Electroplating cell with improved plating efficiency

CN224548599UActive Publication Date: 2026-07-24SUZHOU XINZHIYUAN ENVIRONMENTAL PROTECTION TECH CO LTD
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Patent Information

Application Number
CN202521847306.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-28
Publication Date
2026-07-24
Estimated Expiration
2035-08-28

AI Technical Summary

Technical Problem

In existing electroplating technologies, uneven stirring leads to low electroplating efficiency and uneven coating, especially in areas with complex shapes where insufficient ion supply results in uneven coating thickness and roughness.

Method used

The cathode plate adopts a multi-dimensional motion design, combining a horizontal reciprocating mechanism and a lifting reciprocating mechanism to achieve composite motion of the cathode plate. Dynamic stirring optimizes the solution environment and enhances ion exchange and stirring effects.

Benefits of technology

It accelerates ion exchange during the electroplating process, improves electroplating efficiency and coating uniformity, shortens the electroplating cycle, and is suitable for high-requirement coating production.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the application provides an electroplating tank with improved electroplating efficiency, relates to the technical field of electrolysis, and comprises a tank body, a cathode plate and an anode plate are arranged on the tank body, mounting frames are fixed on the two sides of the length direction of the tank body, sliding blocks corresponding to the cathode plate are slidably arranged in the mounting frames, the two ends of the cathode plate are connected to the corresponding sliding blocks, the sliding blocks abut at the head and the tail, and horizontal reciprocating mechanisms for driving the horizontal movement of the sliding blocks and lifting reciprocating mechanisms for driving the up-down movement of the sliding blocks are arranged on the mounting frames. The application has the effect of improving electroplating uniformity.
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