnetic cores/yokes, etc., can solve the problem of unsatisfactory heat resistance of high-frequency chip beads and external electrodes. Problems such as weak adhesion and impossibility

Inactive Publication Date: 2002-10-02
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the heat resistance of the above-mentioned high-frequency chip beads is unsatisfactory
[0008] In addition, when PTFE is used for high-frequency chip beads, since the surface free energy is small, the adhesion of the external electrodes is very weak, and thus high reliability cannot be achieved

Method used

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  • Chip inductive resistor
  • Chip inductive resistor
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Embodiment Construction

[0019] The following will compare figure 1 A chip inductor according to an embodiment of the present invention will be described.

[0020] in accordance with figure 1 In the shown chip inductor of the present invention, at least one spiral electrode 3 is embedded inside the hexagonal or cylindrical chip inductor body. The spiral electrode 3 is made of a conductive metal such as silver, or a substantially arch-shaped conductive adhesive, and is arranged so that the central axis of the spiral electrode 3 and the axis of the chip inductor 2 are parallel to each other. Adjacent arcuate sections of the spiral electrode 3 are connected to each other by means of first through holes, which extend in the axial direction of the chip inductor body 2 , which are not shown in the figure.

[0021] External electrodes 1 made of a conductive metal such as silver or made of a conductive adhesive are formed longitudinally on both sides of the chip inductor body 2 . The spiral electrode 3 and...

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Abstract

The invention relates to a chip inductor, and the body of the chip inductor includes ferrite powder and resin. At least one spiral electrode is formed on the chip inductor body. The choice of ferrite powder and resin should be such that the inductive reactance cross point according to the frequency inductive reactance characteristics is within the frequency band from 1 GHz to above 1 GHz.

Description

technical field [0001] The present invention relates to a chip inductor having sufficient resistance to soldering heat and having improved inductive reactance characteristics in the high frequency band, especially in the gigahertz band, so that it is possible to transmit up to several gigahertz Circuit signals in the frequency band and can cut off high-frequency noise higher than the frequency in the above frequency band. Background technique [0002] Japanese Unexamined Patent Application No. 10-270255 relates to the prior art of the present invention, which discloses a chip bead with a signal conductor helically embedded in a ferrite powder and insulating The inner side of the insulating substrate composed of resin mixture. The above-mentioned chip bead can be fabricated under a low temperature condition of 100°C to 200°C instead of a high temperature condition (about 900°C). Therefore, the insulating substrate is easy to manufacture and is not affected by the firing tem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F1/113H01F1/33H01F3/08H01F17/06H01F27/02H01F27/24
CPCH01F3/08H01F27/027H01F27/24
Inventor 伴野国三郎大沢隆司川上章彦福岛光宏户田崇
Owner MURATA MFG CO LTD