OPTOELECTRONIC COMPONENT WITH A CONDUCTOR FRAME SECTION AND METHOD

Abstract

Optoelectronic component with at least one conductor frame section (1, 2), wherein an optoelectronic component (22) is arranged on a top surface of the conductor frame section (1, 2), wherein a mold material (20) is applied to at least a first surface of the top surface of the conductor frame section (1, 2) and is bonded to the conductor frame section (1, 2) via the first surface, wherein the conductor frame section consists of a predetermined material, wherein a portion of the first surface of the conductor frame section (1, 2) is provided with a coating (9), wherein an area (10, 11, 12, 13, 14, 15, 18, 19, 26, 29) of the first surface is free of the coating (9), wherein in the free area (10, 11, 12, 13, 14, 15, 18, 19, 26, 29) the mold material (20) is bonded to the material of the conductor frame section (1, 2) is connected, wherein the free area (10, 11, 12, 13, 14, 15, 18, 19, 26, 29) divides the coating (9) into a central area (16,17) and subdivided into an outer edge region (51), wherein the component (22) is arranged in the central region (16, 17).

Description

The invention relates to an optoelectronic component with a conductor frame section and a method for manufacturing the component. This patent application claims priority over German patent application DE 10 2016 103 354 A1 . It is known from the prior art to embed conductor frames on which an LED is arranged in a housing material. US 2013 / 0181236 A1 describes a light-emitting component with two conductor frame sections, wherein the two conductor frame sections are embedded with their side surfaces in a mold body. The conductor frame sections are coated, although the coating may be omitted in the area of ​​the mold body. The light-emitting component is positioned above the top surfaces of the conductor frame sections and connected to the coating of the top surfaces of the conductor frame sections by conductive bonding material. Furthermore, the light-emitting component is embedded in a sealing resin, whereby the top surfaces of the conductor frame sections and the top surface of the mold body are also covered with the sealing resin. The object of the invention is to provide an optoelectronic component with a conductor frame section in which the conductor frame section is reliably connected to the mold material using simple means. Furthermore, the object is to provide a simple method for manufacturing the component. The problem of the invention is solved by the independent patent claims. Further forms of training are specified in the dependent requirements. One advantage of the described component is that good adhesion of the mold material to the conductor frame section can be achieved using simple manufacturing processes. This is accomplished by leaving a portion of the surface where the mold material rests on the conductor frame section free of the conductor frame section's coating. An optoelectronic component with at least one conductor frame section is proposed, wherein an optoelectronic component is arranged on a top surface of the conductor frame section, wherein at least a first surface of the top surface of the conductor frame section has a mold material applied and is bonded to the conductor frame section via the first surface, wherein the conductor frame section consists of a material, and wherein a part of the first surface of the conductor frame section is provided with a coating, wherein at least a first area of ​​the first surface is free of the coating. In the embodiment of the component according to the invention, the free area divides the coating into a central region and an outer edge region, with the component being arranged in the central region. This embodiment offers the advantage that the free area can be easily incorporated into the coating, particularly subsequently. A narrow free area, especially a strip-shaped one, may suffice for improved adhesion of the mold material. In one embodiment, the first surface is formed in an annular shape on the upper side of the conductor frame section, with the mold material also being annular and defining a recess. The component is arranged in the recess, with the coating being located on the upper side of the conductor frame section. The free area surrounds the component in an annular shape and is located beneath the mold material. This free area separates the central region of the coating from an outer edge region of the coating. In one embodiment, the first surface is formed in a semi-annular shape on the upper surface of the conductor frame section and abuts a side edge of the conductor frame section at its ends. The mold material is formed in a semi-annular shape on the conductor frame section and defines part of a recess. The coating is applied to the upper surface of the conductor frame section. The component is positioned within the recess on a central region of the coating. The free area surrounds the component in a semi-annular shape and is located beneath the mold material. This free area separates the central region of the coating from a semi-annular outer edge region of the coating. In one embodiment, a second conductor frame section is provided, the second conductor frame section being arranged at a distance from the first conductor frame section. The conductor frame sections are arranged with their first side edges facing each other, and the two conductor frame sections are connected to each other via mold material. The first surface is semi-annular on the top surface of the first conductor frame section, with ends of the first surface adjoining the first side