Proton irradiation tray compatible with different sizes of wafers

Abstract

The utility model discloses a kind of proton irradiation trays compatible with different sizes wafer, it belongs to semiconductor manufacturing equipment technical field, including wafer tray main body, the wafer tray main body is set to rectangle board structure, the surface of wafer tray main body is provided with several piece-accepting rings, the center of adjacent two piece-accepting rings is equidistant, every piece-accepting ring is single-side notch structure.Several piece-accepting ring's single piece notch is uniform.Each piece-accepting ring and wafer tray main body are fixed using laser spot welding.The utility model provides a kind of proton irradiation trays compatible with different sizes wafer can avoid copper element to contaminate wafer, reduce wafer fragment rate, reduce the frequency of frequently replacing tray due to wafer size difference, improve irradiation production efficiency.The utility model designs piece-accepting ring into single-side notch form, so that suction pen can be inserted into wafer below, adsorb wafer back, facilitate operator operation.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, specifically relating to a proton irradiation tray compatible with wafers of different sizes. Background Technology

[0002] Proton irradiation, also known as hydrogen ion implantation, is an advanced process for improving semiconductor devices. Currently, this process is mainly carried out using a wafer-carrying tray.

[0003] Existing traditional wafer trays primarily use copper screws or stamped bosses to position and secure the wafers to be irradiated. However, the copper screws in traditional trays release copper ions into the air, leading to copper contamination of the wafers.

[0004] Furthermore, to reduce pallet weight, the aluminum plate of the pallet is generally thin, resulting in insufficient contact between the copper screws and the pallet surface, making them very easy to fall off and inconvenient to use and maintain. In actual use, due to the movement of the pallet, the wafer and the stamped boss are prone to collision. When they collide, because the two are in point contact, a large stress will be generated, which may cause serious defects such as chipping and breakage of the wafer.

[0005] On the other hand, in the wafer proton irradiation process, there is a special process requirement that the front side of the wafer needs to be irradiated, and the front side of the wafer generally cannot be touched by tools such as pick-up pens. In addition, wafer trays using copper screws and stamped bosses can only support wafers of a single size, and trays need to be replaced for wafers of different sizes, resulting in low production efficiency. Utility Model Content

[0006] In view of this, the purpose of this utility model is to provide a proton irradiation tray compatible with wafers of different sizes, so as to solve the special process requirement in wafer proton irradiation that the front side of the wafer needs to be irradiated, and the front side of the wafer generally cannot be touched by tools such as suction pens. In addition, the wafer trays using copper screws and stamped bosses only support wafers of a single size, and different sizes of wafers require different trays, resulting in low production efficiency.

[0007] To achieve the above objectives, this utility model employs the following technical solution:

[0008] A proton irradiation tray compatible with wafers of different sizes includes a wafer tray body. The wafer tray body is configured as a rectangular plate structure. The surface of the wafer tray body is provided with a plurality of wafer support rings. The centers of two adjacent wafer support rings are equidistantly arranged, and each wafer support ring has a single-sided notch structure.

[0009] As a preferred embodiment of this utility model, the notches of the several bearing rings are all oriented in the same direction.

[0010] As a preferred technical solution of this utility model, each of the supporting rings is fixed to the wafer tray body by laser spot welding.

[0011] As a preferred technical solution of this utility model, the surface of the bearing ring is provided with step four.

[0012] As a preferred technical solution of this utility model, a third step is provided in the middle of the fourth step, and there is a height difference between the fourth step and the third step.

[0013] As a preferred technical solution of this utility model, step two is provided in the middle of step three, and there is a height difference between step two and step three.

[0014] As a preferred technical solution of this utility model, a step one is provided in the middle of the second step, and there is a height difference between the second step and the first step.

[0015] As a preferred technical solution of this utility model, the step of the bearing ring and the surface of the circular tray body are provided with a height difference, and a wafer suction pen groove is formed between the height difference between the step and the surface of the circular tray body and the single-sided notch.

