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Semiconductor laser device

A laser device and semiconductor technology, which is applied to semiconductor lasers, semiconductor devices, lasers, etc., can solve the problems of complex processes, increased manufacturing costs, and complex manufacturing processes.

Inactive Publication Date: 2006-01-25
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, there is a disadvantage that the manufacturing process of the above-mentioned semiconductor element 3 and light receiving element 4 becomes complicated, and the manufacturing cost related to their mounting increases.
[0008] Moreover, in the above-mentioned semiconductor laser device, since a plurality of through-holes are provided on the stem 1, and after inserting the wires 7 one by one into the through-holes, the space between the through-holes and the wires 7 is buried with an insulator, so there is a problem with packaging. The related process becomes complicated and the disadvantage of high manufacturing cost

Method used

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  • Semiconductor laser device
  • Semiconductor laser device
  • Semiconductor laser device

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Embodiment Construction

[0056] Hereinafter, the semiconductor laser device of the present invention and the optical pickup device including the same will be described in detail through the illustrated embodiments.

[0057] figure 1 It is a schematic perspective view showing a semiconductor laser device 100 according to an embodiment of the present invention.

[0058] The above-mentioned semiconductor laser device 100 is provided with: a wiring substrate 101, a block unit 102 mounted on an example of one side of the wiring substrate 101, a semiconductor laser element 103 for emitting laser light L, and a light receiving element for receiving reflected light of the laser light. 104 , block unit 102 , cuboid-shaped cover 105 covering semiconductor laser element 103 and light receiving element 104 , and hologram element 106 disposed on cover 105 . The above-mentioned block unit 102 is an example of a block, and the light receiving element 104 is an example of a first light receiving element.

[0059] ...

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Abstract

In a semiconductor laser device, a wiring board ( 101 ) has pad patterns on its top surface, on which a block ( 102 ) is also mounted. The block ( 102 ) has a first mounting surface ( 113 ) and a second mounting surface ( 114 ), both of which face in an identical direction. The block ( 102 ) also has a raising mirror ( 111 ) for changing an optical axis of light. On the first mounting surface ( 113 ) is mounted a semiconductor laser element ( 103 ) which emits laser light (L). On the second mounting surface ( 114 ) is mounted a light receiving element ( 104 ) which receives reflected light of the laser light (L).

Description

technical field [0001] The present invention relates to a semiconductor laser device and an optical pickup device including the same. Background technique [0002] Some optical pickup devices for reading optical disc signals used in optical recording media such as CD-ROM (Disc Read Only Memory) and MD (Mini Disc) include semiconductor laser devices of the holographic laser method. The so-called holographic laser method refers to the assembly of semiconductor laser elements, holographic elements and signal receiving elements in one package, the light is emitted from the semiconductor laser element, and the light reflected from the optical disc as an optical recording medium is diffracted by the holographic element and introduced into the The method of placing the light receiving element at a distance from the optical axis. [0003] Conventionally, a holographic laser type semiconductor device is described in Japanese Unexamined Patent Publication No. 6-5990. Such semiconduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/00H01S5/022H01L31/02G11B7/125
CPCH01S5/0683H01S5/02292H01S5/02248H01S5/02296H01S5/02208H01S5/02252H01S5/02255H01S5/02257H01S5/02326H01S5/02325
Inventor 松原和德堀口武小泉秀史
Owner SHARP KK