Device and method for reducing internal environment temperature of computer

Abstract

A device and method for reducing the ambient temperature in the computer a radiation frame with a designed cooling space, a cooling component in it and a cooling body and a fan fixed at the adjacent side of said radiation frame. The method provides a cold generating unit first, then to send the cold temperature to the internal of said computer to reduce the ambient temperature in the computer.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device, in particular to a device and method capable of effectively reducing the internal environment temperature of a computer. 【Background technique】 [0002] Such as figure 1 As shown, a first existing cooling device 1 is applicable to the heat source 3 in the computer casing 2 of the computer (not shown), and the heat source 3 is a CPU or an integrated circuit (IC); 1 includes a heat dissipation fin 101 attached to the heat source 3, and a fan 102 fixed on the heat dissipation fin 101; when the heat source 3 generates heat due to operation, the heat can be conducted to the cooling fins 101, and then blow the airflow to the cooling fins 101 by the fan 102, so that the heat can be dissipated in the computer case 2 to achieve the heat exchange effect; The hot air flow dissipated in the computer case 2 gradually increases and the ambient temperature remains high, so that the fan 102 can only guide the hot...

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Problems solved by technology

[0002] like figure 1 As shown, a first existing cooling device 1 is applicable to the heat source 3 in the computer casing 2 of the computer (not shown), and the heat source 3 is a CPU or an integrated circuit (IC); 1 includes a heat dissipation fin 101 attached to the heat source 3, and a fan 102 fixed on the heat dissipation fin 101; when the heat source 3 generates heat due to operation, the heat can be conducted to the cooling fins 101, and then blow the airflow to the cooling fins 101 by the fan 102, so that the heat can be dissipated in the computer case 2 to achieve the heat exchange effect; The hot air flow dissipated in the computer case 2 gradually increases and the ambient temperature remains high, so that the fan 102 can only guide the hot air flow to the cooling fins 101, resulting in poor cooling effect

[0003] like figure 2 As shown, another second existing cooling device 4 includes a pipe 401 and a fan 402 connected to one end of the pipe 401; The airflow is directly blown on the heat source (not shown) to cool down, or blown into the computer case 2 to lower the ambient temperature; thus, although it has a better heat exchange effect than the aforementioned first existing cooling device 1 , but in fact, when the cooling device 1 is used in summer or hot weather, because the hot air flow introduced by the fan 402 is almost the same as the ambient temperature in the computer case 2, it is impossible to use the high and low temperature difference to Reduce the ambient temperature, resulting in the lack of significant cooling effect

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