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Atmosphere forming method of tin welding device and atmosphere forming device

A soldering and atmosphere technology, applied in auxiliary devices, welding media, welding equipment, etc., can solve the problem of not easy to form stable oxygen concentration in soldering devices

Active Publication Date: 2011-04-13
TAMURA KK +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] These control methods and control devices individually control the flow rate of air variablely, so there is a problem that it is not easy to form an atmosphere with a stable oxygen concentration in the soldering device.

Method used

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  • Atmosphere forming method of tin welding device and atmosphere forming device
  • Atmosphere forming method of tin welding device and atmosphere forming device
  • Atmosphere forming method of tin welding device and atmosphere forming device

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Embodiment Construction

[0032] Below, refer to Figure 1 to Figure 15 The illustrated embodiments illustrate the invention in detail.

[0033] First, explain Figure 1 ~ Figure 3 The first embodiment shown.

[0034] Such as figure 2 As shown, the area 1, the area 2, the area 3, the area 4, the area 5, the area 6, the area 7, the area 8, and the area 9 are separately formed inside the reflow soldering apparatus 11.

[0035] Through each area 1-9 of this soldering device 11, a circuit board conveyor 12 is arranged from the entrance of one end of the device to the exit of the other end of the device. ").

[0036] Areas 1 to 5 are preheating areas for preheating the circuit board, areas 6 and 7 are reflow areas for reflow heating the circuit board, and heaters for hot air generation are respectively installed in these areas 1 to 7 (in the figure not shown) and fan (not shown). In addition, areas 8 and 9 are cooling areas for cooling the circuit board after reflow, and cooling fans are provided.

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Abstract

The invention provides an atmosphere forming method for forming the atmosphere having a stable oxygen concentration in a tin soldering device. Air is mixed with N2 according to a determined radio to generate an air / N2 mixture having a special oxygen concentration (step 1); the air / N2 mixture having a special oxygen concentration is supplying to the tin soldering device in a definite amount (step 2). Then the oxygen concentration in the tin soldering device can be stably controlled based on the special lower oxygen concentration without using a detector (oxygen concentration meter) for detecting the oxygen concentration of the soldering device, because of supplying the air / N2 mixture having a special oxygen concentration to the tin soldering device in a definite amount.

Description

technical field [0001] The present invention relates to an atmosphere forming method and an atmosphere forming device for forming a low-oxygen-concentration atmosphere in a soldering device which is heated in a low-oxygen-concentration atmosphere. Background technique [0002] As a prior art for controlling the atmosphere of a soldering apparatus, there is, for example, a method for controlling the oxygen concentration in an inert atmosphere soldering apparatus (for example, refer to Patent Document 1). Soldering is carried out in an oxygen concentration atmosphere. In this oxygen concentration control method, the oxygen concentration in the atmosphere is measured in the inert atmosphere soldering device, and the injection flow rate of the inert gas is controlled in order to approach the desired oxygen concentration. The air whose flow rate has been adjusted is supplied to the atmosphere. [0003] In addition, there is an inert gas atmosphere control device (for example, re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/20B23K3/08B23K35/38B23K31/02
Inventor 山口崇仁吉田贤太朗山下文弘堂囿清志
Owner TAMURA KK