edge of the conductor frame section. The coating is arranged on the top surface of the first conductor frame section, with the free area of ​​the coating separating a first central region from an outer edge region of the coating and being arranged in the first surface. The mold material is semi-annular on the first surface of the first conductor frame section. The second conductor frame section has a coating on its top surface.The molding material is ring-shaped and encloses a recess. The recess extends over partial surfaces of the tops of the first and second conductor frame sections. The molding material is arranged in a semi-ring shape on the top of the second conductor frame section. The coating of the second conductor frame section has a free area, which separates a second central area of ​​the coating from an outer edge area. The free area is located beneath the molding material and extends in a ring shape from a first lateral edge of the second conductor frame section around the second central area and back to the first lateral edge. This ensures good adhesion of the molding material even when two conductor frame sections are joined together. In one embodiment, the free areas of the coating on the first and / or second conductor frame section are partially ring-shaped and / or U-shaped and / or in the form of an angular U-shape. These geometries of the free areas can be manufactured simply and precisely. In one embodiment, the conductor frame section has a coating on one side edge, with a free area formed in the coating of the side edge, where the mold material covers the side edge. This allows for improved adhesion of the mold material to a side edge of the conductor frame section. In one embodiment, the conductor frame section has a coating on a first side edge, wherein a free area is formed in the coating of the first side edge, the free area of ​​the first side edge extending over at least the width of the recess. This achieves improved adhesion and / or sealing between the side edge of the conductor frame section and the mold material, particularly in the area of ​​the recess. In one embodiment, the component is designed as a light-emitting diode. A reliable mechanical connection between the conductor frame section and the mold material is particularly advantageous for light-emitting diodes. In one version, the material of the conductor frame section is a metal, in particular copper. In one version, the coating incorporates a metal. The desired optical and chemical properties can be achieved simply and cost-effectively using this metal. The coating can contain nickel and / or silver and / or gold and / or palladium. In one embodiment, the conductor frame section is at least partially embedded in the mold material. This provides improved protection for the conductor frame section. The mold material can also form part of a housing, thus enabling a simpler design. Even very narrow free areas can improve adhesion and / or sealing between the mold material and the conductor frame section. For example, the width of the free areas can be less than 0.8 mm, particularly less than 0.5 mm. Depending on the chosen design, the width of the free areas can be less than 0.2 mm. Specifically, the width of the free areas can be less than 100 µm, particularly less than 50 µm, and, for example, in the range of 10 µm. Free areas with a width of less than 100 µm, and especially those with a width of 10 µm, already improve adhesion and sealing. These small free areas, in particular, can be quickly and precisely integrated into the coating, for example, using a laser beam. This allows free areas to be incorporated even in small conductor frame sections. A method for manufacturing an optoelectronic component with at least one conductor frame section is proposed, wherein an optoelectronic component is arranged on the conductor frame section, the conductor frame section being made of a material, wherein a portion of the surface of the conductor frame section is provided with a coating, wherein at least a first region of a first surface remains free of the coating, and wherein molding material is applied to at least the first surface of the first conductor frame section and forms an adhesive bond with the first conductor frame section. In the embodiment of the method according to the invention, the free region divides the coating into a central region and an outer edge region, wherein the component is arranged in the central region. In one method, the coating is first applied to the first surface, and then the coating is removed from that first area. This allows for the creation of a precise shape for the first area. In one embodiment, a cover is used to conceal the first area of ​​the first surface during the application of the coating, and the coating is applied to the first surface outside of the first area. This allows for the creation of the uncoated area using simple means. The invention is explained in more detail below with reference to the figures. Figure 1 shows a schematic representation of two conductor frame sections, Figure 2 shows the two conductor frame sections in a top view with a coating and uncoated areas, Figure 3 shows the conductor frame sections embedded in a molding material, Figure 4 shows a finished component in a transparent view, Figure 5 shows the component of Figure 4 in a perspective view, Figure 6 shows another component with a conductor frame section, Figure 7 shows a side view of the first and second conductor frame sections, Figure 8 shows another finished component, Figure 9 shows two conductor frame sections with free areas in the form of dot areas, and