Radiation-emitting component and method for manufacturing a radiation-emitting component

The radiation-emitting component addresses mechanical and thermal stability issues by arranging the semiconductor chip and reflector layers within a substrate cavity, absorbing shear forces and facilitating efficient manufacturing through a transparent substrate design.

DE102018010672B4Active Publication Date: 2026-05-28OSRAM OPTO SEMICON GMBH & CO OHG
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
DE102018010672
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Filing Date
2018-02-20
Publication Date
2026-05-28
Estimated Expiration
2038-02-20

Smart Images

  • Figure 00000000_0000_ABST
    Figure 00000000_0000_ABST
Patent Text Reader

Abstract

Radiation-emitting component (1) with - a carrier (2) which has a cavity (9), - a radiation-emitting semiconductor chip (3) arranged on a base surface bounding the cavity (9) and designed to generate primary electromagnetic radiation, and - a first reflector layer (6) arranged above a cover surface of the semiconductor chip (3), wherein - the support (2) has a side wall (2b, 2d) and a bottom (2a, 2c), - the carrier (2) is partially transparent to the primary electromagnetic radiation, - the semiconductor chip (3) is arranged at a distance from at least one side surface bounding the cavity (9), - the side wall (2b) has a reflective part and a transparent part (2d), and - the transparent part of the side wall (2d) has a top surface which runs diagonally to the top surface of the base (2a, 2c) of the support (2).
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Radiation-emitting semiconductor component, lighting device and display device

    DE102012102114A1

  • Optoelectronic component and method for manufacturing an optoelectronic component

    DE102014105839A1