An ultrasonic sensor, an ultrasonic fingerprint identification module and an electronic device
By adding a metal layer to the pad area and improving the top electrode structure, the chip fragmentation problem in the bonding process of ultrasonic sensors was solved, improving production yield and enhancing sensor performance.
CN224354860UActive Publication Date: 2026-06-12CHIPSEMI SEMICON (NINGBO) CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHIPSEMI SEMICON (NINGBO) CO LTD
- Filing Date
- 2025-06-19
- Publication Date
- 2026-06-12
AI Technical Summary
⚠Technical Problem
Existing ultrasonic sensors pose a risk of chip fragmentation during the bonding process with circuit boards, resulting in low production yield.
⚗Method used
A first metal layer is added to the pad area to increase its toughness, and the fabrication process of the top electrode is improved through the two-layer metal layer structure to reduce the risk of fragmentation during the bonding process.
🎯Benefits of technology
This improved the production yield of bonding ultrasonic sensors to circuit boards and enhanced the sensor's sensitivity and signal bandwidth performance.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 1 Figure 2
Abstract
The utility model discloses related to the field of ultrasonic sensor, disclose an ultrasonic sensor, ultrasonic fingerprint identification module and electronic equipment. The utility model discloses an ultrasonic sensor includes: substrate, pad area, bottom electrode, piezoelectric layer and top electrode, bottom electrode sets up on the upper surface of substrate, piezoelectric layer sets up above substrate and covers bottom electrode, pad area sets up on the upper surface of substrate, and with bottom electrode interval arrangement, pad area on the first metal layer is provided, wherein, increase the pad area of first metal layer is used for bonding connection with external circuit board. Through setting up first metal layer on the pad area of originally, increase the toughness of pad area, increase the pad area of first metal layer for bonding connection with external circuit board, can play the role of stress buffering in the bonding process through first metal layer, thereby reduce the risk of fragmentation when pad area and external circuit board bonding connection, improve the production yield of module.
Need to check novelty before this filing date? Find Prior Art