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Camera module with minimized defects caused by dirt particles on optical filter

A technology of camera modules and dust particles, which is applied in the direction of cameras, camera bodies, and optical filters for photography, etc., and can solve the problems that the camera module 200 cannot pass the quality control, hinders the light reception of the image sensor 252, has defects, etc.

Inactive Publication Date: 2006-08-02
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] However, there is a problem with the conventional camera module 200 as described above in that when the filter 270 is mounted on the flexible substrate 220, dust and dust particles K inevitably stick to the filter 270, thereby obstructing the image sensor 252. light receiving
[0012] As a result, in light reception, due to dust and dust particles K, the corresponding pixel 250a appears defective, and the camera module 200 having the defective pixel 250a will fail the quality control
Therefore, there is a problem in that a large number of defective products are produced

Method used

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  • Camera module with minimized defects caused by dirt particles on optical filter
  • Camera module with minimized defects caused by dirt particles on optical filter
  • Camera module with minimized defects caused by dirt particles on optical filter

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Embodiment Construction

[0022] Preferred embodiments of the present invention will now be explained in more detail with reference to the accompanying drawings.

[0023] refer to Figure 3a , Figure 3b ,with Figure 4a to Figure 4c , shows a cross-sectional view of a camera module according to the invention which minimizes defects caused by dust particles on its filter. It can be seen that the camera module of the present invention indicated by reference number 1 includes: a flexible substrate 10 with a pattern portion 10a; an image sensor unit 20 mounted on an end region of the flexible substrate 10; a lens unit 30 fixed on the flexible substrate 10 to introduce light into the image sensor unit 20 .

[0024] The lens unit 30 is surrounded by a housing 32 such that a plurality of lenses 37 are placed inside the housing 32 . The filter 40 is disposed in the lens unit 30 to intercept light of a specific wavelength among the light introduced into the lens unit 30 .

[0025] In the present invention...

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Abstract

Disclosed herein is a camera module with minimized defects caused by dirt particles on an optical filter for use in digital optical instruments. The camera module comprises a flexible substrate having a patterned portion, an image sensor unit mounted to an end region of the flexible substrate, a lens unit fixed to the flexible substrate and having a plurality of lenses to introduce light to the image sensor unit, an optical filter arranged in the lens unit to intercept specific wavelengths of the light that is being introduced into the lens unit, and a filter spacer located between the optical filter and the image sensor unit to distance the optical filter from the image sensor unit, so that dirt particles adhered to the optical filter are distanced from pixels of the image sensor unit so as not to shield an angle of view of the pixels.

Description

[0001] This application is based on and claims priority from Korean Application No. 2005-8217 filed on January 28, 2005, the entire contents of which are hereby disclosed by reference. technical field [0002] The present invention relates to a camera module for use in a digital optical instrument, and more particularly, to a camera module with a minimum of defects caused by dust particles on an optical filter, wherein the optical filter is connected to an image sensor Spaced apart to prevent the dust particles adhering to the filter from blocking the viewing angle of the pixels provided on the image sensor when the filter is assembled on the flexible substrate, so that defective products due to dust particles can be prevented Minimal and can increase the productivity of the camera module while reducing the manufacturing cost. Background technique [0003] Many cellular phone manufacturers are now developing and manufacturing ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03B17/02G03B11/00H04N5/225H04M1/02H01L27/14H04N5/335
CPCH04N5/2254H04N5/2253H04N23/52H04N23/54H04N23/55E04G21/3223E04G21/3266
Inventor 丁禹植
Owner SAMSUNG ELECTRO MECHANICS CO LTD