Silicon carbide lapping cooling device
CN224398143UActive Publication Date: 2026-06-23JILIN AOTE OPTOELECTRONIC DEVICES CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JILIN AOTE OPTOELECTRONIC DEVICES CO LTD
- Filing Date
- 2025-08-14
- Publication Date
- 2026-06-23
AI Technical Summary
Technical Problem
Existing silicon carbide grinding equipment has difficulty in effectively cooling down during the grinding process, which leads to temperature rise and affects grinding quality and performance.
Method used
A cooling mechanism, including water pipes and heat-conducting plates, is used to dissipate heat through the cooperation of a water pump and a fan, combined with a shielding mechanism to prevent debris from entering.
Benefits of technology
It achieves effective cooling during the grinding process, improving grinding quality and performance, and facilitating the protection of impurities.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224398143U_ABST
Abstract
The application provides a silicon carbide grinding cooling device, relates to the field of silicon carbide, and improves the problem that the prior art grinding cooling device is difficult to cool during use. In the grinding process of silicon carbide powder, a large amount of heat is generated due to friction and impact, if the heat cannot be dissipated in time, the temperature of the grinding area is increased, and then the performance and grinding quality of the silicon carbide powder are affected. The device comprises a shell and a grinding body, shielding mechanisms are arranged on the two sides of the shell and used for shielding the device, a cooling mechanism is arranged on one side of the shell and used for cooling and lowering the temperature of the grinding body, and the grinding body is fixedly installed on the inner wall bottom end of the shell. The cooling mechanism comprises a water pipe and a heat conduction plate, the water pipe is wound on the surface of the grinding body, the water pipe penetrates through the surface of the shell, and the heat conduction plate is installed on one side of the shell. The device can be cooled during use, and the grinding quality can be improved.
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Citation Information
Patent Citations
Silicon carbide micro-powder grinding and cooling device
CN210060744U