Figure 10 shows two further conductor frame sections with free areas in the form of dot areas. Fig. 1 shows a schematic perspective view of a first conductor frame section 1 and a second conductor frame section 2. The conductor frame sections are manufactured, for example, from a metal, in particular copper, by stamping and / or etching. The conductor frame sections 1 and 2 have strip-like edge elements, so-called tie bars 3, 4, 5, 6, 7, and 8, on their side surfaces. For improved chemical and optical properties, at least the upper surface of the conductor frame sections 1 and 2 is provided with a coating 9, as shown schematically in Fig. 2. The coating 9 can, for example, increase the reflection of electromagnetic radiation. In addition, the coating can facilitate electrical contact and / or protect the material of the conductor frame section. Fig. 2 shows the conductor frame sections 1, 2 from above, with the upper surfaces of the conductor frame sections 1, 2 provided with the coating 9. For example, a nickel-silver alloy can be used for the coating. The coating can contain or consist of nickel and / or silver and / or palladium and / or gold. The coating 9 may also include or consist of other metals or alloys. Furthermore, the conductor frame sections 1, 2 have free areas 10, 11, 12, 13, 14, 15 that are free of the coating 9. In the illustrated embodiment, the free areas 10, 11, 12, 13, 14, 15 are formed as straight strips that separate a central area 16, 17 of the coating 9 of the conductor frame section 1, 2 from the edge areas 51 of the coating 9, in particular from edge areas with the edge elements 3, 4, 5, 6, 7, 8. Instead of the straight strip shape, the free areas can also have a line shape, dots, or other surface shapes. Furthermore, for example, only one or several of the strip-shaped free areas can be provided on the top surface of the first conductor frame section 1. The third free area 12 extends from a first side edge 31 of the first conductor frame section 1 to an opposite second side edge 32 of the first conductor frame section 1. The first free area 10 is arranged opposite the third free area 12 and extends from the first side edge 31 of the first conductor frame section 1 to the opposite second side edge 32 of the first conductor frame section 1. The second free area 11 is also designed as a narrow strip and is arranged perpendicular to the third free area 12 and the first free area 10, and thus parallel to the second side edge 32. The strip-shaped third free area 12 is arranged parallel to the third side edge 33 of the first conductor frame section 1.The strip-shaped first free area 10 is arranged parallel to the fourth side edge 34 of the first ladder frame section 1. The strip-shaped first, second, and third free areas 10, 11, 12 have a lateral distance 35 to the adjacent side edges 32, 33, 34, to which they are aligned parallel. This lateral distance is less than 1 / 4 or less than 1 / 5 of the width of the first conductor frame section 1 perpendicular to the longitudinal extent of the respective strip-shaped free area 10, 11, 12. The lateral distance 35 can be less than 0.5 mm, in particular less than 150 µm. The strip-shaped free areas can have a width perpendicular to their longitudinal extent that is in the range of 1 mm or less. For example, the width of the free areas perpendicular to a longitudinal dimension can be less than 0.8 mm, particularly less than 0.5 mm. Depending on the chosen design, the width of the free areas can be less than 0.2 mm. In particular, the width of the free areas can be less than 100 µm, particularly less than 50 µm, and for example in the range of 10 µm. Tests have shown that even free areas with a width in the range of 10 µm improve adhesion and sealing. In particular, the small-width free areas can be introduced into the coating quickly and precisely, for example, using a laser beam. In this way, the outer edge regions 51 of the coating 9 of the first conductor frame section 1 adjacent to the second side edge 32, the third side edge 33 and the fourth side edge 34 are separated from the first central region 16 of the coating 9 by the U-shaped structure of the first, second and third free regions 10, 11, 12. The edge elements 3, 4, 8 are also separated from the first central region 16 of the coating 9 by the strip-shaped first, second and third free regions 10, 11, 12. The first and third strip-shaped free areas 10, 12, each extending from the first side edge 31, can also terminate at a distance before the second side edge 32. However, it is advantageous if the second free area 11, arranged along the second side edge 32, opens at one end into the first free area 10 and at the other end into the third free area 12. This provides a ring-shaped, circumferential structure around the first central area 16 with contiguous free areas 10, 11, 12 in the coating 9. The ring-shaped circumferential structure can also have an angular U-shape or other shapes. Furthermore, for example, only one of the strip-shaped free areas or several of the free areas 13, 14, 15 can be provided in the coating 9 on the upper side of the second conductor frame section 2. A fourth free area 13 extends from a first side edge 41 of the second conductor frame section 2 to an opposite second side edge 42. A sixth free area 15 is arranged opposite the fourth free area 13 and also extends from the first side edge 41 to the opposite second side edge 42 of the second conductor frame section 1. A fifth free area 14 is also formed as a narrow strip and is arranged perpendicular to the fourth free area 13 and the sixth free area 15, and thus parallel to the