LASER PACKAGE AND METHOD FOR MANUFACTURING A LASER PACKAGE

DE102025101428A1Undetermined Publication Date: 2026-07-16AMS OSRAM INT GMBH
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Patent Information

Application Number
DE102025101428
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-01-16
Publication Date
2026-07-16

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Abstract

The invention relates to a laser package comprising an optoelectronic semiconductor chip for generating radiation and a housing in which the at least one optoelectronic semiconductor chip is hermetically encapsulated. The housing comprises a housing cover which is attached to a housing base body by means of a connecting means. The housing base body comprises a base plate, which is opaque to radiation and serves as a support for the at least one optoelectronic semiconductor chip, and the base plate is provided on both sides with metallic electrical connection areas. The housing cover is configured as a radiation exit window and is formed from a radiation-permeable ceramic material.
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Citation Information

Patent Citations

  • Laser diode device

    DE102012103257A1

  • Optoelectronic component

    DE102012200327A1

  • Optoelectronic semiconductor device

    DE102021109968A1

  • Packages for electro-optic devices

    US4659170A