Substrate for mounting semiconductor chip thereon using ultrasonic welding
An ultrasonic welding and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problem of low ultrasonic conductivity and cannot always effectively prevent the deviation and defect of the magnetic head IC chip 11 Installation and other issues
Inactive Publication Date: 2004-11-03
FUJITSU LTD
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Problems solved by technology
[0017] 3. The ultrasonic conductivity from the tool 75 to the magnetic head IC chip 11 is very low
Therefore, the ultrasonic conductivity from the tool 75 to the magnetic head IC chip 11 is very low, and the welding of the gold bump 51 to the gold pad 61 needs a long time
[0019] 4. The magnetic head IC chip often deviates during installation, and the deviation leads to defective installation
Therefore, when the tool 75 ultrasonically oscillates, the pads on the substrate 32 cannot always effectively prevent the head IC chip 11 from deviating.
Method used
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Embodiment Construction
[0084] The first embodiment solves the problem that the shape of the outline of the underfill is unreliable.
[0085] Figure 9A with 9B A magnetic head IC chip mounting apparatus 100 as a first embodiment of the present invention is shown. The magnetic head IC chip mounting apparatus 100 includes a workbench 101 , a bonding unit 110 and a control unit 130 .
[0086] Workbench 101 accommodates figure 2 The suspension rod 12 shown is provided with an air suction hole 102 for attracting and pulling the suspension rod 12 . On the table 101, there are also four ultraviolet lamps 104 to 107 surrounding the chip mounting position 109, facing the four sides of the mounted magnetic head IC chip 11, so as to irradiate all four sides of the magnetic head IC chip 11 with ultraviolet rays.
[0087] The welding unit 110 includes a welding head 111 , a welding tool 112 suspended from the welding head 111 , and an ultrasonic oscillator 113 integrally formed with the welding tool 112 . T...
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Abstract
A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.
Description
[0001] This application is a divisional application of the invention patent application filed on August 4, 2000, with the application number 00122531.6 and the title of the invention "Method for Installing Semiconductor Chips". technical field [0002] The present invention generally relates to a method of mounting a semiconductor chip, an apparatus for mounting a semiconductor chip, and a substrate for mounting a semiconductor chip. Background technique [0003] The method of mounting the semiconductor chip is suitable for mounting the magnetic head IC chip 11 of the hard disk device 10 onto a suspension 12, as shown in FIGS. 1A and 1B, or mounting the IC chip 31 of the printed circuit board unit 30 onto the substrate 32 on, as shown in Figures 3A to 3C. [0004] As shown in FIGS. 1A and 1B, a hard disk unit 10 has a hard disk 16 rotating at high speed in a hermetically sealed casing 15, and a head slider assembly 19 is fixed to the top end of an arm 18. The magnetic head ...
Claims
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IPC IPC(8): B23K20/10B23K31/00G11B5/00G11B5/48H01L21/58H01L21/60H01L21/607H05K3/34
CPCH01L24/83H01L2924/14H01L2924/15311H01L2924/01029H01L24/75H01L2224/83192H01L2924/01079H01L2224/73204H01L2224/16225H01L2224/81444H01L2224/83874H01L2224/32225H01L2924/07802H01L2924/00012H01L2924/00H01L23/28
Inventor 马场俊二山上高丰海沼则夫小八重健二吉良秀彦小林弘
Owner FUJITSU LTD