Encapsulated package with exposed electrically conductive structures and a sidewall recess, and method for its manufacture

Abstract

One package (100), comprising: • an electronic component (102); • an encapsulation (104) which encapsulates at least part of the electronic component (102); • a first electrically conductive structure (106) which is arranged on one side of the electronic component (102); • a second electrically conductive structure (108) which is arranged on an opposite side of the electronic component (102) and is electrically coupled to the electronic component (102); and • at least one side wall recess (110) on the encapsulation (104); • wherein the first electrically conductive structure (106) and the second electrically conductive structure (108) are configured to be at different electrical potentials during operation of the package (100), and wherein the first electrically conductive structure (106) and the second electrically conductive structure (108) are exposed on opposite main surfaces of the encapsulation (104); • wherein the side wall recess (110) extends only to one of two opposing main surfaces of the encapsulation (104); • wherein the side wall recess (110) exposes a side wall section of the first electrically conductive structure (106).

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