Filling plant and method for operating a filling plant

Abstract

Filling system 1 for filling bores formed in a printed circuit board 6 with a filling material, comprising: a vacuum chamber 2, a plate holding device 3 with a plate holder 3a, a process unit 31 arranged in the vacuum chamber 2 and movable in the vacuum chamber 2 parallel to the printed circuit board held vertically by the plate holder 3a, and comprising: a filling device 7 configured to fill the bores in the printed circuit board 6 on both sides with the filling material during the vertical movement of the process unit 31 along the printed circuit board 6, a doctor blade device 4, 8 arranged vertically downstream of the filling device 7 and configured to doctor blade the printed circuit board 6 on both sides during the vertical movement of the process unit 31 along the printed circuit board 6, and a scanning device 5 arranged vertically downstream of the doctor blade device 4, 8 and configured toIn order to scan both sides of the printed circuit board 6 during the vertical movement of the process unit 31 along it in order to detect the fill levels of the filling bores, a process unit movement device 16 is provided, which is configured to move the process unit 31, and thus together the filling device 13, the doctor blade device 4, 8 and the scanning device 5, vertically along the printed circuit board 6 held vertically by the plate holder 3a, and a control device 17, which is communicatively connected to the process unit 31 and the process unit movement device 16 and which is configured to control the process unit movement device 16 and the filling device 7 depending on the fill levels of the bores detected by the scanning device 5.

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