Fuse and method for disconnecting the fuse
A technology of fuses and contact parts, applied in electrical components, electric solid state devices, circuits, etc., can solve problems such as difficulty in judging the disconnection of fuses
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no. 1 example
[0032] A fuse and a method of breaking it according to a first embodiment of the present invention will be described with reference to FIGS. 1-6B.
[0033] FIG. 1 is a plan view of the fuse according to the present embodiment. FIG. 2 is a diagrammatic sectional view of the fuse according to the present embodiment. FIG. 3 is a circuit diagram of an example of a fuse circuit. FIG. 4 is a diagrammatic sectional view showing a method of disconnecting a fuse according to the present embodiment. 5A-5C and 6A-6B are cross-sectional views of the fuse in steps of a method of manufacturing the fuse according to the present embodiment.
[0034] First, the structure of the fuse according to the present embodiment will be described with reference to FIGS. 1 and 2 .
[0035] Device isolation film 12 defining an active region is formed in the main surface of silicon substrate 10 . An interconnection portion 14 of polysilicon is formed on the device isolation film 12 . An interlayer insu...
no. 2 example
[0065] A fuse and a method of disconnecting the fuse according to a second embodiment of the present invention will be described with reference to FIGS. 7 and 8 . The same components as those of the fuse according to the first embodiment of the present invention shown in FIGS. 1-6 are denoted by the same reference numerals, and the description thereof will not be repeated or simplified.
[0066] Fig. 7 is a diagrammatic sectional view of the fuse according to the present embodiment. Fig. 8 is a diagrammatic sectional view showing another method of disconnecting the fuse according to the present embodiment.
[0067] First, the structure of the fuse according to the present embodiment will be described with reference to FIG. 7 .
[0068] Device isolation film 12 defining an active region is formed in the main surface of silicon substrate 10 . An interconnection portion 14 of a polysilicon-metal silicide structure composed of a polysilicon film 24 and a metal silicide film 26 o...
no. 3 example
[0079] A fuse and a method of disconnecting the fuse according to a third embodiment of the present invention will be described with reference to FIGS. 9 and 10 . The same components as those of the fuse according to the first and second embodiments shown in FIGS. 1-8 are denoted by the same reference numerals, and descriptions thereof are not repeated or simplified.
[0080] Fig. 9 is a plan view of the fuse according to the present embodiment. Fig. 10 is a diagrammatic sectional view of the fuse according to the present embodiment.
[0081] Device isolation film 12 defining an active region is formed in the main surface of silicon substrate 10 . An interconnection portion 14 of a polysilicon-metal silicide structure composed of a polysilicon film 24 and a metal silicide film 26 on the polysilicon film 24 is formed on the device isolation film 12 . The width of one end (the right end in the figure) of the interconnection portion 14 is larger than the width of the other end ...
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