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Power supply drive method for sputter ion pump

A power-driven, ion-pump technology, applied in the direction of sputtering plating, ion implantation plating, metal material coating technology, etc., to achieve the effect of reducing energy consumption, reducing the number of power supplies, and simplifying the work of the system

Inactive Publication Date: 2005-11-16
INST OF MODERN PHYSICS CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Obviously in the prior art, how many sputtering pumps are needed, how many power supplies are necessary

Method used

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  • Power supply drive method for sputter ion pump
  • Power supply drive method for sputter ion pump

Examples

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Embodiment Construction

[0012] The present invention is described in detail below in conjunction with embodiment:

[0013] In the first embodiment of the present invention (see attached figure 1 ), 4 is any existing power supply for the sputtering ion pump, the output end of the power supply is connected with three sputtering ion pumps in parallel, and a cut-off switch K is provided between each sputtering ion pump and the output end of the power supply (K is provided upstream of each terminal). Setting the switch K can put different sputter ion pumps into use or disconnect them according to the needs of the vacuum system. It should be noted that only three sputter ion pumps are connected in parallel in this embodiment, but actually more pumps can be connected in parallel. It can also be seen from the figure that there is also a ground terminal in the wiring connected to each sputter ion pump.

[0014] Second embodiment of the present invention (see attached figure 2 ), is basically the same as ...

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Abstract

A method for supplying electric powr to the sputter ion pump used to make high vacuity features that a power supply whose output power and maximal output current are least equal to the maximal working current and maximal start current of a single sputter ion pump is used for at least parallel two sputter ion pumps.

Description

technical field [0001] The invention relates to a method for supplying power to a special load, more precisely, the invention is a method for supplying power to a sputtering ion pump used for extracting high vacuum. Background technique [0002] The sputtering ion pumps currently used all use a power supply to supply power to a sputtering ion pump to drive the sputtering ion pump to work. This power supply is basically similar to an ordinary stabilized power supply, including a transformer circuit and Boost rectification circuit, and power supply voltage, power supply current measurement and display circuit, safety protection circuit and control switch, usually the power supply of the power supply used should match the working power of the sputter ion pump. Obviously, in the prior art, as many sputtering pumps are needed, as many power supplies are necessary. This is a commonly used measure in this field at this stage. Contents of the invention [0003] The invention pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34
Inventor 杨晓天张军辉游志明高大庆蒙峻胡振军张喜平侯生军张新俊
Owner INST OF MODERN PHYSICS CHINESE ACADEMY OF SCI