Solder bonding structure using a bridge type pattern

Abstract

Disclosed is a solder bonding structure for flip chip connection. Particularly, this invention relates to a solder bonding structure, in which the shape of a connection pad on which solder is applied is changed to thus increase the size of the solder bond that is formed using a reflow process, resulting in highly reliable solder bonding. To this end, the solder bonding structure is composed of a connection pad (a bridge type pattern) composed of at least two pattern regions spaced apart from each other by a predetermined interval, a solder bond formed on the connection pad having such a shape, and a metal bump in contact with the solder bond. In such a solder bonding structure, the solder bond is formed to a sufficient size on a fine pattern having a smaller width, thus achieving reliable solder bonding between the semiconductor chip having the metal bump and the printed circuit board having the connection pad. Further, since the connection pad may be realized through a typical formation process thereof without the need for an additional process, the reliability of the solder bonding may be sufficiently assured without an increase in the working man-hours or in the number of processes.

Description

[0001] Related Application Cross Reference [0002] This application claims the benefit of Korean Patent Application No. 10-2005-0118288, filed Dec. 6, 2005, entitled "Solder bonding structure using solder bridge pattern," the entire contents of which are incorporated in This is for reference. technical field [0003] The present invention generally relates to a solder bonding structure for flip chip connection, and in particular, to a solder bonding structure in which the shape of the connection pads to which the solder is applied is changed into a solder bridge type pattern, thus The size of the solder joint formed by using the reflow process is increased, thereby realizing high-reliability solder joint. Background technique [0004] For flip-chip mounting of electronic components such as semiconductor chips, paste-like flux is applied to connection pads (i.e., circuit patterns) of a printed circuit board (PCB) on which semiconductor chips are mounted, followed by a reflo...

AI Technical Summary

Problems solved by technology

[0014] As noted above, the formation of the curved extensions results in a connection pad having similar results to that obtained from a connection pad enlarged to a size that includes the curved extension along its entire length, thus undesirably increasing flux flux. consume

In addition, in order to form such a structure, since it is necessary to perform a series of processes of applying a solder mask and then forming another pattern (such as a curved extension), the manufacturing process is complicated, and the length of working time and man-hours are increased.

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