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A printed wiring board and production method thereof

A technology for printed circuit boards and circuits, applied in the fields of printed circuit manufacturing, multilayer circuit manufacturing, printed circuits, etc., can solve problems such as difficult soldering and virtual soldering, improve reliability, avoid unsolderable or virtual soldering, and improve The effect of production efficiency

Active Publication Date: 2005-11-23
SHENZHEN WUZHU TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a printed circuit board and its manufacturing method, so as to avoid the problems of difficult soldering and virtual soldering in the prior art when soldering plug-ins

Method used

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  • A printed wiring board and production method thereof
  • A printed wiring board and production method thereof
  • A printed wiring board and production method thereof

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Embodiment Construction

[0035] The core of the present invention is to automatically transfer the assembly information on the printed circuit board to the PCB processing process to produce a PCB board with an assembly identification layer, and to perform different solder joints according to the welding conditions indicated by the assembly identification layer during PCB assembly. Select the appropriate welding tools and welding time to ensure the welding quality of components.

[0036] In order to enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0037] figure 2 An example of the assembly identification layer in the PCB design of the present invention is shown, image 3 It is an assembly identification layer on a PCB actually processed by the present invention.

[0038] refer to figure 2 with image 3 , the printed wiring board provided by th...

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Abstract

This invention discloses one printing circuit board and its process method, which comprises the following steps: getting element lead leg wit large area of copper information when designing the printing circuit PCB; generating printing circuit board, that is printing circuit board with alignment mark layer by the large copper information.

Description

technical field [0001] The invention relates to a manufacturing process in the field of electronics or communication, in particular to a printed circuit board and a manufacturing method thereof. Background technique [0002] PCB (Printed Circuit Board) is an indispensable basic component of all electronic products. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed circuits must be used for the electrical interconnection between them. plate. In the larger electronics product research process, the most fundamental success factors are the design, documentation and fabrication of the product's printed circuit board. The design and manufacturing quality of printed boards directly affect the quality and cost of the entire product, and even lead to the success or failure of commercia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/00
Inventor 冯小强李广生
Owner SHENZHEN WUZHU TECH