HOUSING WITH LATERAL SEMICONDUCTOR FLIP CHIP AND BOND WIRES CROSSING AND BRIDGING A ROUTING STRUCTURE

DE102025102421A1Undetermined Publication Date: 2026-07-23INFINEON TECH AUSTRIA AG
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Patent Information

Application Number
DE102025102421
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-01-23
Publication Date
2026-07-23

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Abstract

Housing (100) comprising a carrier (102) with a main surface (104) on and / or in which an electrically conductive routing structure (106) is formed, a first electronic component (108) which is a lateral semiconductor chip and is mounted in a flip-chip configuration on the carrier (102) to be electrically coupled to the routing structure (106), and electrically conductive bond wires (112) which electrically connect the carrier (102) and / or the first electronic component (108), wherein the bond wires (112) in a top view of the carrier (102) cross the routing structure (106) in at least one intersection region (114) and extend above or below the routing structure (106) to bridge the routing structure (106) in the at least one intersection region (114).
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Citation Information

Patent Citations

  • Circuit support structure with integrated isolation circuitry

    US20230344467A1