[0016] As a preferred embodiment of this utility model, the wafer tray body has symmetrically arranged edging strips on the left and right sides of its surface.

[0017] This invention provides a proton irradiation tray compatible with wafers of different sizes, which can avoid copper contamination of the wafers, reduce wafer breakage rate, reduce the frequency of tray replacement due to wafer size differences, and improve irradiation production efficiency.

[0018] This invention features a wafer support ring on the tray for placing wafers, with a single-sided notch design allowing the suction pen to reach under the wafer and adhere to the back side, facilitating operator work and effectively solving the problem of irradiating the front side of the wafer. Simultaneously, it reduces the risk of wafer fragmentation caused by unstable airflow during vacuum breaking in the vacuum process chamber.

[0019] This invention can load wafers, reducing the contact area between the wafer and the tray, significantly reducing the probability of wafer contamination, edge chipping, fragmentation, and other phenomena, and greatly improving wafer yield.

[0020] This invention uses a wafer support ring to elevate the wafer, making the suction between the wafer and the tray negligible. This facilitates wafer handling for operators, results in a cleaner appearance, better integration, and a simpler structure.

[0021] This invention is compatible with wafers of different sizes, reducing the frequency of wafer tray replacement;

[0022] This invention uses aluminum alloy materials throughout, thus avoiding the impact of copper contamination on wafer quality;

[0023] This invention eliminates the need for frequent screw removal and installation, improving production efficiency and facilitating later use and maintenance.

[0024] This invention improves the structure of wafer trays for loading wafers, changing the traditional copper screw positioning and stamped boss structure to a wafer ring structure that is compatible with wafers of different sizes.

[0025] Other advantages, objectives, and features of this invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination and study, or may be learned from practice of this invention. The objectives and other advantages of this invention can be realized and obtained through the following description. Attached Figure Description

[0026] Figure 1 This is a top view of the main body of the wafer tray of this utility model;

[0027] Figure 2 This is a top view of the bearing ring structure of this utility model;

[0028] Figure 3 This is a schematic cross-sectional view of the bearing ring of this utility model;

[0029] In the diagram: 1. Wafer tray body; 2. Wafer support ring; 3. Step 1; 4. Step 2; 5. Step 3; 6. Step 4; 7. Edge trim. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0033] In the above description of this utility model, it should be noted that the terms "one side," "the other side," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0034] Furthermore, terms such as "identical" do not imply that components must be absolutely identical; minor differences are permissible. The term "perpendicular" simply means that the positional relationship between components is more perpendicular than "parallel," not that the structure must be perfectly perpendicular; a slight tilt is acceptable. Example

[0035] Please see Figure 1-3 The present invention provides a technical solution for a proton irradiation tray compatible with wafers of different sizes, comprising a wafer tray body 1, wherein the wafer tray body 1 is configured as a rectangular plate structure, and a plurality of wafer support rings 2 are provided on the surface of the wafer tray body 1. The centers of two adjacent wafer support rings 2 are equidistantly arranged, and each wafer support ring 2 has a single-sided notch structure. The wafer notches of the plurality of wafer support rings 2 all face the same direction.

[0036] Specifically, in this embodiment, the present invention provides a proton irradiation tray compatible with wafers of different sizes, which can avoid copper contamination of the wafers, reduce wafer breakage rate, reduce the frequency of tray replacement due to wafer size differences, and improve irradiation production efficiency.

[0037] Specifically, in this embodiment, the present invention incorporates a wafer support ring on the tray for placing the wafer, and the wafer support ring is designed with a single-sided notch. This allows the suction pen to extend under the wafer and adhere to the back of the wafer, facilitating operator operation and effectively solving the problem of irradiating the front of the wafer. Simultaneously, it reduces the risk of wafer fragmentation caused by unstable airflow blowing onto the wafer during vacuum process chamber vacuum breaking.

