A novel wafer carrier table assembly

Abstract

The utility model relates to a bearing table technical field discloses a novel wafer bearing table subassembly, including bearing piece tray, the bottom of bearing piece tray is provided with temperature control component, the below of temperature control component is provided with first insulating layer, when carrying out electrical property test to wafer, the setting of first insulating layer can realize the electrical isolation between inner shielding casing and temperature control component, bearing piece tray, avoid unnecessary electric interference, and inner shielding casing plays the shielding effect to internal temperature control component, bearing piece tray etc, reduces the influence of external electromagnetic environment to internal component, second insulating layer can realize the electrical isolation between inner shielding casing and outer shielding casing, prevents both conduction influence shielding effect, and outer shielding casing further strengthens the shielding performance of whole, resists external electromagnetic interference, protects internal structure simultaneously, and the whole common ground can be made by connecting post, and static electricity etc. harmful electric charge can be led away in time, avoid charge accumulation to cause damage to wafer, make electrical property test result more pure.

Description

Technical Field

[0001] This utility model relates to the field of wafer carrier technology, and in particular to a novel wafer carrier assembly. Background Technology

[0002] A wafer is a core material in the semiconductor industry, specifically referring to silicon wafers used to manufacture integrated circuits (ICs). It is a single-crystal silicon wafer made from silicon sand through multiple purification and processing steps. It is round in shape, hence the name wafer. Wafers are the basic raw material for manufacturing chips, while chips are semi-finished products that are cut from wafers after etching semiconductor devices (such as diodes, transistors, etc.).

[0003] In the existing technology, the shielding structure design of the carrier stage is relatively simple, often using only a single layer of shielding or the shielding material has insufficient performance, making it difficult to effectively block interference from the complex external electromagnetic environment. External electromagnetic signals can easily enter the carrier stage through spatial coupling, interfering with the wafers on the substrate and related test circuits, causing test signal distortion and seriously affecting the accuracy of test results. Utility Model Content

[0004] The purpose of this invention is to solve the problems existing in the prior art by proposing a novel wafer carrier stage assembly.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A novel wafer carrier stage assembly includes a wafer tray, the bottom of which is provided with a temperature control component;

[0007] A first insulating layer is provided below the temperature control component, and an inner shielding shell is provided below the first insulating layer. The first insulating layer, the temperature control component, and the support plate are sequentially arranged inside the inner shielding shell.

[0008] A second insulating layer is provided below the inner shielding shell, a heating component is provided on one side of the second insulating layer, an outer shielding shell is provided below the second insulating layer, and the second insulating layer and one side of the inner shielding shell are disposed inside the outer shielding shell;

[0009] The bottom of the outer shielding shell is provided with a connecting post, which enables the whole to be grounded.

[0010] Preferably, both the inner and outer shielding shells are integrally formed from alloy steel, and both the inner and outer shielding shells are plated with nickel.

[0011] Preferably, both the inner and outer shielding shells are cylindrical.

[0012] Preferably, the first insulating layer is integrally molded from polytetrafluoroethylene.

[0013] Preferably, the inner shielding shell has a plurality of wire holes, and each of the plurality of wire holes is provided with an insulating ring, the insulating ring being integrally formed of ceramic.

[0014] Preferably, the second insulating layer is integrally formed from ceramic to prevent the inner shielding layer and the outer shielding layer from conducting.

[0015] Preferably, the heating component is a heating element.

[0016] Preferably, the temperature control component includes a cold water pan disposed at the bottom of the plate plate, and an inlet connector and an outlet connector are provided on one side of the cold water pan for installing water circuit connectors and introducing cooling water to circulate in the cold water pan. The cold water pan is disposed inside the inner shielding shell.

[0017] Preferably, a plurality of bolts are provided on one side of the connecting column, and the plurality of bolts are movably threaded through the connecting column and screwed into the outer shielding shell.

[0018] Preferably, the support plate is integrally formed of aluminum alloy, and the surface of the support plate is plated with gold.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] This invention, by setting a temperature control component at the bottom of the wafer carrier, can effectively regulate the temperature of the wafer carrier to meet the temperature requirements of the wafer during processing, ensuring the stability and quality of wafer processing. When performing electrical performance testing on the wafer, the first insulating layer can achieve electrical isolation between the inner shielding shell and the temperature control component and the wafer carrier, avoiding unnecessary electrical interference. The inner shielding shell also shields the internal temperature control component and wafer carrier, reducing the impact of the external electromagnetic environment on internal components. The second insulating layer can achieve electrical isolation between the inner and outer shielding shells, preventing them from conducting and affecting the shielding effect. The outer shielding shell further enhances the overall shielding performance, resisting external electromagnetic interference while protecting the internal structure. The connecting post makes the whole system grounded, which can promptly conduct away harmful charges such as static electricity, avoiding charge accumulation that could damage the wafer and making the electrical performance test results purer. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a novel wafer carrier stage assembly proposed in this utility model.

[0022] Figure 2 This is a schematic diagram of the insertion of a novel wafer carrier stage assembly proposed in this utility model.