second side edge 42. The strip-shaped fourth free area 13 is arranged parallel to a third side edge 43 of the second conductor frame section 2.The strip-shaped sixth free area 15 is arranged parallel to a fourth side edge 44 of the second conductor frame section 2. The strip-shaped fourth, fifth, and sixth free areas 13, 14, 15 have a lateral distance 35 from the adjacent side edges 42, 43, 44, to which they are aligned parallel, which is less than 1 / 4 or less than 1 / 5 of the width of the second conductor frame section 2 perpendicular to the longitudinal extent of the respective strip-shaped free area 13, 14, 15. The lateral distance 35 can be less than 0.5 mm, in particular less than 150 µm. The strip-shaped fourth, fifth, and / or sixth free areas 13, 14, 15 can have a width perpendicular to their longitudinal extent that is in the range of 1 mm or less. For example, the width of the free areas can be less than 0.8 mm, particularly less than 0.5 mm. Depending on the chosen design, the width of the free areas can be less than 0.2 mm. Specifically, the width of the free areas can be less than 100 µm, particularly less than 50 µm, and for example, in the range of 10 µm. Tests have shown that even free areas with a width in the range of 10 µm improve adhesion and sealing. In particular, the small-width free areas can be quickly and precisely incorporated into the coating, for example, using a laser beam. In this way, outer edge regions 51 of the coating 9 of the second conductor frame section 2, with the second side edge 42, the third side edge 43, and the fourth side edge 44, are separated from a second central region 17 of the coating 9 by the continuous U-shaped structure of the fourth, fifth, and sixth free regions 13, 14, 15. The edge elements 5, 6, 7 are also separated from the second central region 17 of the coating 9 by the strip-shaped free regions 13, 14, 15. The strip-shaped fourth and sixth free areas 13, 15 can each extend to the first side edge 41 or terminate at a distance from the second side edge 42. However, it is advantageous if the fifth free area 14, which is arranged along the second side edge 42, opens at one end into the fourth free area 13 and at the other end into the sixth free area 15. This provides a ring-shaped, continuous structure around the second central area 17 with contiguous free areas 13, 14, 15 in the coating 9. Fig. 3 shows an embodiment in which a seventh and an eighth free area 18, 19 are formed in the form of two U-shaped lines in the coating 9 of the conductor frame sections 1, 2. In this embodiment as well, outer edge areas 51 of the coating 9 adjacent to the second, third, and fourth side edges 32, 33, 34 of the first conductor frame section 1 are separated from the first central area 16, and outer edge areas 51 of the coating 9 adjacent to the second, third, and fourth side edges 42, 43, 44 of the second conductor frame section 2 are separated from the second central area 17 by the free areas 18, 19. Thus, the corresponding edge elements 3, 4, 5, 6, 7, 8 are also separated from the central areas 16, 17 by the seventh and eighth free areas 18, 19. In this version as well, the free areas 18, 19 can be formed in the form of points arranged along the u-shaped line shape. The seventh free area 18 of the coating 9 of the first conductor frame section 1 has a U-shape, with both ends of the U-shape terminating at the first side edge 31 of the first conductor frame section 1. The eighth free area 19 of the coating 9 of the second conductor frame section 2 has a U-shape, with both ends of the U-shape terminating at the first side edge 41 of the second conductor frame section 2. Instead of the U-shape, the seventh and eighth areas 18, 19 could also have a square U-shape, a partial circle shape, or any other circumferential shape that separates the central area 16, 17 of the coating 9 from an outer edge area 51 of the coating 9. The ends of the seventh and eighth free areas 18, 19 should each extend to the first side edge 31, 41 of the respective conductor frame section 1, 2. The free areas 10 to 15, 18, 19 of Figures 2 and 3 can be produced, for example, by covering the surfaces of the free areas 10 to 15, 18, 19 with a protective layer, such as photoresist, or by mechanical masking during the deposition of the coating 9. The coating 9 can be deposited, for example, using an electroplating process. Furthermore, depending on the chosen embodiment, the entire surfaces of the first and second conductor frame sections 1, 2 can be provided with the coating 9, and then the free areas 10 to 15 and 18, 19 can be produced in the desired shape by appropriately removing the coating 9.For example, the free areas 10 to 15, 18, 19 can be produced using a laser ablation process, wherein the coating 9 in the surface areas of the intended free areas 10 to 15, 18, 19 is removed from the surface of the conductor frame sections 1, 2 by laser ablation. Subsequently, a molding material 20 is applied to the ladder frame sections 1, 2, as schematically illustrated in Fig. 4 for the design of the ladder frame sections 1, 2 of Fig. 2. The ladder frame sections 1, 2 are covered with molding material 20 at least on one upper surface in edge regions that extend outwards from the central regions 16, 17 beyond the first, second, third, fourth, fifth, and sixth free areas 10 to 15 to the side edges of the ladder frame sections. The first, second, third, fourth, fifth, and sixth free areas 10, 11, 12, 13, 14, 15 are shown as dashed lines. Furthermore, the two ladder frame sections 1, 2 are connected to each other at a predetermined distance by the molding material 20. A