A cooling device for facilitating temperature control of a carrier plate

By designing a cooling device with cooling copper pipes and a self-locking valve structure on the carrier plate, the problem of untimely carrier plate temperature control was solved, achieving real-time cooling and stable control of the carrier plate temperature, and improving the performance consistency and production efficiency of HJT batteries.

CN224362867UActive Publication Date: 2026-06-16ANHUI QIANJING YUANLONG NEW ENERGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ANHUI QIANJING YUANLONG NEW ENERGY CO LTD
Filing Date
2025-04-14
Publication Date
2026-06-16

AI Technical Summary

⚠Technical Problem

In the CVD process, untimely temperature control of the carrier plate leads to thermal expansion and contraction, affecting the flatness of silicon wafer placement and the uniformity of the thin film. Furthermore, excessively high temperatures affect chemical reactions, reducing the performance consistency and yield of HJT cells. At the same time, prolonged cooling extends the production cycle and increases costs.

⚗Method used

Design a carrier plate device including cooling copper pipes, adopting a self-locking valve structure and flat embedded copper pipes to achieve real-time temperature control of the carrier plate, and ensuring that the carrier plate operates at a suitable temperature by circulating coolant.

🎯Benefits of technology

It achieves real-time and accurate cooling of the carrier plate temperature, improves cooling efficiency, ensures the stability of the carrier plate temperature during the process, and improves product yield and production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a cooling device convenient to temperature control of carrier plate, including carrier plate, be equipped with cooling copper pipeline on the carrier plate, and the liquid inlet end of cooling copper pipeline is equipped with the cooling liquid import self -locking valve and cooling liquid inlet device of interconnection, and the liquid outlet end of cooling copper pipeline is equipped with the cooling liquid export self -locking valve and cooling liquid outlet device of interconnection, and the back of cooling copper pipeline is equipped with a plurality of silicon wafer placing groove. The utility model carries out the temperature reduction measure to the temperature of carrier plate in real time accurately, and timely improves the overall temperature of carrier plate, improves temperature cooling efficiency, guarantees carrier plate to run in suitable temperature.
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