[0038] Each of the aforementioned support rings 2 is fixed to the wafer tray body 1 by laser spot welding.

[0039] Specifically, in this embodiment, the present invention improves the wafer tray structure for loading wafers, that is, it changes the traditional copper screw positioning and stamped boss structure to a wafer support ring structure that is compatible with wafers of different sizes.

[0040] The surface of the support ring 2 has a step four 6. A step three 5 is formed in the middle of step four 6, and there is a height difference between step four 6 and step three 5. A step two 4 is formed in the middle of step three 5, and there is a height difference between step two 4 and step three 5. A step one 3 is formed in the middle of step two 4, and there is a height difference between step two 4 and step one 3. A height difference exists between step one 3 of the support ring and the surface of the circular tray body 1, and this height difference, along with the single-sided notch, forms a wafer pick-up slot.

[0041] Specifically, in this embodiment, the present invention can load wafers, reducing the contact area between the wafer and the tray, significantly reducing the probability of wafer contamination, edge chipping, fragmentation, and other phenomena, and greatly improving wafer yield.

[0042] Specifically, in this embodiment, the present invention uses a wafer support ring to support the wafer, and the suction force between the wafer and the tray is negligible, which makes it convenient for operators to pick up and put down the wafer, resulting in a neat appearance, better integration, and a simpler structure.

[0043] Specifically, in this embodiment, the present invention is compatible with wafers of different sizes, reducing the frequency of wafer tray replacement;

[0044] Specifically, in this embodiment, the present invention uses aluminum alloy material throughout, thus avoiding the impact of copper contamination on wafer quality;

[0045] Specifically, in this embodiment, the present invention eliminates the need for frequent screw removal and installation, thereby improving production efficiency and facilitating later use and maintenance.

[0046] The wafer tray body 1 has symmetrically arranged edging strips 7 on the left and right sides of its surface. The edging strips 7 are magnetic and can be attracted by mechanical grippers.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A proton irradiation tray compatible with wafers of different sizes, comprising a wafer tray body (1), characterized in that: The wafer tray body (1) is configured as a rectangular plate structure. Several wafer support rings (2) are provided on the surface of the wafer tray body (1). The centers of two adjacent wafer support rings (2) are equidistant. Each wafer support ring (2) has a single-sided notch structure.

2. The proton irradiation tray compatible with wafers of different sizes according to claim 1, characterized in that: The notches of several of the bearing rings (2) are all oriented in the same direction.

3. The proton irradiation tray compatible with wafers of different sizes according to claim 1, characterized in that: Each of the aforementioned support rings (2) is fixed to the wafer tray body (1) by laser spot welding.

4. The proton irradiation tray compatible with wafers of different sizes according to claim 1, characterized in that: The surface of the bearing ring (2) is provided with step four (6).

5. A proton irradiation tray compatible with wafers of different sizes according to claim 4, characterized in that: Step three (5) is provided in the middle of step four (6), and there is a height difference between step four (6) and step three (5).

6. A proton irradiation tray compatible with wafers of different sizes according to claim 5, characterized in that: Step 2 (4) is provided in the middle of Step 3 (5), and there is a height difference between Step 2 (4) and Step 3 (5).

7. A proton irradiation tray compatible with wafers of different sizes according to claim 6, characterized in that: Step 1 (3) is provided in the middle of Step 2 (4), and there is a height difference between Step 2 (4) and Step 1 (3).

8. A proton irradiation tray compatible with wafers of different sizes according to claim 7, characterized in that: The step 1 (3) of the bearing ring and the surface of the round tray body (1) are provided with a height difference, and a wafer suction pen slot is formed between the height difference between the step 1 (3) and the surface of the round tray body (1) and the single-sided notch.

9. A proton irradiation tray compatible with wafers of different sizes according to claim 1, characterized in that: The wafer tray body (1) has symmetrically arranged edging strips (7) on the left and right sides of its surface.

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