flat surface 50 made of mold material 20 is formed between the first side edge 31 of the first ladder frame section 1 and the first side edge 41 of the second ladder frame section 2.Thus, a semi-ring-shaped edge region of each conductor frame section 1, 2 is covered with mold material 20. The central regions 16, 17 of the conductor frame sections 1, 2 are at least partially free of the mold material 20. The free regions 10 to 15 of the coating 9 are covered by the mold material 20. The mold material 20 has a recess 21, which is enclosed by the mold material 20 in a ring-shaped frame. The recess 21 extends from a top surface of the mold material 20 to the top surface of the conductor frame sections 1, 2 into the central regions 16, 17. The recess 21 is bounded by the ring-shaped mold material 20, by exposed partial areas of the surfaces of the conductor frame sections 1, 2, and in the intermediate region between the first side edges 31, 41 of the two conductor frame sections 1, 2 by the flat surface 50 of the mold material 20.The flat surface 50 of the mold material is positioned at the same height as the top surfaces of the ladder frame sections 1, 2. In the area of ​​the free sections 10 to 15, a direct connection is established between the material of the ladder frame sections and the mold material. This improves the mechanical, adhesive bond. Furthermore, improved sealing between the ladder frame sections and the mold material is achieved. Depending on the chosen embodiment, the recess 21 can be produced when the conductor frame sections 1, 2 are embedded in the mold material 20. Alternatively, the recess 21 can also be produced subsequently by removing mold material 20. An optoelectronic component 22 is then mounted onto the first central area 16 of the first conductor frame section 1. Furthermore, an electrically conductive connection is established between the component 22 and the second conductor frame section 2, for example, using a bond wire 23. The recess 21 is then filled with a potting compound 25. This stage of the process is also shown in Fig. 4, where the molding compound 20 is depicted as transparent. This achieves a seal for the component 22. Due to the improved seal between the molding compound 20 and the free areas 10, 11, 12, 13, 14, 15 of the coating 9, outflow of the liquid molding compound between the conductor frame section 1, 2 and the molding compound 20 is prevented. The open areas 10 to 15 allow direct contact between the material of the conductor frame sections 1 and 2 and the mold material 20. This enables a strong bond between the mold material 20 and the open areas 10 to 15, resulting in good adhesion with high bond strength and / or good surface adhesion. In particular, good adhesion is achieved between the copper surface of the conductor frame section and the mold material. This also improves the mechanical stability of the connection between the mold material and the conductor frame sections. Furthermore, a moisture-proof bond can be achieved between the mold material and the conductor frame section. This makes it difficult, and in particular prevents, the ingress of moisture into the optoelectronic component. It also prevents the ingress or flow of other liquids such as fluxes, tin residues, cleaning fluids, etc.made more difficult or avoided. As can be seen in Fig. 4, the edge elements 3, 4, 5, 6, 7, 8 of the conductor frame sections 1, 2 abut the outer side surfaces of the mold material 20. This creates a risk of moisture penetrating to the component 22 via the exposed edge elements 3 to 8. However, due to the free areas arranged around the central region 16, 17 of the coating 9 on the first and second conductor frame sections 1, 2, respectively, a very tight seal is achieved between the mold material and the conductor frame section. Thus, moisture cannot migrate across this barrier. Depending on the chosen design, the edge elements 3, 4, 5, 6, 7, 8 of the conductor frame sections 1, 2 can be omitted, and the conductor frame sections 1, 2 are also laterally embedded in the mold material 20. Using lasers or photoresist technology, after the coating 9 has been applied to the surface of the conductor frame sections 1, 2 and before the mold material 20 has been applied to the coating 9, very small free areas 10 to 15 with precise surfaces in the coating 9 can be produced on the upper surfaces of the conductor frame sections 1, 2. This method can therefore also be used for very small components to coat a large area of ​​the surface of the conductor frame sections 1, 2 with the coating 9 and to provide only small free areas where the material of the conductor frame sections 1, 2 is exposed and the coating 9 has been removed. The direct contact between the material of the conductor frame sections and the mold material ensures a good seal for the component 22. This improves the long-term stability of the component's seal. In the embodiment shown in Fig. 4, side edges 31, 32, 33, 34, 41, 42, 43, 44 of the ladder frame sections 1, 2 are at least partially covered with molding material. The first side edge 31 of the first ladder frame section 1 and the first side edge 41 of the second ladder frame section 2 are completely covered with the molding material 20. Furthermore, the first side edge 31 of the first ladder frame section 1 and the first side edge 41 of the second ladder frame section 2 abut the flat surface 50 and the recess 21 filled with potting compound 25. Depending on the selected design, side edges 31, 32, 33, 34 of the first conductor frame section 1 and / or side edges 41, 42, 43, 44 of the second conductor frame section 2 may also be