Semiconductor device, method for manufacturing a semiconductor device, semiconductor testing device and semiconductor device testing device

DE102025154604A1Undetermined Publication Date: 2026-07-23MITSUBISHI ELECTRIC CORP
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Patent Information

Application Number
DE102025154604
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-22
Filing Date
2025-12-19
Publication Date
2026-07-23

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Abstract

A semiconductor device according to the present disclosure has a structure in which terminals of different shapes coexist in a housing, or a structure in which the distances between terminals exposed to the outside of the housing are not uniform in a part of the housing, wherein the semiconductor device comprises: a semiconductor element; a resin part provided to cover the semiconductor element; a plurality of terminals, each having one end electrically connected to the semiconductor element and another end having an exposed portion through a surface of the resin part; and an identification part provided on the surface of the resin part having a function by which the position of the exposed portion of each of the plurality of terminals can be identified.
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Citation Information

Patent Citations

  • Semiconductor package and package mount body

    JP2003197848A

  • JP002003197848A