Wafer cleaning mechanism and wafer cutting machine

Abstract

This utility model discloses a wafer cleaning mechanism and a wafer dicing machine. The wafer cleaning mechanism includes a base, a rotating shaft, and a suction cup. The base is provided with a cleaning table, an air extraction port, and an air blowing port. The rotating shaft is rotatably mounted on the base and located at the bottom of the cleaning table. A blind hole is provided at the end of the rotating shaft near the cleaning table, extending along the end away from the cleaning table. A through hole is formed on the circumference of the rotating shaft, communicating with the blind hole. The base and the circumference of the rotating shaft form a chamber, communicating with the through hole. Both the air extraction port and the air blowing port are communicating with the chamber. The air extraction port is used at least to evacuate the chamber, and the air blowing port is used at least to blow air into the chamber to break the vacuum. The suction cup is mounted on the cleaning table and has a suction port communicating with the blind hole. The wafer cleaning mechanism and wafer dicing machine of this application can at least solve the problems of low cleaning efficiency and poor wafer adhesion in wafer cleaning devices.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and more specifically, to a wafer cleaning mechanism and a wafer dicing machine. Background Technology

[0002] In the semiconductor manufacturing industry, wafer cleaning is one of the key processes, directly affecting chip quality and yield. Wafer cleaning equipment, as a device that can automatically clean wafers, brings many conveniences to wafer processing. It uses vacuum to adsorb and fix the wafer in the cleaning chamber, and then cleans and dries it with the help of the machine's drive mechanism. However, existing wafer cleaning equipment lacks a vacuum release port. Therefore, when it's time to remove the cleaned wafer from the machine, the waiting time for the vacuum to dissipate is relatively long, significantly reducing cleaning efficiency. Furthermore, the lack of an oil seal at the spindle of existing wafer cleaning equipment results in poor wafer adsorption, posing a risk of wafer detachment during cleaning and potentially damaging the wafer. Utility Model Content

[0003] The main objective of this invention is to provide a wafer cleaning mechanism and a wafer dicing machine, which at least solves the problems of low cleaning efficiency and poor adhesion to wafers in wafer cleaning devices.

[0004] According to one aspect of the present invention, a wafer cleaning mechanism is provided, comprising:

[0005] A base, on which a cleaning platform, an air extraction port, and an air blowing port are provided;

[0006] A rotating shaft is rotatably mounted on the base and located at the bottom of the cleaning table. A blind hole is provided at one end of the rotating shaft near the cleaning table, and the blind hole extends along the end away from the cleaning table. A through hole is provided on the circumference of the rotating shaft, and the through hole communicates with the blind hole. The base and the circumference of the rotating shaft form a cavity, and the cavity communicates with the through hole. Both the air extraction port and the air blowing port communicate with the cavity. The air extraction port is used at least to evacuate the cavity, and the air blowing port is used at least to blow air into the cavity to break the vacuum.

[0007] A suction cup is provided on the cleaning table, and the suction cup is provided with a suction port, which communicates with the blind hole.

[0008] Furthermore, the base includes a first housing and a second housing. Along the height direction of the wafer cleaning mechanism, the first housing and the second housing are sequentially sleeved on the rotating shaft and surround the rotating shaft to form the cavity. One of the first housing and the second housing is provided with the air extraction port, and the other of the first housing and the second housing is provided with the air blowing port.

[0009] Furthermore, the wafer cleaning mechanism also includes a sealing ring disposed between the first housing and the second housing.

[0010] Furthermore, at least one of the first housing and the second housing is provided with an annular groove, the chamber includes an annular chamber, the first housing, the second housing and the rotating shaft surround to form the annular chamber, and the air extraction port and the air blowing port are both connected to the annular chamber.

[0011] Furthermore, the wafer cleaning mechanism further includes a first valve, which is disposed at the air extraction port to control the opening or closing of the air extraction port; and / or,

[0012] The wafer cleaning mechanism further includes a second valve, which is disposed at the air inlet to control the air inlet to open or close.

[0013] Furthermore, the wafer cleaning mechanism also includes a driving device, which is disposed on the base, and the end of the rotating shaft opposite to the suction cup is connected to the power output end of the driving device.

[0014] Furthermore, the wafer cleaning mechanism also includes an oil seal assembly, which is disposed between the base and the rotating shaft to seal the chamber.