provided with the coating 9. Furthermore, a free area may be provided on a side edge 31, 32, 33, 34, 41, 42, 43, 44 of the first and second conductor frame sections 1, 2, in which no coating 9 is applied to the material of the conductor frame section 1, 2, or in which a free area has been incorporated into the coating 9 after its application. In particular, the first side edge 41 of the second conductor frame section 2 can be provided with the coating 9. The coating 9 includes a ninth free area 26 on the first side edge 41. The ninth free area 26 is, for example, formed as a straight strip and extends transversely over the entire length of the first side edge 41. In the example shown, the ninth free area 26 borders the third side edge 43 and the fourth side edge 44. Depending on the chosen design, the ninth free area 26 can also terminate at a predetermined distance from the third and fourth side edges 43 and 44. Advantageously, the ninth free area 26 extends at least over the entire width of the recess 21. A coating 9 is also provided on the opposite first side edge 31 of the first conductor frame section 1. Furthermore, a tenth free area 29 is incorporated into the coating 9 of the first side edge 31 of the first conductor frame section 1. The tenth free area 29 is formed as a straight strip and extends transversely over the entire length of the first side edge 31. The free area 29 borders the third side edge 33 and the fourth side edge 34. Depending on the chosen design, the tenth free area 29 can also terminate at a predetermined distance from the third and fourth side edges 33, 34. Advantageously, the tenth free area 29 extends at least over the entire width of the recess 21. Fig. 5 shows the arrangement of Fig. 4, wherein the potting material 25 and the molding material 20 form a housing 24. Depending on the chosen embodiment, the optoelectronic component can also have only one conductor frame section 1 on which the optoelectronic component 22 is arranged, as shown schematically in Fig. 6. In this embodiment, the first central region 16 of the first conductor frame section 1 can be surrounded by a ring-shaped bead of mold material 20. In this embodiment as well, the top surface of the first conductor frame section is provided with a coating 9. The mold material 20 is arranged on an annular first surface on the coating 9. A seventh free region 18, in which no coating 9 is arranged on the top surface of the first conductor frame section 1, is formed in the form of a closed annular surface, which is also located in the first surface. The seventh free region 18 is covered with mold material 20. In the seventh free region 18, the material of the first conductor frame section 1 borders directly on the mold material 20.An interior formed by the annular mold material 20, representing a recess 21, is filled with potting compound 25. The optoelectronic component 22 is annularly surrounded by the mold material 20 and arranged in the recess 21 on the first conductor frame section 1. Thus, the component 22 and the central region 16 are covered with the potting compound 25. In this embodiment, the seventh free region 18 can also have other surface shapes that annularly surround the central region 16 of the coating 9. For example, the seventh free region 18 can consist of three or four strip-shaped areas, particularly straight strip-shaped areas, adjoining each other, surrounding the central region 16 and beneath the mold material 20.In addition, the seventh free area 18 can also be formed in the form of a series of point surfaces that surround the central area 16 as a ring-shaped line and separate it from an outer edge area 51 of the coating 9. Fig. 7 schematically shows an arrangement of the first and second ladder frame sections 1, 2, which are designed according to Figs. 2 and 4. The ladder frame sections 1, 2 are shown one above the other, with a view of the first side edge 31, 41 of each ladder frame section 1, 2. In this embodiment, the ladder frame sections 1, 2 are provided with the coating 9 on their upper surface, as shown in Figs. 2 and 4. The first side edge 31, 41 of the ladder frame sections 1, 2 is also provided with the coating 9. A ninth and a tenth free area 29, 26, respectively, is incorporated into the coating 9 of the first side edges 31, 41 of the ladder frame sections 1, 2. The ninth free area 26 of the first side edge 41 of the second ladder frame section 2 is formed as a straight strip and extends transversely over the entire length of the first side edge 41. The ninth free area 26 borders the third side edge 43 and the fourth side edge 44. The tenth free area 29 of the first side edge 31 of the first ladder frame section 1 is formed as a straight strip and extends transversely over the entire length of the first side edge 31. The tenth free area 29 borders the third side edge 33 and the fourth side edge 34. Depending on the chosen embodiment, the ninth and tenth free areas 29, 26 of the first side edges 31, 41 of the first and second conductor frame sections 1, 2 can also be shorter and not extend to the side edges. Providing the ninth and tenth free areas 26, 29 increases the adhesion between the mold material 20 and the first side surfaces 31, 41 of the conductor frame sections 1, 2, even though a coating 9 is provided on the first side surfaces 31, 41. Depending on the chosen design, the other side edges 32, 33, 34, 42, 43, 44 of the conductor frame sections 1, 2 can also be provided with a coating 9, wherein the coating 9 may have free areas on the side edges 32, 33, 34, 42, 43, 44 of the conductor frame sections 1, 2. Fig. 8 shows another completed