Method, device and system for SIM profile binding to an eUICC chip

The method employs multi-layered encryption with asymmetric key pairs to securely and flexibly bind SIM profiles to eUICC chips in vehicle production, addressing flexibility and security challenges in SIM profile assignment.

DE102024138903B3Active Publication Date: 2026-05-28CARIAD SE
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Patent Information

Application Number
DE102024138903
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Filing Date
2024-12-19
Publication Date
2026-05-28
Estimated Expiration
2044-12-19

AI Technical Summary

Technical Problem

Current methods for binding SIM profiles to eUICC chips in vehicle production environments lack flexibility and security, particularly in scenarios requiring rapid, secure, and dynamic assignment of SIM profiles to vehicles without relying on external infrastructure or certified components.

Method used

A method involving multi-layered encryption using asymmetric key pairs, where SIM profiles are encrypted with a public key PKp and stored with a batch ID, and the corresponding secret key SKp is encrypted with a public key PK.EUM.batchX, ensuring secure and flexible management and installation directly on the eUICC chip.

Benefits of technology

Enables rapid, secure, and flexible SIM profile assignment in vehicle production, minimizing unauthorized access and reducing reliance on external systems, while ensuring compliance with security standards and efficient production processes.

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Abstract

The disclosure relates to a method, a device and a system for binding a SIM profile to an eUICC chip of a communication device, in particular to a communication device of a vehicle in a production environment of the vehicle.
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Citation Information

Patent Citations

  • Profile generation for provisioning the profile to an euicc

    US20240305973A1

  • Provisioning of a xuicc with an operating system and data and programs

    WO2024245798A1