Work cutting device and work cutting method
A technology for cutting devices and workpieces, which is applied to fine working devices, manufacturing tools, stone processing equipment, etc., can solve the problems of flatness accuracy (deterioration of cutting accuracy, etc.), achieve low cost, stable high precision, and reduce the position of the cutting edge effect of change
Active Publication Date: 2010-05-12
HITACHI METALS LTD
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- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
When the cutting resistance increases, the thin inner peripheral blade warps toward the platen, changing the position of the cutting edge, and degrading the flatness (cutting accuracy) of the cut surface of the cut product.
Method used
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Embodiment Construction
[0052] Embodiments of the present invention will be described below with reference to the drawings.
[0053] refer to figure 1 and figure 2 , an embodiment of the workpiece cutting device 10 of the present invention, the workpiece cutting device 10 is provided with an inner peripheral blade 32 (described below) in the longitudinal direction, and a workpiece 66 (described below) is sent to the inner peripheral blade 32 of the rotation. ) and cut off.
[0054] The workpiece cutting device 10 includes a base 12 . A rotation support portion 14 is provided on the base 12 . A rotating shaft 18 fixed to the chuck body 16 is inserted into this rotating support portion 14 , and the rotating shaft 18 is supported by bearings 20 and 22 . The chuck body 16 is thus rotatably supported.
[0055] Such as figure 2 As shown in (a), a transmission pulley 24 is attached to the rotation shaft 18 in the rotation support portion 14 . In addition, a rotating shaft motor 26 is installed in t...
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Abstract
This invention provided a work cutting device (10) and a work cutting method capable of stably and accurately cutting a work (66) by a simple structure. In the work cutting device (10), the work (66)is disposed by a layout part (59) so as to be cut off by an inner periphery cutter blade (32). The slide table (54) of a moving part (53) supporting the layout part (59) is movably towed by a fallingweight (70) to feed the work (66) to the rotating inner periphery cutter blade (32). A projected part (56) formed on the bottom face of the slide table (54) of the moving part (53) and the control plate (82) of a speed suppressing means (76) are moved in the direction (of arrow B) of a feed stopper (84) while coming into contact with each other. The moving speed of the control plate (82) is slowerthan the moving speed of the slide table (54) by the towing of the weight (70), and the slide table (54) feeds the work (66) to the inner periphery cutter blade (32) while its moving speed is suppressed until the work (66) is brought into contact with the edge (32b) of the inner periphery cutter blade (32).
Description
technical field [0001] The present invention relates to a workpiece cutting device and a workpiece cutting method, and more particularly to a workpiece cutting device and a workpiece cutting method which use an inner peripheral blade to cut a workpiece. Background technique [0002] In the past, in order to cut thin wafers from workpieces such as silicon ingots or gallium arsenide ingots, an inner peripheral blade cutting device was used to make a thin platen with a hollow disc shape and a thin platen on the inner edge of the platen. The inner peripheral blade provided with cutting edge rotates at high speed to cut the workpiece. There is an advantage that a thin product can be obtained with a high yield by cutting using an inner peripheral blade cutting device. [0003] In such an inner peripheral blade cutting device, the workpiece is fed to the rotating inner peripheral blade, or the rotating inner peripheral blade is fed to the workpiece to perform cutting processing. ...
Claims
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IPC IPC(8): B28D5/02
CPCB28D5/028
Inventor 近藤祯彦仲村刚小川亘宫垣和幸
Owner HITACHI METALS LTD