[0023] In the diagram: 1. Support plate; 2. First insulating layer; 3. Inner shielding shell; 4. Second insulating layer; 5. Outer shielding shell; 6. Connecting post; 7. Wire hole; 8. Insulating ring; 9. Heating element; 10. Cold water pan; 11. Inlet connector; 12. Outlet connector; 13. Bolt. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0025] Reference Figure 1 and Figure 2 A novel wafer carrier stage assembly includes a wafer tray 1, the bottom of which is provided with a temperature control component;

[0026] A first insulating layer 2 is provided below the temperature control component, and an inner shielding shell 3 is provided below the first insulating layer 2. The first insulating layer 2, the temperature control component, and the support plate 1 are sequentially arranged inside the inner shielding shell 3.

[0027] A second insulating layer 4 is provided below the inner shielding shell 3, a heating component is provided on one side of the second insulating layer 4, an outer shielding shell 5 is provided below the second insulating layer 4, and the second insulating layer 4 and one side of the inner shielding shell 3 are disposed inside the outer shielding shell 5.

[0028] The bottom of the outer shielding shell 5 is provided with a connecting post 6, which enables the whole to be grounded.

[0029] In use, this device effectively regulates the temperature of the wafer tray 1 by setting a temperature control component at the bottom of the tray 1, meeting the temperature requirements of the wafer during processing and ensuring the stability and quality of wafer processing. When performing electrical performance testing on the wafer, the first insulating layer 2 provides electrical isolation between the inner shielding shell 3 and the temperature control component and the wafer tray 1, avoiding unnecessary electrical interference. The inner shielding shell 3 shields the internal temperature control component and wafer tray 1, reducing the impact of the external electromagnetic environment on internal components. The second insulating layer 4 provides electrical isolation between the inner shielding shell 3 and the outer shielding shell 5, preventing them from conducting and affecting the shielding effect. The outer shielding shell 5 further enhances the overall shielding performance, resisting external electromagnetic interference and protecting the internal structure. The connecting post 6 grounds the entire device, allowing harmful charges such as static electricity to be conducted away in time, preventing charge accumulation from damaging the wafer and making the electrical performance test results purer.

[0030] Furthermore, both the inner shielding shell 3 and the outer shielding shell 5 are integrally formed from alloy steel, and both surfaces are plated with nickel. The integral forming of the inner and outer shielding shells ensures high structural strength and stability, preventing deformation and allowing for long-term stable shielding. Alloy steel itself possesses excellent shielding properties, effectively blocking electromagnetic signals. The nickel plating improves the shell's corrosion resistance, extending its service life. Simultaneously, the nickel layer enhances the electromagnetic shielding effect to a certain extent, ensuring long-term stability of the shielding performance.

[0031] Furthermore, both the inner shielding shell 3 and the outer shielding shell 5 are cylindrical. The cylindrical structure is easy to process and manufacture, and when combined with other circular components (such as the support plate 1), the space utilization is more reasonable and the installation is more convenient.

[0032] Furthermore, the first insulating layer 2 is integrally molded from polytetrafluoroethylene (PTFE). PTFE possesses excellent insulation properties, reliably achieving electrical isolation between the inner shielding shell 3 and the temperature control component and the wafer carrier plate 1, preventing leakage and electrical interference. It also exhibits good chemical stability and excellent resistance to high and low temperatures, adapting to temperature changes and chemical corrosion under different working environments, ensuring long-term stability of insulation performance. The integral molding structure avoids weak points in insulation performance caused by splicing, improving the reliability of insulation.

[0033] Furthermore, the inner shielding shell 3 has several wire holes 7, and each of the wire holes 7 is provided with an insulating ring 8. The insulating ring 8 is integrally formed from ceramic. The wire holes 7 on the inner shielding shell 3 facilitate the insertion of wires and the connection between internal components and external circuits. The integrally formed ceramic insulating ring 8 in the wire holes 7 has good insulation and high temperature resistance, which can prevent electrical conduction between the wires and the inner shielding shell 3, ensure the stability of the signal transmission of the wires, and at the same time avoid the shielding effect of the inner shielding shell 3 being affected by the presence of the wire holes 7, thus ensuring the overall shielding performance of the inner shielding shell 3.

[0034] Furthermore, the second insulating layer 4 is integrally molded from ceramic to prevent electrical conduction between the inner and outer shielding layers. The ceramic material possesses extremely high insulation strength and stability, effectively preventing electrical conduction between the inner and outer shielding layers, ensuring reliable electrical isolation between them, and guaranteeing the proper functioning of their respective shielding capabilities. Ceramic is also resistant to high temperatures and corrosion, enabling it to withstand harsh environments encountered during component operation, maintaining excellent insulation performance over a long period, and improving the stability and lifespan of the component.

[0035] Furthermore, the heating component is a heating element 9, which features uniform heating, rapid temperature rise, and high temperature control accuracy. It can quickly and effectively heat related components and, in conjunction with the temperature control component, achieve precise temperature adjustment of the wafer tray 1 to meet different temperature requirements during wafer processing and ensure the quality of wafer processing.