[0015] Furthermore, the oil seal assembly includes a first oil seal and a second oil seal, and the base includes a first housing and a second housing. Both the first oil seal and the second oil seal are sleeved on the rotating shaft. Along the axial direction of the rotating shaft, the first oil seal is located on the first side of the chamber, and the first oil seal is interference-fitted with the inner wall surface of the first housing and clearance-fitted with the circumferential side of the rotating shaft. The second oil seal is located on the second side of the chamber opposite to the first side, and the second oil seal is interference-fitted with the inner wall surface of the second housing and clearance-fitted with the circumferential side of the rotating shaft.

[0016] Furthermore, the first oil seal is provided with a first annular groove, which extends along the height direction of the first oil seal and the opening of the first annular groove faces away from the chamber. The second oil seal is provided with a second annular groove, which extends along the height direction of the second oil seal and the opening of the second annular groove faces away from the chamber. Both the first annular groove and the second annular groove surround the circumference of the rotating shaft.

[0017] On the other hand, this application also mentions a wafer dicing machine, which includes the wafer cleaning mechanism described above.

[0018] In this invention, a rotating shaft is rotatably mounted on a base and located at the bottom of the cleaning table. When the shaft rotates, it drives the cleaning table above it to rotate, thus enabling the cleaning and drying of the wafers. During the actual operation of the wafer cleaning mechanism, firstly, the air extraction port evacuates the chamber. Since the chamber is connected to the through-hole, which in turn is connected to the blind hole, and the blind hole is connected to the suction port of the suction cup, the evacuation creates an adsorption force on the suction cup, firmly adhering the wafer to the cleaning table. This ensures the stability of the wafer during the cleaning process and prevents wafer movement from affecting the cleaning effect. Then, the wafer cleaning mechanism drives the rotating shaft to rotate, causing the cleaning table to rotate, thus enabling the wafer cleaning mechanism to perform rotational cleaning and drying. After the wafer cleaning and drying are completed, the wafer cleaning mechanism can blow air into the chamber through the air outlet to break the vacuum. This will quickly eliminate the suction force of the chuck on the wafer. Finally, after the suction force of the chuck on the wafer has completely disappeared, the operator can easily take out the cleaned and dried wafer for subsequent processing.

[0019] In other words, by setting an air blowing port on the wafer cleaning mechanism, this application can accelerate the vacuum breaking efficiency of the chamber, eliminate the suction force of the chuck on the wafer as soon as possible, and reduce the waiting time required to remove the wafer, thereby improving the cleaning efficiency of the wafer cleaning device to a certain extent. Attached Figure Description

[0020] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0021] Figure 1 This is a structural diagram of the wafer dicing machine disclosed in an embodiment of the present utility model;

[0022] Figure 2This is a structural diagram of the wafer cleaning mechanism disclosed in an embodiment of the present utility model from a first-view perspective;

[0023] Figure 3 This is a structural diagram of the wafer cleaning mechanism disclosed in an embodiment of the present utility model from a second perspective;

[0024] Figure 4 This is a structural diagram of the wafer cleaning mechanism disclosed in an embodiment of the present utility model from a third-person perspective;

[0025] Figure 5 This is a structural diagram of the wafer cleaning mechanism disclosed in an embodiment of the present invention from a fourth perspective;

[0026] Figure 6 This is a structural diagram of the first housing, the second housing, and the rotating shaft disclosed in an embodiment of the present utility model from a fifth-angle perspective;

[0027] Figure 7 This is a structural diagram of the first housing, the second housing, and the rotating shaft disclosed in an embodiment of the present utility model from a sixth-angle perspective;

[0028] Figure 8 This is a cross-sectional view of the first housing, the second housing, and the rotating shaft disclosed in an embodiment of the present utility model from a sixth perspective;

[0029] Figure 9 This is a structural diagram of the first oil seal component disclosed in an embodiment of the present utility model;

[0030] Figure 10 This is a structural diagram of the second oil seal component disclosed in an embodiment of the present utility model.

[0031] The above figures include the following reference numerals:

[0032] 1000, Wafer dicing machine; 200, Wafer cleaning mechanism; 21, Base; 211, Cleaning table; 212, Air extraction port; 213, Air blowing port; 214, Chamber; 2141, Annular chamber; 215, First housing; 2151, Annular groove; 216, Second housing; 22, Rotating shaft; 221, Blind hole; 222, Through hole; 23, Suction cup; 24, Sealing ring; 25, First valve; 26, Second valve; 27, Drive device; 28, Oil seal assembly; 281, First oil seal; 2811, First annular groove; 282, Second oil seal; 2821, Second annular groove. Detailed Implementation