component, which is essentially designed according to the component of Fig. 4, except that the coating 9 of the first conductor frame section 1 has a seventh free area 18 and the coating 9 of the second conductor frame section 2 has an eighth free area 19 according to Fig. 3. The seventh and eighth free areas 18, 19 are shown as dashed lines. Fig. 9 shows a schematic representation of an embodiment of ladder frame sections 1, 2, which are essentially designed according to Fig. 2, except that in this embodiment the first, second, third, fourth, fifth, and sixth free areas 10, 11, 12 are formed in the form of dot surfaces 52 arranged in rows. The distances between the dot surfaces 52 can be constant and, for example, less than the diameter of the dot surfaces 52. The distances between the dot surfaces can also vary. The dot surfaces 52 can have a circular shape, a rectangular shape, a square shape, or other shapes. The dot surfaces 52 can be of the same size or of different sizes. The diameter of a dot surface 52 can, for example, be less than 1 mm. Fig. 10 shows a schematic representation of an embodiment of ladder frame sections 1, 2, which are essentially designed according to Fig. 3, except that in this embodiment the first, second, third, fourth, fifth, and sixth free areas 10, 11, 12 are formed in the form of dot surfaces 52 arranged in rows. The distances between the dot surfaces 52 can be constant and, for example, less than the diameter of the dot surfaces 52. The distances between the dot surfaces can also vary. The dot surfaces 52 can have a circular shape, a rectangular shape, a square shape, or other shapes. The dot surfaces 52 can be of the same size or of different sizes. The diameter of a dot surface 52 can, for example, be less than 1 mm. Components according to Fig. 4 and Fig. 7 can be manufactured using the ladder frame sections 1,2 of Fig. 9 and Fig. 10. Even small free dot areas 52 can improve adhesion and / or sealing between the mold material and the conductor frame section. For example, the width or diameter of the dot areas can be less than 0.8 mm, particularly less than 0.5 mm. Depending on the chosen design, the width or diameter of the dot areas 52 can be less than 0.2 mm. In particular, the width or diameter of the dot areas 52 can be less than 100 µm, particularly less than 50 µm, and for example, in the range of 10 µm. Free dot areas 52 with a width or diameter in the range of less than 100 µm, and in particular with a width or diameter around 10 µm, can improve adhesion and sealing. In particular, the free dot areas 52 with the small widths or diameters...Diameters can be quickly and precisely incorporated into the coating, for example using a laser beam. This allows for the inclusion of a free area even in small, flat conductor frame sections. REFERENCE MARK LIST 1 First conductor frame section 2 Second conductor frame section 3 to 8 Edge elements 9 Coating 10 First free area 11 Second free area 12 Third free area 13 Fourth free area 14 Fifth free area 15 Sixth free area 16 First center area 17 Second center area 18 Seventh free area 19 Eighth free area 20 Mold material 21 Recess 22 Component 23 Bond wire 24 Housing 25 Potting compound 26 Ninth free area 29 Tenth free area 31 First side edge of first conductor frame section 32 Second side edge of first conductor frame section 33 Third side edge of first conductor frame section 34 Fourth side edge of first conductor frame section 35 Lateral clearance 41 First side edge of second conductor frame section 42 Second side edge of second conductor frame section 43 Third side edge of second conductor frame section 44 Fourth side edge of second conductor frame section 50 Flat surface 51 Edge area 52 Point area

Claims

Optoelectronic component with at least one conductor frame section (1, 2), wherein an optoelectronic component (22) is arranged on a top surface of the conductor frame section (1, 2), wherein a mold material (20) is applied to at least a first surface of the top surface of the conductor frame section (1, 2) and is bonded to the conductor frame section (1, 2) via the first surface, wherein the conductor frame section consists of a predetermined material, wherein a portion of the first surface of the conductor frame section (1, 2) is provided with a coating (9), wherein an area (10, 11, 12, 13, 14, 15, 18, 19, 26, 29) of the first surface is free of the coating (9), wherein in the free area (10, 11, 12, 13, 14, 15, 18, 19, 26, 29) the mold material (20) is bonded to the material of the conductor frame section (1, 2) is connected, wherein the free area (10, 11, 12, 13, 14, 15, 18, 19, 26, 29) divides the coating (9) into a central area (16,17) and subdivided into an outer edge region (51), wherein the component (22) is arranged in the central region (16, 17). Component according to claim 1, wherein the first surface is formed in an annular shape on the top side of the conductor frame section (1, 2), wherein the mold material (20) is formed in an annular shape and defines a recess (21), wherein the component (22) is arranged in the recess (21), wherein the coating (9) is arranged on the top side of the conductor frame section (1, 2), wherein the free area (18) surrounds the component in an annular shape and is arranged under the mold material (20), wherein the free area separates the central area (16) of the coating (9) from an annular outer edge area (51) of the coating (9). Component according to claim 1, wherein the first surface is formed in a semi-annular shape on a top surface of the conductor frame section (1) and adjoins a side edge (31) of the conductor frame section (1) at its ends, wherein