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Piezoelectric device and method of producing the same

A technology for piezoelectric devices and manufacturing methods, which is applied to electrical components, impedance networks, etc., and can solve problems such as unfavorable thinning of piezoelectric devices, damage to excitation electrodes, and unstable reference planes for crystal wafer installation.

Inactive Publication Date: 2006-08-16
CITIZEN WATCH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is due to the instability of the installation reference surface of the crystal element, such as nozzle suction, etc. during installation.
[0007] In addition, even if the piezoelectric blank can be installed on the insert, it is necessary to set the upper and lower gaps of the piezoelectric blank in the insert to be larger, which is not conducive to the thinning of the piezoelectric device.
[0008] Moreover, since the excitation electrode part near the center of the piezoelectric blank is made into a flat plate or close to a flat plate shape, if the vicinity of the center is adsorbed by the suction nozzle, the piezoelectric blank can be kept substantially stable in a horizontal state, but it is possible Damage the excitation electrode installed on the piezoelectric blank by adsorption of this part

Method used

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  • Piezoelectric device and method of producing the same
  • Piezoelectric device and method of producing the same
  • Piezoelectric device and method of producing the same

Examples

Experimental program
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Embodiment Construction

[0025] First, refer to figure 1 Referring to FIG. 3 , the configuration of a crystal vibrator as an embodiment of the piezoelectric device of the present invention will be described. A crystal vibrator 1 includes a rectangular crystal plate 2 in plan view as a piezoelectric blank, an insert 3 made of ceramics, and a cover member 5 for closing the insert.

[0026] As shown in FIG. 3 , the crystal plate 2 is a rectangle whose vibration displacement direction is the long side (dimension p) and the side at right angles to it is the short side (dimension q) in plan view. One surface UF (hereinafter referred to as the upper surface) of the crystal plate 2 is a flat surface, and the other surface LF (hereinafter referred to as the lower surface) forms a tapered arcuate shape whose thickness becomes thinner toward the tip at both ends in the longer direction. In addition, in FIG. 3, a plurality of circular arcs c represent contour lines.

[0027] An excitation electrode 21 is instal...

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PUM

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Abstract

The invention relates to a piezoelectric element and a manufacture method thereof. A piezoelectric element plate is rectangular as seen from above, and the upper surface thereof is formed to be flat, while the lower surface thereof has a beveling arc applied thereto. The piezoelectric element plate is mounted on a package by adsorbing one longitudinal end of its upper surface (flat surface) by an adsorbing nozzle. Then, ultrasonic waves are applied through the adsorbing nozzle to a bump positioned between the package and one longitudinal end of the lower surface of the piezoelectric element plate, while pressing the piezoelectric element plate against the package by the adsorbing nozzle, whereby the piezoelectric element plate is joined to the package.

Description

technical field [0001] The present invention relates to a piezoelectric device useful for ultrasonic bonding and a manufacturing method thereof. Background technique [0002] For a long time, in response to the miniaturization or thinning of electronic equipment, the density of electronic circuits has also increased. Electronic components mounted on circuit printed circuit boards are suitable for thin and high-density installations, and other general electronic components Also being miniaturized, a large number of surface mount components (Surface Mounting Devices; SMD) that can only be soldered on one side of a circuit printed circuit board appear. In recent years, along with the popularization of portable communication devices and the like, more and more electronic components have been reduced in size and weight, and cost reduction has been strongly demanded. [0003] Piezoelectric devices also require small SMD products for the same reason. In the conventional method of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/19H03H9/02H03H3/02H03H9/05H03H9/10H03H9/13
CPCH03H9/19H03H9/1021
Inventor 村田一男
Owner CITIZEN WATCH CO LTD