[0033] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0034] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to the present invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0035] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0036] As described in the background section, wafer cleaning is a critical process in semiconductor manufacturing, directly impacting chip quality and yield. While existing wafer cleaning equipment can automatically clean wafers and use vacuum to adhere and fix them in the cleaning chamber for cleaning and drying, it suffers from several drawbacks. Firstly, the lack of a vacuum release port means that the vacuum holding the wafer in place must dissipate over a considerable time before the cleaned wafer can be removed from the cleaning chamber. This significantly reduces cleaning efficiency. Secondly, the absence of an oil seal at the spindle in existing wafer cleaning equipment results in poor wafer adhesion, posing a risk of wafer detachment during cleaning and potentially causing damage. Therefore, this application provides a novel wafer cleaning mechanism that not only improves the cleaning efficiency of the wafer cleaning apparatus but also enhances the adhesion of the wafer cleaning apparatus to the wafer, preventing the wafer from detaching during the cleaning process. The wafer cleaning mechanism of this application will be described in detail below with reference to the accompanying drawings.

[0037] See Figures 1 to 10 As shown in the figure, this application embodiment provides a wafer cleaning mechanism 200, which includes a base 21, a rotating shaft 22 and a suction cup 23.

[0038] The base 21 is provided with a cleaning platform 211, an air extraction port 212, and an air blowing port 213. A rotating shaft 22 is rotatably mounted on the base 21 and located at the bottom of the cleaning platform 211. A blind hole 221 is provided at one end of the rotating shaft 22 near the cleaning platform 211. The blind hole 221 extends along the end away from the cleaning platform 211, and a through hole 222 is provided on the periphery of the rotating shaft 22. The through hole 222 communicates with the blind hole 221. The base 21 and the periphery of the rotating shaft 22 form a chamber 214, which communicates with the through hole 222. Both the air extraction port 212 and the air blowing port 213 communicate with the chamber 214. The air extraction port 212 is used at least to evacuate the chamber 214, and the air blowing port 213 is used at least to blow air into the chamber 214 to break the vacuum. The suction cup 23 is disposed on the cleaning table 211, and the suction cup 23 is provided with a suction port, which is connected to the blind hole 221.

[0039] In this application, the rotating shaft 22 is rotatably mounted on the base 21 and located at the bottom of the cleaning table 211. When the rotating shaft 22 rotates, it can drive the cleaning table 211 above the rotating shaft 22 to rotate, thus cleaning and drying the wafer. During the actual operation of the wafer cleaning mechanism 200, firstly, the air extraction port 212 can evacuate the chamber 214. Since the chamber 214 is connected to the through hole 222, and the through hole 222 is connected to the blind hole 221, and the blind hole 221 is connected to the suction port (not shown in the figure) of the suction cup 23, when the air extraction port 212 evacuates the chamber 214, the suction cup 23 can generate an adsorption force, thereby firmly adsorbing the wafer onto the cleaning table 211, thus ensuring the stability of the wafer during the cleaning process and avoiding the impact of wafer movement on the cleaning effect of the wafer cleaning mechanism 200. Then, the wafer cleaning mechanism 200 drives the rotating shaft 22 to rotate, which in turn drives the cleaning stage 211 to rotate. This allows the wafer cleaning mechanism 200 to perform rotational cleaning and drying of the wafer. After the wafer cleaning and drying are completed, the wafer cleaning mechanism 200 can blow air into the chamber 214 through the air outlet 213 to break the vacuum. This can quickly eliminate the suction force of the suction cup 23 on the wafer. Finally, after the suction force of the suction cup 23 on the wafer has completely disappeared, the operator can easily remove the cleaned and dried wafer for subsequent processing.

[0040] In other words, by providing an air outlet 213 on the wafer cleaning mechanism 200 that can blow air into the chamber 214, this application can accelerate the vacuum breaking efficiency of the chamber 214, eliminate the suction force of the suction cup 23 on the wafer as soon as possible, and reduce the waiting time required to remove the wafer, thereby improving the cleaning efficiency of the wafer cleaning device to a certain extent.

[0041] Further, see Figure 3 , Figures 6 to 8As shown, the base 21 includes a first housing 215 and a second housing 216. Along the height direction of the wafer cleaning mechanism 200, the first housing 215 and the second housing 216 are sequentially sleeved on the rotating shaft 22 and surround the rotating shaft 22 to form a cavity 214. An air extraction port 212 is provided on one of the first housing 215 and the second housing 216, and an air blowing port 213 is provided on the other of the first housing 215 and the second housing 216.

