Sample testing procedure for a single die, device, apparatus and medium

Abstract

The present application discloses a sample testing method for a single die, a device, an apparatus, and a medium relating to the technical field of wafer testing. The method comprises the following: obtaining the current first parameter transfer file when the first capacity to be tested of the first single die to be tested in the wafer to be tested is greater than the preset capacity threshold; wherein the first parameter transfer file comprises a first algorithm selection information and a preset difference; determining a second algorithm selection information and an updated second parameter transfer file by updating the first algorithm selection information according to a first capacity difference and the preset difference between the first capacity to be tested and the preset capacity threshold;Determine and start a target sample inspection algorithm from several different candidate sample inspection algorithms according to the second algorithm selection information; perform a sample inspection on the first die in different areas according to the second parameter passing file and the target sample inspection algorithm to complete the inspection for the single die. The efficiency of the inspection for the single die can be improved.

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