Microelectromechanical system with at least one U-spring element with transverse stiffness in the z-direction, accelerometer, loudspeaker and optical sensor, each comprising at least two U-spring elements, and use of the at least one U-spring element in systems with movable mass bodies

DE102025101438A1Undetermined Publication Date: 2026-07-16ROBERT BOSCH GMBH
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Patent Information

Application Number
DE102025101438
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-01-16
Publication Date
2026-07-16
Patent Text Reader

Abstract

The present invention relates to a microelectromechanical system (MEMS) (1) comprising a first functional layer (2) which spans an xy-plane and has a thickness d1 perpendicular to the xy-plane in the z-direction, at least one second functional layer (4) which is mounted on the first functional layer (2) such that a functional layer stack (6) with height H is present in the z-direction, and at least one U-spring element (8). The at least one U-spring element (8) comprises a spring attachment (10) and a movable spring deflection part (12) which extends in the z-direction and has transverse stiffness in the z-direction. The invention further relates to MEMS (1) according to the invention, which are configured as an accelerometer (100), as a loudspeaker (200), or as an optical sensor (300) and comprise at least two U-spring elements (8, 38). The invention further relates to the use of the MEMS (1) according to the invention in systems with movable mass bodies (30).
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Citation Information

Patent Citations

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  • Method for manufacturing a protective wafer including inclined optical windows and device

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