[0042] Specifically, the height direction of the wafer cleaning mechanism 200 is... Figure 1 and Figure 3 The height direction is shown in the figure. In this application, the base 21 is designed as a separate arrangement of the first housing 215 and the second housing 216, which are sequentially fitted onto the rotating shaft 22 along the height direction of the wafer cleaning mechanism 200. This structural design allows for a more compact and rational layout of the components of the wafer cleaning mechanism 200, thereby fully utilizing the space of the wafer cleaning mechanism 200 and reducing the overall volume of the wafer cleaning mechanism 200 to a certain extent, which is beneficial for the miniaturization and integration of the equipment. The first housing 215 and the second housing 216 together with the rotating shaft 22 form a chamber 214, providing a closed space for subsequent evacuation and blowing operations, ensuring the effectiveness and stability of the evacuation and blowing process, and enabling precise control of the air pressure changes within the chamber 214 according to design requirements. The first housing 215 and the second housing 216 are respectively provided with an evacuation port 212 and an blowing port 213, thereby enabling vacuuming and vacuum breaking operations in the chamber 214. When the wafer cleaning mechanism 200 needs to clean the wafer, the suction port 212 can evacuate the chamber 214, thereby generating suction force through the through-hole 222 and blind hole 221. The suction force generated by the suction cup 23 can firmly adhere to the wafer, facilitating cleaning and drying by the wafer cleaning mechanism 200. When the wafer needs to be removed after cleaning, the wafer cleaning mechanism 200 can blow air into the chamber 214 through the air blowing port 213, thereby breaking the vacuum in the chamber 214 and eliminating the suction force of the suction cup 23 on the wafer. This allows the operator to easily remove the cleaned and dried wafer from the cleaning table 211, thus achieving effective control of the suction cup 23's adsorption and release of the wafer. The combined structure of the first housing 215 and the second housing 216 not only facilitates the processing of the chamber 214, but also facilitates the inspection and cleaning of the interior of the chamber 214. Furthermore, it facilitates the maintenance and upkeep of the air extraction port 212 and the air blowing port 213 by operators, improving the maintainability of the wafer cleaning mechanism 200. It is understood that while the base 21 includes the first housing 215 and the second housing 216, it does not mean that the base 21 is composed solely of the first housing 215 and the second housing 216; rather, it means that the first housing 215 and the second housing 216 are part of the base.

[0043] For example, in this application, an air extraction port 212 can be provided on the first housing 215 and an air blowing port 213 can be provided on the second housing 216. Alternatively, an air blowing port 213 can be provided on the first housing 215 and an air extraction port 212 can be provided on the second housing 216. This application does not make specific requirements on the specific locations of the air extraction port 212 and the air blowing port 213 on the first housing 215 and the second housing 216. As long as reasonable adjustments are made to the air extraction port 212 and the air blowing port 213 under the concept of this application, they are all within the scope of protection claimed by this application. This embodiment shows the case where an air extraction port 212 is provided on the first housing 215 and an air blowing port 213 is provided on the second housing 216.

[0044] Further, see Figure 8 As shown, the wafer cleaning mechanism 200 also includes a sealing ring 24, which is disposed between the first housing 215 and the second housing 216. Specifically, the sealing ring 24, disposed between the first housing 215 and the second housing 216, effectively ensures the sealing of the chamber 214, allowing the vacuuming operation performed by the suction port 212 and the operation of blowing air into the chamber 214 by the blowing port 213 to break the vacuum to be performed effectively. Furthermore, good sealing ensures that the pressure changes within the chamber 214 meet design requirements, guaranteeing the normal operation of the wafer cleaning mechanism 200. By preventing gas leakage within the chamber 214, interference from external factors on the pressure within the chamber 214 can be effectively reduced, making the wafer cleaning mechanism 200 more stable during operation. Simultaneously, a stable pressure environment facilitates the adsorption and release of the wafer by the suction cup 23, improving the reliability of the wafer cleaning process. In addition, the sealing ring 24 can prevent dust, impurities and other contaminants from entering the chamber 214, thus avoiding wear or blockage of the internal structure of the shaft 22, such as the blind hole 221 and through hole 222, and extending the service life of the wafer cleaning mechanism 200 to a certain extent.

[0045] Further, see Figure 3 and Figure 8 As shown, at least one of the first housing 215 and the second housing 216 is provided with an annular groove 2151, the chamber 214 includes an annular chamber 2141, the first housing 215, the second housing 216 and the rotating shaft 22 surround to form an annular chamber 2141, and the air extraction port 212 and the air blowing port 213 are both connected to the annular chamber 2141.

