Semiconductor module

The introduction of a sealing gel expansion suppression plate in semiconductor modules mitigates the effects of gel expansion, ensuring reliability by preventing excessive stress and separation, thus improving performance at elevated temperatures.

DE112015006064B4Active Publication Date: 2026-07-09MITSUBISHI ELECTRIC CORP
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Patent Information

Application Number
DE112015006064
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Filing Date
2015-01-27
Publication Date
2026-07-09
Estimated Expiration
2035-01-27

AI Technical Summary

Technical Problem

Semiconductor modules for electrical power applications experience damage and degradation due to moisture absorption and temperature-induced expansion of the sealing gel, leading to broken wires and separation from the insulating substrate.

Method used

Incorporation of a sealing gel expansion suppression plate positioned inclined towards the upper surface of the sealing gel to prevent excessive pressure and separation, with additional configurations such as grid-shaped frames, inverted V-shapes, and buffer materials to manage expansion.

Benefits of technology

The solution effectively reduces stress on sealed objects, preventing damage and separation, thereby enhancing the reliability of semiconductor modules at high temperatures.

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Abstract

Semiconductor module (600, 700) comprising: a semiconductor element (6a, 6b) connected to a metal pattern (5) on an insulating substrate (3) contained in a housing (1); a sealing gel (2) sealing the insulating substrate (3) and the semiconductor element (6a, 6b) within the housing (1); and a sealing gel expansion suppression plate (8) arranged to contact an upper surface of the sealing gel, the upper surface of the sealing gel (2) having a plurality of holes (2c), and the housing (1) having a cover (1a) closing an opening of the housing (1) and a space between the cover (1a) and the upper surface of the sealing gel (2).
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Citation Information

Patent Citations

  • Semiconductor device and method of manufacturing the same

    JP2000311970A

  • Semiconductor device

    US20030089974A1

  • Power semiconductor module

    US5744860A

  • Package for semiconductor power device and method for assembling the same

    US6201696B1