Semiconductor device, method for manufacturing a semiconductor device, semiconductor testing device and semiconductor device testing device
DE102025154604A1Undetermined Publication Date: 2026-07-23MITSUBISHI ELECTRIC CORP
Patent Information
- Application Number
- DE102025154604
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-22
- Filing Date
- 2025-12-19
- Publication Date
- 2026-07-23
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Abstract
A semiconductor device according to the present disclosure has a structure in which terminals of different shapes coexist in a housing, or a structure in which the distances between terminals exposed to the outside of the housing are not uniform in a part of the housing, wherein the semiconductor device comprises: a semiconductor element; a resin part provided to cover the semiconductor element; a plurality of terminals, each having one end electrically connected to the semiconductor element and another end having an exposed portion through a surface of the resin part; and an identification part provided on the surface of the resin part having a function by which the position of the exposed portion of each of the plurality of terminals can be identified.
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Citation Information
Patent Citations
Semiconductor package and package mount body
JP2003197848A
JP002003197848A
