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Module of heat elimination, and method for controlling radiating wind rate

A heat dissipation module and air volume control technology, which is applied in the direction of flow control of electrical devices, cooling/ventilation/heating transformation, etc., can solve the problems of insufficient heat dissipation effect of high-calorie heat sources

Inactive Publication Date: 2010-05-05
QUANTA COMPUTER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the difference between the first operating temperature T1 and the second operating temperature T2, the cooling effect of the cold air on the high-calorie heat source is insufficient.

Method used

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  • Module of heat elimination, and method for controlling radiating wind rate
  • Module of heat elimination, and method for controlling radiating wind rate
  • Module of heat elimination, and method for controlling radiating wind rate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] Table 1 is image 3 The temperature ratio look-up table of the control method;

[0016] Table 2 is image 3 The temperature difference look-up table for the control method in .

[0017] Please refer to Figure 2A , which is a schematic block diagram of an electronic device according to a preferred embodiment of the present invention. The electronic device 200 is, for example, a notebook computer, a desktop computer, a projector, a server, or a power supply. exist Figure 2A Among them, the electronic device 200 includes a first heat source 210 , a first fin 210 a , a second heat source 220 , a second fin 220 a , a heat dissipation module 230 and a control unit 240 . In this embodiment, the first heat source 210 is a central processing unit (CPU), including a first temperature sensing element 211 ; the second heat source 220 is a chipset, including a second temperature sensing element 222 . The cooling module 230 includes blades 231 , a housing 232 and a first air ...

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PUM

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Abstract

The cooling module is used to be installed in an electronic device. The electronic device has a first heat source and a second heat source. The cooling module at least comprises a first vent, a secondvent and a first blast regulator. The first vent provides a first blast at the first heat source, and the second vent provides a second blast at the second heat source. The first blast regulator is located at the first vent for adjusting the blast according to the temperature of the first heat source and the second heat source.

Description

technical field [0001] The invention relates to a heat dissipation module and a method for controlling the heat dissipation air volume thereof, in particular to a heat dissipation module for adjusting the heat dissipation air volume according to the temperatures of two or more different heat sources and a method for controlling the heat dissipation air volume. Background technique [0002] In today's era of rapid technological development, all kinds of electronic products bring convenience to life and are widely used in daily life. For example, for electronic products such as notebook computers, desktop computers, servers, and power supplies, the heat dissipation effect will directly affect the performance of electronic products. The heat source is usually a central processing unit (Central Processing Unit, CPU), a hard disk, a chipset, or a light bulb. As electronic products tend to be thinner and shorter, heat energy cannot be effectively dissipated in a limited space, an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20G05D7/06
Inventor 刘湘肇
Owner QUANTA COMPUTER INC