[0046] Specifically, the annular chamber 2141 ensures more uniform communication between the extraction port 212 and the blowing port 213 and the chamber 214, allowing for smoother gas flow and diffusion within the annular chamber 2141. This avoids uneven local pressure and ensures the stability and efficiency of the vacuuming operation of the extraction port 212 and the vacuum breaking operation of the blowing port 213 within the chamber 214. Furthermore, the annular chamber 2141 also allows for more uniform gas flow between the chamber 214 and the blind hole 221 through the through hole 222, unaffected by the rotation of the shaft 22. In addition, the design of the annular groove 2151 provides the structural basis for the formation of the annular chamber 2141. This structural layout rationally utilizes the space between the first housing 215, the second housing 216, and the shaft 22, making the entire wafer cleaning mechanism 200 more compact and reducing unnecessary space occupation. Stable vacuuming and vacuum breaking operations enable better control over the adsorption and release of the wafer by the chuck 23.

[0047] Exemplarily, in this application, an annular groove 2151 can be provided solely on the first housing 215, or solely on the second housing 216. Alternatively, annular grooves 2151 can be provided simultaneously on both the first housing 215 and the second housing 216, and then an annular chamber 2141 is formed by the first housing 215, the second housing 216, and the rotating shaft 22. This embodiment illustrates the case where an annular groove 2151 is provided solely on the first housing 215.

[0048] Further, see Figure 3 and Figure 8As shown, the wafer cleaning mechanism 200 also includes a first valve 25, which is located at the extraction port 212 to control the opening or closing of the extraction port 212. Specifically, the first valve 25 is located at the extraction port 212 and can flexibly control the opening or closing of the extraction port 212 according to actual needs. When a vacuum operation is required in the chamber 214, the first valve 25 is opened, allowing the extraction device (not shown in the figure) connected to the first valve 25 to extract air from the chamber 214 through the extraction port 212, creating a vacuum environment inside the chamber 214. This allows the suction cup 23 to generate an adsorption force to adsorb and fix the wafer. When evacuation of the chamber 214 is not required, the wafer cleaning mechanism 200 can control the first valve 25 to close, thereby preventing outside air from accidentally entering the chamber 214, maintaining the stability of the vacuum level inside the chamber 214, and avoiding the impact of vacuum fluctuations on the normal operation of the wafer cleaning mechanism 200. This improves the stability and reliability of the entire wafer cleaning mechanism 200 system. In addition, by using a first valve 25 to control the air extraction port 212, the operator can precisely adjust the timing and duration of air extraction according to different cleaning processes and wafer conditions, so that the wafer cleaning mechanism 200 can better adapt to diverse work needs.

[0049] Optionally, the wafer cleaning mechanism 200 further includes a second valve 26, which is disposed at the air blowing port 213 to control the opening or closing of the air blowing port 213. Specifically, the wafer cleaning mechanism 200 of this application can precisely control the opening and closing of the air blowing port 213 through the second valve 26. When it is necessary to blow air into the chamber 214 to break the vacuum, the wafer cleaning mechanism 200 can control the second valve 26 to open, allowing gas to enter the chamber 214, thereby eliminating the suction force of the suction cup 23 on the wafer, making it easier for the operator to remove the cleaned and dried wafer from the wafer cleaning mechanism 200. When blowing air is not required, the wafer cleaning mechanism 200 can control the second valve 26 to close, avoiding unnecessary gas leakage and ensuring the accuracy and controllability of the blowing operation. This allows for flexible opening and closing of the air inlet 213 according to actual work needs, preventing abnormal pressure fluctuations that may occur due to continuous gas entering the chamber 214. This helps maintain the stability of the internal pressure of the wafer cleaning mechanism 200, thereby improving the overall system stability of the wafer cleaning mechanism 200.

[0050] Further, see Figure 2 , Figure 3 , Figure 5 as well as Figure 8 As shown, the wafer cleaning mechanism 200 also includes a drive device 27, which is disposed on the base 21, and the end of the rotating shaft 22 opposite to the suction cup 23 is connected to the power output end of the drive device 27.

[0051] Specifically, the drive device 27 provides power for the rotation of the rotating shaft 22, enabling the shaft 22 to drive the connected suction cup 23 to rotate, thereby realizing the rotation of the wafer during the cleaning process, which helps to clean the wafer more comprehensively and evenly. Simultaneously, the way the drive device 27 is positioned on the base 21 helps to integrate the power source with the base structure, making the entire wafer cleaning mechanism 200 more compact, reducing additional space occupation, and facilitating equipment miniaturization and layout optimization. The end of the rotating shaft 22 facing away from the suction cup 23 is connected to the power output end of the drive device 27. This connection method ensures the stability and reliability of power transmission, thereby accurately transmitting the power of the drive device 27 to the rotating shaft 22, ensuring the normal operation of the wafer cleaning process. In this application, the drive device 27 can be a torque motor or a variable frequency motor, etc. This embodiment shows the case where the drive device 27 is a torque motor.

