Modular heat dissipation system for RF modules

Abstract

The invention consists of a system for reducing the temperature of electronic boards located in a confined space, in order to stack them in a compact and modular design within radio frequency circuits that radiate high transmission power. Radio frequency transmission circuits are widely used for frequency jamming systems in security and protection against threats controlled by telemetry or communication systems. For this reason, it is necessary to stack the electronics required to transmit high-power signals at different frequencies, causing these boards to reach critical temperatures that can result in total damage. Conventional designs use heat sinks made of aluminum or other heat-conducting materials, supported by fans that extract the air; however, these do not optimize space for more convenient and efficient designs.