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Structure for increasing reliability of metal connecting line

A metal connection and reliability technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problem of insufficient capture rate of conductive particles

Inactive Publication Date: 2004-12-29
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the reduction of gold bump area, the phenomenon of insufficient capture rate of conductive particles is also prone to occur.

Method used

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  • Structure for increasing reliability of metal connecting line
  • Structure for increasing reliability of metal connecting line
  • Structure for increasing reliability of metal connecting line

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Embodiment

[0031] Please also refer to figure 2 and image 3 , figure 2 A plan view illustrating a preferred embodiment of the structure of the present invention for increasing the reliability of metal wiring. image 3 is along figure 2 The 3-3' section view. A plurality of metal bumps 202 are located on a first substrate 204 such as a semiconductor substrate. In this preferred embodiment, the semiconductor substrate 204 is a silicon chip, and the metal bumps 202 are preferably composed of gold, which is formed on silicon Metal electrodes (not shown) of the chip are connected to the chip 204 , and the metal bump 202 has a plurality of grooves 206 on the other surface adjacent to the first substrate 204 . The grooves 206 are preferably rectangular or square, and arranged in a matrix to form a grid-like metal bump 202 . It should be noted that the shortest side of the rectangular groove 206 needs to be longer than the diameter of the conductive particles 208 of the anisotropic cond...

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Abstract

The structure with raised connecting metal wire reliability includes several raised metal points on one substrate and corresponding notches on the other side of the substrate. By means of the raised metal points in lattice distribution on the chip, the ACF conducting particle seizing probability is increased. By means of the increased contact area of ACF glue between the raised metal points in lattice distribution and the notches, the tensile strength of the linkage between the chip and the glass substrate metal pad is raised.

Description

technical field [0001] The present invention relates to a structure for increasing the reliability of metal wiring, in particular to the construction technology of integrated circuits, in particular to a construction technology applied between integrated circuits and displays. Background technique [0002] In some existing electronic devices, the connection between the components and the main circuit is performed through a conductive film (such as anisotropic conductive glue, referred to as ACF). Anisotropic conductive adhesive ACF is made by mixing non-conductive synthetic resin and conductive particles. Conductive particles 1 such as Figure 1A As shown in the cross-sectional view of , its diameter is about 3-5 μm, its central part 1a is made of polymer, and the outside is covered with metal conductor 1b, such as gold, nickel, tin, etc. [0003] ACF is often used in the manufacture of liquid crystal displays, and some are used to directly package the driver chip of the pan...

Claims

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Application Information

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IPC IPC(8): G02F1/133
CPCH01L24/29H01L2224/83101H01L2924/14
Inventor 李俊右郑炳钦
Owner AU OPTRONICS CORP