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Bonding device and bonding tool

A welding tool and welding equipment technology, applied in welding equipment, non-electric welding equipment, manufacturing tools, etc., can solve problems such as frequent temperature changes and achieve the effect of stabilizing vibration characteristics

Active Publication Date: 2006-05-24
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the contact pressure with which the heater is pressed against the inner surface of the mounting hole is not always constant and frequently changes due to temperature changes or the unfastened state of the fastening device
Therefore, the stiffness distribution of the entire arm sometimes changes, so stable vibration characteristics may not be maintained as desired

Method used

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  • Bonding device and bonding tool
  • Bonding device and bonding tool
  • Bonding device and bonding tool

Examples

Experimental program
Comparison scheme
Effect test

no. 2 example

[0056] Figure 4 is a front sectional view of a welding tool according to a second embodiment of the present invention. According to the second embodiment, in the welding tool 141 having the same shape and the same shape structure as the welding tool 14 shown in the first embodiment, in the machine arm 151, a substantially symmetrical arrangement is installed than that of the first embodiment. The heater 18 is larger or the same as the heater 18A. At this time, the heater 18A is provided at a portion corresponding to the antinode portion of the vibration of the arm 151 .

[0057] exist Figure 4Among them, in the machine arm 151, a mounting hole 151e having a circular cross-section is provided along the longitudinal direction (first direction) from the right side end face to the part before the suction hole 16c. In the mounting hole 151e, a heater 18A as a rod-shaped heating device is inserted in the longitudinal direction. The function and mounting method of the heater 18...

no. 3 example

[0060] Figure 5 is a front sectional view of a welding tool according to a third embodiment of the present invention. In the first and second embodiments, an example of a closed side-mounted type welding tool is shown in which the arm is fixed and supported at a plurality of support positions in the longitudinal direction. However, the present invention is not limited to closed side-mounted type welding tools, but can be applied as Figure 5 Open side mounted welding tool shown.

[0061] exist Figure 5 Among them, the open side-mounted welding tool 142 has a structure in which the right side portion is cut off from the protruding portion 30 in the welding tool 141 shown in the second embodiment. Similar to the case of the closed-side-mounted welding tool, the welding tool 142 is fixed and supported at a position corresponding to a node of the standing wave, and has a structure in which the welding operation portion 31 is arranged at a position corresponding to an antinode...

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Abstract

A welding apparatus is used to weld an object to be welded to a surface to be welded under pressure by applying a load and vibration to the object to be welded. The welding device includes a welding tool (14) adjacent to an object to be welded and a pressing unit for pressing the welding tool to the object to be welded. The welding tool comprises a transversely extended machine arm; a vibrator (17) applying longitudinal vibration to the machine arm (15) in a first direction along the longitudinal direction of the machine arm; along a second direction substantially perpendicular to the first direction a protruding portion (30) protruding; a welding operation portion (31) provided at the end of the protruding portion (30) so as to be adjacent to an object to be welded; and inserted into a mounting hole provided in the machine arm a heating unit. The heating unit is mounted into the mounting hole with a gap maintained from an inner surface of the mounting hole.

Description

technical field [0001] The present invention relates to a bonding device and a bonding tool for electronic components, which are used for bonding an object to be soldered, such as an electronic component, to a surface to be soldered, thereby being soldered to, for example, a board on the electrodes. Background technique [0002] As a method of soldering an object to be soldered such as an electronic component to a surface to be soldered so as to be soldered to, for example, an electrode on a board, a method of welding using ultrasonic pressure is well known. According to this method, while pressing the electronic part on the surface to be soldered, ultrasonic vibration is applied to the electronic part to locally vibrate the surface to be soldered and bring the surface to be soldered into close contact with the electronic part. The soldering tool used in this method has an elongated horn for transmitting vibrations from a vibration generating source to electronic components...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K20/10H01L21/60H01L21/607
CPCB23K20/10H01L24/75H01L24/81H05K3/00
Inventor 桧作雅史高桥诚司
Owner PANASONIC CORP