the mold material (20) is formed in a semi-annular shape on the conductor frame section (1) and delimits a part of a recess (21), wherein the coating (9) is arranged on the top surface of the conductor frame section (1), wherein the component (22) is arranged in the recess (21) on a central region (16) of the coating (9), wherein the free region (10, 11, 12, 18) surrounds the component in a semi-annular shape and is arranged under the mold material (20), wherein the free region (10, 11, 12, 18) separates the central region (16) of the coating from a semi-annular outer edge region (51) of the coating (9). Component according to claim 1, wherein a second conductor frame section (2) is provided, wherein the second conductor frame section (2) is arranged at a distance from the first conductor frame section (1), wherein the two conductor frame sections (1, 2) are arranged with their first side edges (31, 41) facing each other, wherein the two conductor frame sections (1, 2) are connected to each other via mold material (20), wherein the first surface is formed in a semi-annular shape on the top side of the first conductor frame section (1), wherein ends of the first surface adjoin the first side edge (31) of the conductor frame section (1), wherein the mold material (20) is formed in a semi-annular shape on the first surface on the first conductor frame section (1), wherein the coating (9) is arranged on the top side of the first conductor frame section (1), wherein the free area (10, 11, 12,18) of the coating (9) of the first conductor frame section, separating a first central region (16) from an outer edge region (51) of the coating (9), wherein the second conductor frame section (2) has a coating (9) on its upper surface, wherein the coating (9) of the second conductor frame section (2) has a free region, wherein the free region separates a second central region (17) of the coating (9) from an outer edge region of the coating (9), wherein the mold material (20) is arranged in a semi-annular shape on the upper surface of the second conductor frame section (2), wherein the free region is arranged under the mold material (20), wherein the free region is guided in an annular shape from a first side edge (41) of the second conductor frame section (2) around the second central region (17) and back to the first side edge (43), wherein the mold material (20) is formed in an annular shape and defines a recess (21),wherein the recess (21) extends over partial surfaces of the upper surfaces of the first and second ladder frame sections (1,2). Component according to claim 4, wherein the free areas (10, 11, 12, 13, 14, 15, 18, 19) of the coating (9) of the first and / or the second conductor frame section (1, 2) are formed in a semi-ring shape or in a u-shape or in the form of an angular U-shape. Component according to one of the preceding claims, wherein the conductor frame section (1,2) has a coating (9) on a side edge (31, 41), wherein a free area (26, 29) is formed in the coating (9) of the side edge (31, 41), wherein the mold material (20) covers the side edge (31, 41). Component according to claim 4, wherein the conductor frame section (1,2) has a coating (9) on a first side edge (31, 41), wherein a free area (26, 29) is formed in the coating (9) of the first side edge (31, 41). Component according to claim 7, wherein the free area (26, 29) of the first side edge (31, 41) extends over at least one width of the recess (21). Component according to one of the preceding claims, wherein the component (22) comprises a light-emitting diode. Component according to one of the preceding claims, wherein the material of the conductor frame section (1, 2) is a metal. Component according to claim 10, wherein the metal is copper, and wherein there is better adhesion between the copper surface of the free first area and the mold material than between the coating and the mold material. Component according to one of the preceding claims, wherein the coating (9) comprises a metal. Component according to claim 12, wherein the coating (9) comprises nickel and / or silver and / or palladium and / or gold. Component according to one of the preceding claims, wherein the width of the free areas (10, 11, 12, 13, 14, 15, 18, 19, 26, 29) is less than 0.8 mm, in particular less than 0.5 mm, in particular less than 100 µm and for example in the range of 10 µm. A method for manufacturing an optoelectronic component according to one of the preceding claims, comprising at least one conductor frame section, wherein a portion of a surface of the conductor frame section is provided with a coating, wherein a first region of a first area remains free of the coating, the free region dividing the coating into a central region and an outer edge region, wherein at least the first surface of the conductor frame section is coated with mold material, the mold material defining at least a portion of a recess, wherein an optoelectronic component is arranged on the conductor frame section in the region of the portion of the recess, the component being arranged in the central region of the coating. Method according to claim 15, wherein the coating is first applied at least to the first surface of the conductor frame section, and the coating is subsequently removed in the provided free area. Method according to claim 16, wherein the coating is removed using a laser beam. The method of claim 15, wherein the first area of ​​the first surface is covered by means of a covering when applying the coating, and wherein the coating is applied in the first surface outside the first area.

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