[0052] Further, see Figures 8 to 10 As shown, the wafer cleaning mechanism 200 also includes an oil seal assembly 28, which is disposed between the base 21 and the rotating shaft 22 to seal the chamber 214. Specifically, the oil seal assembly 28, disposed between the base 21 and the rotating shaft 22, effectively prevents gas leakage from the chamber 214 into the external environment, ensuring the airtightness of the chamber 214 and maintaining the pressure and environmental stability within the chamber 214. Simultaneously, the oil seal assembly 28 also prevents external dust and impurities from entering the chamber 214, thereby protecting other components within the chamber 214, such as the rotating shaft 22. This reduces wear and malfunctions caused by impurities entering the chamber, extending the service life of the wafer cleaning mechanism 200. Furthermore, good sealing performance helps maintain a clean environment within the chamber 214, ensuring the stability and effectiveness of operations such as suction and blowing, thereby improving the cleaning effect on the wafers. Reducing malfunctions and damage caused by gas leakage or impurities entering the chamber 214 lowers the frequency of maintenance and component replacement, thus reducing the maintenance cost of the wafer cleaning mechanism 200.

[0053] Further, see Figures 7 to 10 As shown, the oil seal assembly 28 includes a first oil seal 281 and a second oil seal 282, and the base 21 includes a first housing 215 and a second housing 216. The first oil seal 281 and the second oil seal 282 are both sleeved on the rotating shaft 22. Along the axial direction of the rotating shaft 22, the first oil seal 281 is located on the first side of the chamber 214, and the first oil seal 281 is interference-fitted with the inner wall surface of the first housing 215 and clearance-fitted with the circumferential side of the rotating shaft 22. The second oil seal 282 is located on the second side of the chamber 214 opposite to the first side, and the second oil seal 282 is interference-fitted with the inner wall surface of the second housing 216 and clearance-fitted with the circumferential side of the rotating shaft 22.

[0054] Specifically, the axial direction of the rotating shaft 22 is... Figure 7 and Figure 8 The direction indicated by 'z'. The first oil seal 281 and the second oil seal 282 are located on both sides of the chamber 214 and are interference-fitted with the corresponding inner wall surfaces of the housing, effectively preventing gas leakage within the chamber 214 and ensuring its sealing performance. The first oil seal 281 and the second oil seal 282 are clearance-fitted with the circumferential side of the rotating shaft 22, so that excessive friction and wear will not be caused to the oil seals when the rotating shaft 22 rotates, ensuring both sealing performance and unimpeded normal rotation of the rotating shaft 22. This is crucial for the function of the wafer cleaning mechanism 200, which requires the rotating shaft 22 to drive the chuck 23 and the wafer to rotate for cleaning, thus ensuring the stable operation of the wafer cleaning mechanism 200. This application employs a method where the first oil seal 281 and the second oil seal 282 are respectively positioned at different locations (i.e., the first and second sides of the chamber 214). This not only seals both sides of the chamber 214 in the axial direction of the rotating shaft 22, ensuring the airtightness of the chamber 214, but also facilitates the installation and maintenance of the first oil seal 281 and the second oil seal 282 by operators. If either the first oil seal 281 or the second oil seal 282 is damaged, the operator can replace it individually without having to replace the entire oil seal assembly 28, reducing maintenance costs and difficulty. Furthermore, this arrangement makes the oil seal assembly 28 structurally more stable and better able to withstand the effects of pressure differences inside and outside the chamber 214. The first oil seal 281 and the second oil seal 282 cooperate with their respective housings, working together to enhance the sealing and protection of the chamber 214 by the entire oil seal assembly 28, thereby improving the reliability of the wafer cleaning mechanism 200.

[0055] Further, see Figures 8 to 10 As shown, the first oil seal 281 is provided with a first annular groove 2811, which extends along the height direction of the first oil seal 281 and the opening of the first annular groove 2811 faces the side away from the chamber 214. The second oil seal 282 is provided with a second annular groove 2821, which extends along the height direction of the second oil seal 282 and the opening of the second annular groove 2821 faces the side away from the chamber 214. Both the first annular groove 2811 and the second annular groove 2821 surround the circumference of the rotating shaft 22.

