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Substrate processing apparatus

A substrate processing and substrate technology, applied in the field of substrate processing devices, can solve the problems of hindering electroplating films, coating pores and the like

Inactive Publication Date: 2003-11-12
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Residual air bubbles will prevent the normal formation of the plating film on the surface of the substrate, and easily generate defects such as pores in the plating film

Method used

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  • Substrate processing apparatus
  • Substrate processing apparatus
  • Substrate processing apparatus

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Embodiment Construction

[0052] Refer below Figures 2 to 16 A substrate processing apparatus in one embodiment of the present invention will be described. figure 2 is a top view of a substrate processing apparatus according to an embodiment of the present invention.

[0053] A substrate processing apparatus according to an embodiment of the present invention is used as a plating apparatus for electroplating copper or the like on the surface of a substrate. Such as figure 2 As shown, a substrate processing apparatus is housed in a rectangular housing 1 to continuously perform electroplating on a plurality of substrates, such as semiconductor substrates. The substrate processing device (electroplating device) includes: a pair of loading / unloading units 10, which are respectively used to store a plurality of substrates, and a pair of bevel edge etching / chemical cleaning / drying units 16, which are used to clean the electroplating substrates with a chemical solution. A pair of substrate stages 18, wh...

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Abstract

A substrate processing apparatus comprises a plating section having a plating bath for holding a plating liquid therein, and a head assembly for holding a substrate and immersing the substrate in the plating liquid in the plating bath. A plated film is formed on a surface of the substrate in the plating liquid. The substrate processing apparatus further comprises a cleaning section for cleaning a peripheral edge of the plated substrate and a substrate contact portion held in contact with the substrate, and a drive mechanism for moving the head assembly between the plating section and the cleaning section.

Description

technical field [0001] The present invention relates to a substrate processing apparatus for processing a substrate, and more particularly to a substrate processing apparatus for filling copper or the like into wiring grooves formed in a semiconductor substrate. Background technique [0002] At present, in order to fill the micro-wiring grooves or through holes formed in the surface of the substrate, it is usually necessary to use a substrate processing device (plating device) to electroplate on a substrate such as a semiconductor substrate, such as copper, which has a resistivity lower than that of aluminum or aluminum-based materials. metal to form embedded wiring structures in trenches or vias. [0003] figure 1 It is a schematic diagram of a flip-chip electroplating device with a traditional structure. Such as figure 1 As shown, the conventional flip-chip electroplating device includes an upwardly open cylindrical electroplating tank 312, which is used to accommodate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D7/12C25D17/06C25D17/08C25D19/00H01L21/00H01L21/288H01L21/687
CPCH01L21/6723H01L21/67173H01L21/67184C25D7/12C25D17/001H01L21/67167H01L21/68707H01L21/67051H01L21/67161H01L21/288
Inventor 粂川正行
Owner EBARA CORP