[0036] Furthermore, the temperature control component includes a cold water pan 10 disposed at the bottom of the wafer tray 1. The cold water pan 10 has an inlet connector 11 and an outlet connector 12 on one side for installing water circuit connectors and introducing cooling water to circulate within it. The cold water pan 10 is housed within the inner shielding shell 3. The cold water pan 10 in the temperature control component introduces cooling water through the inlet connector 11 and outlet connector 12, efficiently removing excess heat from the wafer tray 1 and achieving temperature control of the wafer tray 1. In conjunction with the heating component, it can more precisely adjust the temperature of the wafer tray 1, expanding the temperature adjustment range and ensuring that the wafer is processed in a suitable temperature environment, improving processing accuracy and yield. The cold water pan 10, being housed within the inner shielding shell 3, is protected and shielded by the inner shielding shell 3, reducing the impact of external factors on its temperature control effect.

[0037] Furthermore, a plurality of bolts 13 are provided on one side of the connecting column 6. The plurality of bolts 13 movably pass through the connecting column 6 and are threadedly connected to the outer shielding shell 5. The plurality of bolts 13 on one side of the connecting column 6 movably pass through the connecting column 6 and are threadedly connected to the outer shielding shell 5. This connection method makes the connection between the connecting column 6 and the outer shielding shell 5 firm and reliable, ensuring the overall stability. The bolt 13 connection is easy to disassemble and install. When the connecting column 6 or the outer shielding shell 5 is damaged, it is easy to repair and replace, reducing maintenance costs.

[0038] Furthermore, the wafer support tray 1 is integrally formed from aluminum alloy, and the surface of the wafer support tray 1 is plated with gold. The integral forming of aluminum alloy makes the wafer support tray 1 lightweight and has high structural strength, which can reduce the overall weight of the component while ensuring the load-bearing capacity of the wafer support tray 1. Its thermal conductivity is good, which is conducive to heat transfer and uniform distribution. With the temperature control component, temperature adjustment can be achieved quickly. The gold plating on the surface can improve the surface smoothness of the wafer support tray 1, reduce friction and contamination between the wafer and the wafer support tray 1, and at the same time, gold has good conductivity, which can prevent static electricity accumulation and protect the wafer from damage.

[0039] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A novel wafer carrier stage assembly, comprising a wafer carrier disk (1), characterized in that: A temperature control component is provided at the bottom of the plate holder (1); A first insulating layer (2) is provided below the temperature control component, and an inner shielding shell (3) is provided below the first insulating layer (2). The first insulating layer (2), the temperature control component, and the support plate (1) are sequentially arranged inside the inner shielding shell (3). A second insulating layer (4) is provided below the inner shielding shell (3), a heating component is provided on one side of the second insulating layer (4), an outer shielding shell (5) is provided below the second insulating layer (4), and the second insulating layer (4) and one side of the inner shielding shell (3) are located inside the outer shielding shell (5). The bottom of the outer shielding shell (5) is provided with a connecting post (6), which enables the whole to be grounded.

2. The novel wafer carrier assembly according to claim 1, characterized in that: Both the inner shielding shell (3) and the outer shielding shell (5) are integrally formed from alloy steel, and both the inner shielding shell (3) and the outer shielding shell (5) are plated with nickel.

3. A novel wafer carrier stage assembly according to claim 2, characterized in that: Both the inner shielding shell (3) and the outer shielding shell (5) are cylindrical.

4. A novel wafer carrier stage assembly according to claim 3, characterized in that: The first insulating layer (2) is integrally molded from polytetrafluoroethylene.

5. A novel wafer carrier assembly according to claim 4, characterized in that: The inner shielding shell (3) has a plurality of wire holes (7), and each of the plurality of wire holes (7) is provided with an insulating ring (8), which is integrally formed from ceramic.

6. A novel wafer carrier stage assembly according to claim 5, characterized in that: The second insulating layer (4) is integrally formed with ceramic to prevent the inner shielding layer and the outer shielding layer from conducting.

7. A novel wafer carrier assembly according to claim 6, characterized in that: The heating component is a heating element (9).

8. A novel wafer carrier assembly according to claim 7, characterized in that: The temperature control component includes a cold water pan (10) located at the bottom of the plate plate (1). The cold water pan (10) has an inlet connector (11) and an outlet connector (12) on one side for installing water circuit connectors and introducing cooling water to circulate in the cold water pan (10). The cold water pan (10) is located inside the inner shielding shell (3).

9. A novel wafer carrier assembly according to claim 8, characterized in that: A number of bolts (13) are provided on one side of the connecting column (6), and the bolts (13) are movably threaded through the connecting column (6) and screwed into the outer shielding shell (5).

10. A novel wafer carrier assembly according to claim 9, characterized in that: The plate holder (1) is integrally formed from aluminum alloy, and the surface of the plate holder (1) is plated with gold.

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