Lead frame for semiconductor element and semiconductor device using same

Abstract

The present invention prevents a heat dissipation from an inner lead to a die pad area at the time of soldering process of the inner lead by providing a discontinuous part between the die pad area and the inner lead frame. The lead frame 1 for discontinuously forming die pad area 10 for mounting a semiconductor device and the inner lead 11 is provided.

Description

technical field [0001] The present invention relates to a lead frame on which a semiconductor element is mounted and a semiconductor device using the lead frame. Background technique [0002] A lead frame for mounting a semiconductor element is made of a thin plate-shaped conductive material having a predetermined shape. [0003] For example, as shown in Fig. 1 of the following patent document 1, the pad region for bonding with the semiconductor substrate chip of the semiconductor laser element 1, the inner lead (cathode connection terminal 2a) connected to the pad region, and the bonding pad region are formed. The pad region is separated and is constituted by an inner lead (anode connection terminal 3 ) connected to the electrode lead of the semiconductor laser element 1 by wire bonding. [0004] That is, if Figure 6 As shown, the lead frame 50 is provided with a pad area 51 for soldering the semiconductor element chip, an inner lead 52 electrically connected to the pad a...

AI Technical Summary

Problems solved by technology

[0010] That is, when two inner leads are soldered at the same temperature, the inner lead connected to the land area conducts heat to the pad area, so heat dissipation occurs; for discontinuous inner leads, the soldering temperature decreases, and this occurs Insufficient soldering strength and prolonged soldering time

[0011] Moreover, it will cause thermal damage to the mounted semiconductor components.

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