LED glass substrate packaging structure

By synergistically designing a transparent elastic damming layer, a jelly-like fluorescent adhesive layer, and a glass substrate, the problems of insufficient electrical performance and poor luminous effect in traditional LED packaging structures are solved, achieving efficient and stable optical and electrical performance and expanding application scenarios.

CN224368241UActive Publication Date: 2026-06-16SHENZHEN COLIGHTING LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN COLIGHTING LTD
Filing Date
2025-06-19
Publication Date
2026-06-16

AI Technical Summary

⚠Technical Problem

Traditional LED lighting products have problems with electrical performance and insulation, such as signal transmission delay and chip short circuits. They also have poor optical performance, low light emission uniformity and low light source utilization, making it difficult to create a high-quality lighting environment.

⚗Method used

The LED encapsulation structure employs a transparent elastic dammed layer, a jelly-like fluorescent layer, and a glass substrate in collaboration. Through a parallel design of the metal window layer and a flip-chip process, combined with environmentally friendly materials, it optimizes electrical and optical performance.

🎯Benefits of technology

It improves optical and electrical performance, enhances the stability and reliability of packaging, expands application areas, and meets the lighting and decoration needs of different scenarios.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of LED glass substrate packaging structures, it is related to LED packaging technical field, the utility model includes glass substrate, arc dam, metal windowing layer, LED chip, transparent elastic dam glue layer, jelly fluorescent glue layer, wiring terminal and metal wiring layer.Glass substrate adopts environmental protection type special glass material, provides stable support for whole, its good electrical insulation, high thermal conductivity and transmittance guarantee chip stable work.Metal windowing layer is connected with LED chip by flip technology, and multiple metal windowing layers are connected in parallel, to ensure that chip electrical performance is good.Transparent elastic dam glue layer and jelly fluorescent glue layer improve optical performance, and jelly fluorescent glue layer composition is adjustable, can realize multicolor fluorescent emission.The packaging structure solves the problems of insufficient electrical performance, poor light emitting effect and other problems of existing LED packaging, has the advantages of excellent optical performance, strong packaging reliability, environmental protection, diverse functions and other advantages, and has wide application prospect in LED lighting field.
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