[0056] Specifically, the first annular groove 2811 and the second annular groove 2821 increase the sealing path length between the oil seal and surrounding components, allowing the sealing oil to better seal the gaps between the first housing 215 and the rotating shaft 22, as well as the gaps between the second housing 216 and the rotating shaft 22. This ensures the sealing performance of the chamber 214 without interfering with the rotation of the rotating shaft 22. When gas attempts to leak from the chamber 214, the sealing oil in the first annular groove 2811 and the second annular groove 2821 prevents gas leakage, thereby improving the sealing performance of the chamber 214 and reducing the possibility of gas leaking from the chamber 214 to the outside. The annular grooves (i.e., the first annular groove 2811 and the second annular groove 2821) serve as accommodating spaces. On one hand, the bottom of the annular grooves prevents dust and other impurities from entering the chamber 214, preventing these impurities from causing wear on the oil seal and the rotating shaft 22, and extending the service life of the oil seal assembly 28 and the rotating shaft 22. On the other hand, the annular groove can store a certain amount of sealing oil. This sealing oil not only seals the gaps between the first housing 215 and the rotating shaft 22, and between the second housing 216 and the rotating shaft 22, but also provides lubrication, ensuring lubrication between the oil seal assembly 28 and the rotating shaft 22, reducing frictional resistance, and making the rotation of the rotating shaft 22 smoother. Furthermore, the first annular groove 2811 and the second annular groove 2821 surround the circumference of the rotating shaft 22. This structural design makes the circumferential force on the oil seal more uniform. During the rotation of the rotating shaft 22, it can better adapt to the movement of the rotating shaft 22, reducing deformation or damage to the oil seal caused by uneven local force, and improving the structural stability and reliability of the entire oil seal assembly 28. The presence of the annular groove provides a certain positioning reference for the installation of the oil seal. During installation, the operator can more accurately install the first oil seal 281 and the second oil seal 282 into the correct position based on the position and direction of the annular groove, ensuring that the oil seal assembly 28 can perform its sealing function normally.

[0057] On the other hand, see Figure 1 As shown, this application also mentions a wafer dicing machine 1000, which can be, for example, a manual wafer dicing machine, a semi-automatic wafer dicing machine, or a fully automatic wafer dicing machine, and the wafer dicing machine 1000 includes the aforementioned wafer cleaning mechanism 200. Therefore, the wafer dicing machine 1000 includes all the technical effects of the aforementioned wafer cleaning mechanism 200. Since the technical effects of the wafer cleaning mechanism 200 have been described in detail above, they will not be repeated here.

[0058] As described above, this application establishes a wafer cleaning mechanism 200 comprising a base 21, a rotating shaft 22, a suction cup 23, a sealing ring 24, a first valve 25, a second valve 26, a drive device 27, and an oil seal assembly 28, and applies this wafer cleaning mechanism 200 to a wafer dicing machine 1000. During the operation of the wafer dicing machine 1000, the diced wafer is first placed on the corresponding position on the suction cup 23. At this time, the wafer cleaning mechanism 200 controls the opening of the first valve 25, which is connected to the air extraction port 212, and creates a vacuum in the chamber 214, thus providing sufficient suction force to the suction cup 23 to adhere and fix the wafer. Then, the wafer cleaning mechanism 200 drives the drive device 27 to rotate the cleaning table 211 and the suction cup 23 to clean and dry the wafer. After the wafer is cleaned and dried, the wafer cleaning mechanism 200 controls the first valve 25 to close and controls the second valve 26, which is connected to the air outlet 213, to open and blow air into the chamber 214 to break the vacuum. This quickly eliminates the suction force of the suction cup 23 on the wafer. Finally, after the suction force of the suction cup 23 on the wafer has completely disappeared, the wafer cleaning mechanism 200 controls the second valve 26 to close, allowing the operator to remove the cleaned and dried wafer for subsequent processing. Furthermore, because the wafer cleaning mechanism 200 of this application is equipped with an oil seal assembly 28, it not only improves the sealing of the chamber 214 and enhances the suction effect of the suction cup 23 on the wafer, but also prevents the wafer from accidentally falling out during the cleaning and drying process.

[0059] As can be seen, compared with existing wafer cleaning devices, the wafer cleaning mechanism 200 of this application, by setting an air blowing port 213 to break the vacuum in the chamber 214, can significantly shorten the time waiting for the suction cup 23 to lose its adsorption force on the wafer, thereby improving the cleaning efficiency of the wafer cleaning mechanism 200 to a certain extent. Furthermore, the oil seal assembly 28 can solve the problem of poor suction force on the wafer in previous wafer cleaning devices, preventing the wafer from accidentally falling off during cleaning and drying, thus improving the safety and durability of the wafer cleaning mechanism 200.

