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Reactive hot-melt adhesive

A hot melt adhesive, reactive technology, applied in the field of forming hot melt adhesive compositions, reactive hot melt adhesive compositions, substrates of structural parts, polyisocyanates, can solve the problem of not providing original strength Issues such as creep and/or creep resistance

Inactive Publication Date: 2006-04-12
ROHM & HAAS CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, their "green strength" (i.e., the strength of the adhesive before reaction with moisture is complete) and creep resistance are not stated in the patent, and this adhesive, when used in certain other structural components, cannot Provide adequate green strength creep and / or creep resistance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0030] Preparation of test samples:

[0031] The test specimens were sandwich laminate structures: oriented strand board (OSB), adhesive, expanded polystyrene foam, adhesive, and OSB, according to the Acceptance Criteria for Sandwich Board Adhesives published by the International Conference of Building Officials (ICBO). "(Acceptance Criteria For Sandwich Panel Adhesive), prepared by procedure of #AC05.

[0032] Manual break:

[0033] Sandwich lamination test samples were cut into pieces approximately 5 to 7.5 centimeters (2 to 3 inches) wide. Fix one OSB, apply force on the other OSB by hand until the sandwich structure separates, and observe its fracture mode. "Pass" fracture mode refers to polystyrene foam separation. A "failure" failure mode refers to failure of the adhesive bonded to either bonding surface.

[0034] Creep: Following ICBO Procedure AC05, Section 8.6.1, apply a pressure of 345 kPa (50 psi) to the sandwich test specimen and observe its deformation. "P...

Embodiment

[0042] The hot melt adhesive composition of the present invention is prepared by the following steps. Add polyol raw material to a 1.5 liter resin pot, then add defoamer if desired. The mixture was then heated to 150°C under nitrogen atmosphere. After holding at this temperature for 2 hours, the mixture was cooled to 115°C and full vacuum (2729 ft Hg) was applied to remove excess moisture. After one hour, the temperature dropped to 105-110°C and the vacuum was released by bubbling dry nitrogen. The polyisocyanate is then added. The vacuum was re-evacuated and the temperature equilibrated to 100°C. After one hour, the vacuum was released by bubbling dry nitrogen and Jeffcat DMDEE was added. The reaction was continued at 100°C for one hour under nitrogen.

[0043] Using the adhesive compositions of the present invention (Examples 1-21), several sandwich lamination samples were prepared.

[0044] Raw materials:

[0045] Thermoplastic polymer A: an acrylic acid terpolymer h...

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PUM

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Abstract

A hot melt adhesive composition is disclosed that includes a combination of one or more high molecular weight components, high levels of one or more multifunctional polyols, one or more organic compounds having a least one hydroxy functional group and high levels of one or more polyisocyanates, with each corresponding ingredient adjusted in specified ways that provides an unexpected balance of properties required for bonding structural components.

Description

technical field [0001] The present invention relates to a hot-melt adhesive, in particular to a reactive hot-melt adhesive composition, a method of forming a hot-melt adhesive composition, and a method for using a hot-melt adhesive The composition is a method of bonding substrates including but not limited to structural components. More specifically, the present invention relates to a combination comprising one or more high molecular weight components, a high level of one or more polyfunctional polyols and a high level of one or more polyisocyanates, each of the respective components according to Tuned in the specified manner to achieve the desired balance of performance. Background technique [0002] Hot melt adhesives are known to be ideal fast curing adhesives and cure in the absence of aqueous or solvent based media that provide the flowability of other types of adhesives. Moisture-reactive hot melt adhesives based on isocyanate-group-containing urethane prepolymers ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04
CPCC08G2250/00C09J175/06C08G18/6662C08G18/6629C09J175/04C08L33/00C08G2170/20C08G18/12C08L2666/04C08L2666/06C08G18/307C09J133/04C09J133/08
Inventor M·A·凯塞迈耶J·L·里查德
Owner ROHM & HAAS CO