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Fuse and method for disconnecting the fuse

A technology of fuses and contact parts, applied in electrical components, electric solid state devices, circuits, etc., can solve problems such as difficulty in judging the disconnection of fuses

Inactive Publication Date: 2007-03-14
FUJITSU SEMICON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the resistance of the fuse part increases by up to about 10 times, so it is difficult to judge the disconnection of the fuse

Method used

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  • Fuse and method for disconnecting the fuse
  • Fuse and method for disconnecting the fuse
  • Fuse and method for disconnecting the fuse

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0032] A fuse and a method of breaking it according to a first embodiment of the present invention will be described with reference to FIGS. 1-6B.

[0033] FIG. 1 is a plan view of the fuse according to the present embodiment. FIG. 2 is a diagrammatic sectional view of the fuse according to the present embodiment. FIG. 3 is a circuit diagram of an example of a fuse circuit. FIG. 4 is a diagrammatic sectional view showing a method of disconnecting a fuse according to the present embodiment. 5A-5C and 6A-6B are cross-sectional views of the fuse in steps of a method of manufacturing the fuse according to the present embodiment.

[0034] First, the structure of the fuse according to the present embodiment will be described with reference to FIGS. 1 and 2 .

[0035] Device isolation film 12 defining an active region is formed in the main surface of silicon substrate 10 . An interconnection portion 14 of polysilicon is formed on the device isolation film 12 . An interlayer insu...

no. 2 example

[0065] A fuse and a method of disconnecting the fuse according to a second embodiment of the present invention will be described with reference to FIGS. 7 and 8 . The same components as those of the fuse according to the first embodiment of the present invention shown in FIGS. 1-6 are denoted by the same reference numerals, and the description thereof will not be repeated or simplified.

[0066] Fig. 7 is a diagrammatic sectional view of the fuse according to the present embodiment. Fig. 8 is a diagrammatic sectional view showing another method of disconnecting the fuse according to the present embodiment.

[0067] First, the structure of the fuse according to the present embodiment will be described with reference to FIG. 7 .

[0068] Device isolation film 12 defining an active region is formed in the main surface of silicon substrate 10 . An interconnection portion 14 of a polysilicon-metal silicide structure composed of a polysilicon film 24 and a metal silicide film 26 o...

no. 3 example

[0079] A fuse and a method of disconnecting the fuse according to a third embodiment of the present invention will be described with reference to FIGS. 9 and 10 . The same components as those of the fuse according to the first and second embodiments shown in FIGS. 1-8 are denoted by the same reference numerals, and descriptions thereof are not repeated or simplified.

[0080] Fig. 9 is a plan view of the fuse according to the present embodiment. Fig. 10 is a diagrammatic sectional view of the fuse according to the present embodiment.

[0081] Device isolation film 12 defining an active region is formed in the main surface of silicon substrate 10 . An interconnection portion 14 of a polysilicon-metal silicide structure composed of a polysilicon film 24 and a metal silicide film 26 on the polysilicon film 24 is formed on the device isolation film 12 . The width of one end (the right end in the figure) of the interconnection portion 14 is larger than the width of the other end ...

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Abstract

The fuse comprises an interconnection part 14 luding a silicon layer; a contact part 20b connected one end of the interconnection part 14; and a contact part 20aconnected to the other end of the interconnection part 14 and containing a metal material. A current is flowed from the contact part 20bto the contact part 20a to migrate the metal material of the contact part 20a to the silicon layer to thereby change the contact resistance between the interconnection part 14 and the contact part 20a.

Description

technical field [0001] The present invention relates to a fuse and a method of opening the fuse, and more particularly to a fuse capable of electrically opening and reconfiguring a circuit and a method of opening the fuse. Background technique [0002] Semiconductor devices such as memory devices of DRAM, SRAM, or logic devices contain a large number of devices, and some circuits or memory cells often do not work properly due to various factors in the manufacturing process. In this case, if a defective part of the circuit or memory cell makes the entire device defective, the manufacturing yield will be reduced, leading to an increase in manufacturing cost. In order to prevent this from happening, recently in semiconductor devices, defective circuits or defective memory cells are converted into redundant circuits or redundant memory cells to make the circuits or memory cells normal, thereby saving defective semiconductor devices . [0003] Some semiconductor devices include...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/525H01L21/768
CPCH01L2924/0002H01L23/5256H01L2924/00Y02B20/40
Inventor 大冢敏志泽田丰治须贺真人长山准佐藤元伸铃木贵志
Owner FUJITSU SEMICON LTD
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