Surface mounted semiconductor electronic parts and producing method

Abstract

This invention provides a method for installing surface mounting semiconductor electronic components on a surface of an electrode welded on the base board and the electronic components processed by this method, which conducts the conductor graphs set on both sides of the insulation base board with through-holes with metallic conducting films formed on the internal wall to form a double-side through-hole PCB filling the through-hole and with the open-end of the through-hole covered by two erosion layers, at the same time, LED bare chips and photic bare chips are fixed on the conductor graphs connecting to the through-holes and the lower electrodes of the bare chips are connected with the graphs, the upper electrodes are connected with the conductor graphs separating from the conductor graphs with the bare chips and connected with the through-hole via leads and transmission resin is used to cover the chips and leads for sealing.

Description

technical field [0001] The present invention relates to a method of manufacturing a surface mount type semiconductor electronic component, and more particularly to a surface mount method having a process of pressing a fluid resin into a molding die provided with a printed circuit board on which a semiconductor bare chip is placed, and sealing the semiconductor bare chip with resin. A method of manufacturing a type semiconductor electronic component and a surface mount type semiconductor electronic component. Background technique [0002] Patent Document 1 JP-A-11-74410 (pp. 4-6, figure 1 ) [0003] Patent Document 2 Japanese Unexamined Patent Publication No. 8-213660 (pages 4-8, figure 1 , Figure 8) [0004] Patent Document 3 Japanese Unexamined Patent Publication No. 9-181359 (pages 2-3, figure 1 ) [0005] In recent years, in accordance with the miniaturization and weight reduction of electronic equipment, miniaturization and surface-mounting of electronic components ...

AI Technical Summary

Problems solved by technology

In addition, compared with the three-dimensional welding part connecting the unfilled half-through hole and the electrode pad in the planar soldering part with only the electrode pad, the extension of the flux and solder is insufficient, which may cause poor soldering performance. deterioration

[0010] In addition, remove the conductor pattern on the solder surface at the position where the through hole of the printed circuit board with conductor patterns formed on both sides is located, use a laser or a drilling machine to open a hole reaching the conductor pattern, and pass electroplating on the inner peripheral surface of the hole. In the method of forming a metal conductive film to form a through hole, the process of removing the conductor pattern is required in the process of manufacturing the printed circuit board, and in order to obtain multiple electronic components on one printed circuit board, multiple electronic components are provided on the printed circuit board. It takes a lot of time to form these holes by using a laser, and when forming the holes for the through holes by a drill, it is required to carry out such that the teeth of the drill do not penetrate the conductor pattern and the insulation of the printed circuit board does not remain on the surface. In the processing of conductor patterns, when considering the depth setting of holes, reproducibility, and the work accuracy required to meet these requirements, the yield of products becomes a major issue.

Therefore, when forming through-holes by these methods, the time and labor involved in the processing man-hour increase and the increase in product cost due to the decrease in the yield of the finished product becomes a problem.

Also, the burr generated when cutting the through hole prevents the solder from rising to the electrode pad provided in the direction perpendicular to the through hole, so that the solder cannot sufficiently flow over the entire surface of the electrode pad, and there is a problem of causing soldering with weak fixing strength.

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