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Method for manufacturing multi-circuit element wafer with concave end electrode and its completed product

A manufacturing method and terminal electrode technology, which are applied in the manufacturing of electrical components, resistor terminals/electrodes, semiconductor/solid-state devices, etc., can solve the problems of increasing the probability of defective products and narrowing the spacing of limited perforations.

Inactive Publication Date: 2006-06-21
TA I TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the formation of the terminal electrodes 136 of the multi-resistor chip in the past, the metal layer will extend laterally toward the through holes 133, and the distance between the limited through holes 133 will be reduced, resulting in an increased probability of defective products.

Method used

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  • Method for manufacturing multi-circuit element wafer with concave end electrode and its completed product
  • Method for manufacturing multi-circuit element wafer with concave end electrode and its completed product
  • Method for manufacturing multi-circuit element wafer with concave end electrode and its completed product

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Embodiment Construction

[0030] In order to avoid the problems in the past, the manufacturing method of the multi-circuit element wafer with recessed terminal electrodes of the present invention is changed to form electrodes at the through holes, and when forming side electrodes, the side wall surface between the two electrodes is covered so that it is not exposed, so that it cannot be used for subsequent electroplating terminals. Metal is deposited at the time of electrodes, and the insulation distance between electrodes can be ensured.

[0031] In the following, with Figure 8 A method for manufacturing a multi-circuit element wafer in this embodiment will be described.

[0032] First, a substrate 3 is provided in step 21 . Such as Figure 9 and Figure 10 A plurality of longitudinal dividing lines 31 and a plurality of transverse dividing lines 32 perpendicular to the longitudinal dividing lines 31 are extended on the upper surface of the substrate 3 to divide into a plurality of bases 4 arrange...

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Abstract

The manufacture method for a multi-circuit elements wafer with depressed-end electrode comprises: providing a substrate with some conductive zones parallel and separate extended from left to right on top surface, arranging a hole through top to bottom surface on every conductive zone end; spattering to form a metal film on wall surface with hole as a protection layer on substrate top surface to cover the middle zone of conductive zones and plating base body, and forming the end electrode to keep a distance between near electrodes.

Description

technical field [0001] The invention relates to a manufacturing method of a multi-circuit element wafer and its finished product, in particular to a manufacturing method of a multi-circuit element wafer with recessed terminal electrodes and its finished product. Background technique [0002] A multi-circuit element chip is a single chip in which several circuit elements are arranged side by side, such as a multi-resistor chip and a multi-capacitance chip. These circuit elements are not electrically connected to each other, but each has two electrodes for connecting to the outside world, so that the multi-circuit element chip has a plurality of electrodes. [0003] Such as figure 1 and figure 2 In the past, multi-resistor chips are formed on a ceramic substrate 1 . The ceramic substrate 1 is planned with a plurality of longitudinal dividing lines 11 and transverse dividing lines 12 to divide into a plurality of ceramic substrates 13 arranged in matrix. The upper surface ...

Claims

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Application Information

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IPC IPC(8): H01C7/00H01C1/14H01C17/06H01C17/28H01G4/005H01G4/33H01L21/28H01L21/44H01L27/01
Inventor 凌溢骏江财宝
Owner TA I TECH