Power supply drive method for sputter ion pump
A power-driven, ion-pump technology, applied in the direction of sputtering plating, ion implantation plating, metal material coating technology, etc., to achieve the effect of reducing energy consumption, reducing the number of power supplies, and simplifying the work of the system
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[0012] The present invention is described in detail below in conjunction with embodiment:
[0013] In the first embodiment of the present invention (see attached figure 1 ), 4 is any existing power supply for the sputtering ion pump, the output end of the power supply is connected with three sputtering ion pumps in parallel, and a cut-off switch K is provided between each sputtering ion pump and the output end of the power supply (K is provided upstream of each terminal). Setting the switch K can put different sputter ion pumps into use or disconnect them according to the needs of the vacuum system. It should be noted that only three sputter ion pumps are connected in parallel in this embodiment, but actually more pumps can be connected in parallel. It can also be seen from the figure that there is also a ground terminal in the wiring connected to each sputter ion pump.
[0014] Second embodiment of the present invention (see attached figure 2 ), is basically the same as ...
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