Device for applying hot melt adhesive to articles

DE102025101755A1Undetermined Publication Date: 2026-07-23KHS GMBH
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Patent Information

Application Number
DE102025101755
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-01-20
Publication Date
2026-07-23

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Abstract

The invention relates to a device (1) for applying hot melt adhesive to articles, comprising at least one application head (5) with at least one adhesive nozzle (5.1) having a nozzle opening (5.2) for applying the hot melt adhesive to the articles in portions, further comprising at least one heating and / or cooling device (20) designed for heating and / or cooling an adhesive thread that forms between the nozzle opening (5.2) and the respective article during the portion-by-portion application of the hot melt adhesive in order to cut the adhesive thread.
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Citation Information

Patent Citations

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    DE102010017295B3

  • Method for manufacturing bundle of bottles, involves interconnecting container groups with each other to form bundle by applied adhesive or bonding agent, and separating containers from groups in non-destructive manner

    DE102011106759B3

  • Device for forming packaging units

    DE102012100810A1

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    DE212022000158U1

  • Process and device for applying liquid, pasty or plastic substances to a substrate

    DE3905342A1