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Aqueous edge bead remover

A technology of scavenger and edge glue, which is applied in the photoplate making process of patterned surface, microlithography exposure equipment, instruments, etc., can solve the problems of toxicity and ecological unpleasantness

Inactive Publication Date: 2007-05-16
AZ ELECTRONICS MATERIALS USA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such compositions are often very toxic, ecologically undesirable and / or have an unpleasant odor as well as cause swelling of the photoresist film in the areas where the solvent-based edge bead composition is applied

Method used

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  • Aqueous edge bead remover

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Embodiment Construction

[0016] The present invention provides edge bead remover compositions comprising, or more specifically consisting essentially of, a solution of a basic compound at a concentration of about 0.5 to about 8 normal. The basic compound may be selected from ammonium hydroxide, organic amines, alkali metal compounds, alkaline earth metal compounds and mixtures thereof. The compositions of the present invention may further comprise nonionic surfactants. Embodiments include nonionic surfactants selected from the group consisting of: (i) HO(EO) a (PO) b (EO) a H, where EO is ethylene oxide, PO is propylene oxide (CH-(CH 3 )-CH 2 -O or CH 2 -CH(CH 3 )-O), a is about 1-about 140, b is about 5-about 100; (ii) HO(PO) b (EO) a (PO) b H, wherein EO, PO, a and b are as defined in (i); (iii) R-[O-(AO) n ] m -H, wherein AO is an oxyalkylene unit selected from EO and PO; n is at least about 5 and m is 1-3; and (iv) mixtures thereof.

[0017] In addition, the present invention also prov...

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Abstract

The present invention relates to an edge bead remover composition for a photoresist composition disposed as a film on a surface comprising from about 0.5 to about 8 Normal solution of a basic compound.

Description

Background of the invention [0001] The present invention relates generally to the field of microelectronic devices such as integrated circuits, and more particularly to compositions and methods for removing photoresist compositions from the surface of substrates such as silicon wafers used in the manufacture of integrated circuits. In its most specific aspect, the invention relates to compositions and methods for removing unwanted edge residues of photoresist compositions from wafers that have been spun-coated with photoresist. [0002] Broadly speaking, the fabrication of integrated circuits involves the steps of preparing a polished silicon wafer substrate, imaging integrated circuit pattern geometries on various wafer surfaces, and producing the desired pattern on the wafer. [0003] The imaging method involves the use of a photoresist applied to the surface of the wafer. A photoresist is a composition that changes in response to light of a specific wavelength such that th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F7/16G03C5/00
CPCG03F7/2028G03F7/168
Inventor R·R·达米尔S·迈耶M·A·斯帕克
Owner AZ ELECTRONICS MATERIALS USA CORP