Method for making minisize flow passage by lead frame technology
A lead frame and miniature technology, which is applied in the direction of microstructure technology, manufacturing microstructure devices, semiconductor/solid-state device manufacturing, etc., can solve the problems of mass production cost reduction, die-casting or injection molding bottlenecks, and inability to mass-manufacture, etc.
Active Publication Date: 2005-09-21
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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Problems solved by technology
However, the first two technologies have the disadvantages of being unable to process high aspect ratios and complex three-dimensional three-dimensional structures, so their application in the production of microstructures is quite limited.
Although microlithography electroforming is a technology developed for the purpose of batch manufacturing, it is still not practical due to the high equipment and production costs required, and there are still bottlenecks in die-casting or injection molding technologies. Fabrication of microstructures in large quantities at low cost
[0005] Non-batch manufacturing technologies include precision micro machining, electro-discharge micro machining, and laser micro machining, etc. Although they can perform higher aspect ratios and are more complex Three-dimensional three-dimensional structure processing, but because it cannot be mass-produced, it is impossible to reduce costs through mass production to take advantage of the microsystem
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[0082] The aforementioned and other technical contents, features and effects of the present invention will be clearly understood in the following detailed description of the three preferred embodiments with reference to the drawings. Before presenting a detailed description, it should be noted that in the following description, similar elements are denoted by the same reference numerals. At the same time, due to the many functions and uses of the micro flow channel, it is difficult to give an example one by one, so the following only takes a circulating cooling device 1 as an example to illustrate the manufacturing method of the present invention, and those who are familiar with this technology can naturally use the following implementation The example is easy to understand, and other devices that can achieve specific functions with flow channels can also be manufactured by the method of the present invention for manufacturing micro flow channels with lead frame technology.
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Abstract
This invention relates to a method to process micro channel by conductive structure technique, which comprises the following steps: first forming one groove channel on one conductive rack; then fixing one cover on the groove channel on the rack to determine one micro flow channel.
Description
【Technical field】 [0001] The invention relates to a method for making a micro flow channel, in particular to a method for making a micro flow channel by using the lead frame technology. 【Background technique】 [0002] Nowadays, electronic technology is changing with each passing day. Electronic devices such as mobile phones (cell phones), personal digital assistants (PD(A), and notebook computers (Noteboo(k)) are all moving towards light, thin, short, small, beautiful, and multi-functional. The trend of function development has made the electronic components contained in the above-mentioned electronic equipment, such as micro-processing chips, also miniaturized. The accumulation of heat will cause the temperature of the components to rise. Coupled with the increase in the overall electronic component density caused by the trend of miniaturization, and the high-frequency current caused by high-speed circuits, each component and system is limited by the operating temperature. ...
Claims
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IPC IPC(8): B81C1/00H01L21/00
Inventor 陈佩佩林招庆
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD