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Semiconductor mounting substrate for making electronic package and its production process

A production process and electronic packaging technology, which is applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve the problems of low efficiency, increased production cost of semiconductor mounting substrates, and formation of rectangular openings in multilayer substrates. difficulties, etc.

Inactive Publication Date: 2004-02-25
NEC ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Since it is necessary to form rectangular openings one by one in the multilayer substrate using a router, the efficiency of the production process of the semiconductor mounting substrate described above is low, resulting in an increase in the production cost of the semiconductor mounting substrate.
In addition, when the thickness of the intermediate metal film layer is thinned, it is difficult to form a rectangular opening in a multilayer substrate because the router must be strictly and accurately controlled so that the thin metal layer cannot be penetrated by the cutter of the router.
Therefore, the thinner the thickness of the intermediate metal film layer, the higher the production cost of the semiconductor mounting substrate

Method used

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  • Semiconductor mounting substrate for making electronic package and its production process
  • Semiconductor mounting substrate for making electronic package and its production process
  • Semiconductor mounting substrate for making electronic package and its production process

Examples

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no. 1 example

[0066] see figure 1 , shows in a perspective view a first embodiment of a semiconductor mounting substrate according to the present invention, which is applied to manufacture a plurality of electronic packages such as BGA (Ball Grid Array) packages.

[0067] Such as figure 1 As shown, a semiconductor mounting substrate, generally indicated at 10, is formed as a multilayer substrate. In the first embodiment, a semiconductor mounting substrate or multilayer substrate 10 includes three metal film layers 12A, 12B, and 12C, and two electrically insulating layers 14A and 14B alternately stacked. That is, the metal film layers 12A and 12C form the outermost layer of the multilayer substrate 10, the metal film layer 12B forms the middle layer, and each electrical insulation layer 14A and 14B is respectively formed on the outermost metal film layer 12A and the middle metal film layer 12B and the middle layer. Interposed between the metal film layer 12B and the outermost metal film la...

no. 2 example

[0091] refer to Figure 4 and 5 , illustrates in perspective and plan views a second embodiment of a semiconductor mounting substrate according to the present invention, which is also used for manufacturing a plurality of electronic packages such as BGA (Ball Grid Array) packages.

[0092] Such as Figure 4 As shown, the semiconductor mounting substrate, generally indicated at 20, is also formed as a multilayer substrate. Similar to the above-described first embodiment, the semiconductor mounting substrate or multilayer substrate 20 includes three metal film layers 22A, 22B, and 22C, and two electrically insulating layers 24A and 24B stacked alternately. That is, the metal film layers 22A and 22C form the outermost layer of the multilayer substrate 20, the metal film layer 22B forms an intermediate layer, and each electrical insulation layer 24A and 24B is respectively inserted between the outermost metal film layer 22A and the intermediate metal film layer 22B. Between, an...

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Abstract

In a semiconductor-mounting substrate used to manufacture a plurality of electronic packages, a first multi-layer substrate section is composed of a metal film layer and an electronic insulation layer, and a plurality of package areas are defined on a surface of the first substrate section. A second multi-layer substrate section is composed of at least two metal film layers which are spaced from an electric insulation layer intervened therebetween. The first substrate section is laminated onto the second substrate section, using a press machine, such that the electronic insulation layer of the first substrate section is laid on one of the metal film layers of the second substrate section. A chip-mounting opening is formed at each package area in the first substrate section prior to the lamination of the first substrate section onto the second substrate section.

Description

technical field [0001] The present invention relates to a semiconductor mounting substrate for use in the manufacture of a plurality of electronic packages, and to a production process for producing such a semiconductor mounting substrate. Background technique [0002] Generally, compared with each electronic package to be manufactured, the size of the semiconductor mounting substrate is quite large, so as to manufacture multiple electronic packages at the same time, such as ball grid array BGA (Ball Grid Array) package and the like. [0003] Generally, semiconductor mounting substrates are produced as multilayer substrates consisting of three metal film layers and two electrically insulating layers stacked alternately. That is, the two metal films form the two outermost metal film layers of the multilayer substrate, and the remaining metal film layers form the middle metal film layer of the multilayer substrate, and two electrically insulating layers are formed between the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/12H01L23/13H01L23/498H05K1/18H05K3/46
CPCH05K3/4611H01L2924/0002H05K1/183H01L23/13H01L23/49833H01L2924/00H01L23/12
Inventor 栗原健一
Owner NEC ELECTRONICS CORP