[0060] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0061] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0062] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer cleaning mechanism, characterized in that, include: The base (21) is provided with a cleaning table (211), an air extraction port (212) and an air blowing port (213); A rotating shaft (22) is rotatably mounted on the base (21) and located at the bottom of the cleaning table (211). A blind hole (221) is provided at one end of the rotating shaft (22) near the cleaning table (211), extending from the end opposite to the cleaning table (211). A through hole (222) is provided on the circumference of the rotating shaft (22), communicating with the blind hole (221). The base (21) and the rotating shaft (22) surround a cavity (214) to form a cavity (214). The cavity (214) is connected to the through hole (222). The air extraction port (212) and the air blowing port (213) are both connected to the cavity (214). The air extraction port (212) is used at least to evacuate the cavity (214), and the air blowing port (213) is used at least to blow air into the cavity (214) to break the vacuum. A suction cup (23) is provided on the cleaning table (211), and the suction cup (23) is provided with a suction port, which is connected to the blind hole (221).

2. The wafer cleaning mechanism according to claim 1, characterized in that, The base (21) includes a first housing (215) and a second housing (216). Along the height direction of the wafer cleaning mechanism, the first housing (215) and the second housing (216) are sequentially sleeved on the rotating shaft (22) and surround the rotating shaft (22) to form the chamber (214). One of the first housing (215) and the second housing (216) is provided with the air extraction port (212), and the other of the first housing (215) and the second housing (216) is provided with the air blowing port (213).

3. The wafer cleaning mechanism according to claim 2, characterized in that, The wafer cleaning mechanism further includes a sealing ring (24), which is disposed between the first housing (215) and the second housing (216).

4. The wafer cleaning mechanism according to claim 2, characterized in that, At least one of the first housing (215) and the second housing (216) is provided with an annular groove (2151), the chamber (214) includes an annular chamber (2141), the first housing (215), the second housing (216) and the rotating shaft (22) surround to form the annular chamber (2141), and the air extraction port (212) and the air blowing port (213) are both connected to the annular chamber (2141).

5. The wafer cleaning mechanism according to claim 1, characterized in that, The wafer cleaning mechanism further includes a first valve (25), which is disposed at the air extraction port (212) to control the air extraction port (212) to open or close; and / or, The wafer cleaning mechanism further includes a second valve (26), which is disposed at the air inlet (213) to control the air inlet (213) to open or close.

6. The wafer cleaning mechanism according to claim 1, characterized in that, The wafer cleaning mechanism also includes a drive device (27), which is disposed on the base (21). The end of the rotating shaft (22) facing away from the suction cup (23) is connected to the power output end of the drive device (27).

7. The wafer cleaning mechanism according to any one of claims 1 to 6, characterized in that, The wafer cleaning mechanism also includes an oil seal assembly (28), which is disposed between the base (21) and the rotating shaft (22) to seal the chamber (214).

8. The wafer cleaning mechanism according to claim 7, characterized in that, The oil seal assembly (28) includes a first oil seal (281) and a second oil seal (282). The base (21) includes a first housing (215) and a second housing (216). The first oil seal (281) and the second oil seal (282) are both sleeved on the rotating shaft (22). Along the axial direction of the rotating shaft (22), the first oil seal (281) is located on the first side of the chamber (214), and the first oil seal (281) is interference-fitted with the inner wall surface of the first housing (215) and clearance-fitted with the circumferential side of the rotating shaft (22). The second oil seal (282) is located on the second side of the chamber (214) opposite to the first side, and the second oil seal (282) is interference-fitted with the inner wall surface of the second housing (216) and clearance-fitted with the circumferential side of the rotating shaft (22).

9. The wafer cleaning mechanism according to claim 8, characterized in that, The first oil seal (281) is provided with a first annular groove (2811), which extends along the height direction of the first oil seal (281) and the opening of the first annular groove (2811) faces away from the chamber (214). The second oil seal (282) is provided with a second annular groove (2821), which extends along the height direction of the second oil seal (282) and the opening of the second annular groove (2821) faces away from the chamber (214). Both the first annular groove (2811) and the second annular groove (2821) surround the circumference of the rotating shaft (22).

10. A wafer dicing machine, characterized in that, The wafer dicing machine includes the wafer cleaning mechanism according to any one of claims 1 to 9.

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